Harness sub-assembly rationalization
View Patent ↗This application discloses a system implementing tools and mechanisms to generate a structured bill of materials for a wire harness described in a harness design, identify variable parameter corresponding to a physical characteristic for a first sub-assembly in the structured bill of materials for the wire harness, and substitute the first sub-assembly in the structured bill of materials for the wire harness with a second sub-assembly based, at least in part, on the variable parameter for the first sub-assembly.
1. A method comprising:
generating, by a computing system in response to execution of instructions, a structured bill of materials for a wire harness described in a harness design;
utilizing, by the computing system in response to execution of the instructions, a parameterized signature generated based, at least in part, on a variable parameter corresponding to a physical characteristic for a first sub-assembly in the structured bill of materials for the wire harness to identify a second sub-assembly stored in a library accessible by the computing system; and
substituting, by the computing system in response to execution of the instructions, the first sub-assembly in the structured bill of materials for the wire harness with the second sub-assembly.
2. The method of claim 1 , wherein substituting the first sub-assembly in the structured bill of materials for the wire harness with the second sub-assembly further comprises replacing a part number of the first sub-assembly with a part number of the second sub-assembly in the structured bill of materials for the wire harness.
3. The method of claim 2 , further comprising:
identifying, by the computing system, a group of one or more sub-assemblies having a same structure as the first sub-assembly except for the physical characteristic corresponding to the variable parameter; and
selecting, by the computing system, the second sub-assembly from the group of one or more sub-assemblies.
4. The method of claim 3 , wherein identifying the group of one or more sub-assemblies having a same structure as the first sub-assembly except for the physical characteristic corresponding to the variable parameter further comprises:
generating the parameterized signature, which corresponds to the structure of the first sub-assembly except for the physical characteristic corresponding to the variable parameter; and
comparing the parameterized signature against known parameterized signatures of sub-assemblies to identify the group of one or more sub-assemblies.
5. The method of claim 4 , wherein the group of one or more sub-assemblies includes a master sub-assembly, and wherein the second sub-assembly is the master sub-assembly in the group of one or more sub-assemblies.
6. The method of claim 3 , wherein the selection of the second sub-assembly from the group of one or more sub-assemblies is based on at least one of a cost of or a manufacturing availability of the first sub-assembly and each sub-assembly in the group of one or more sub-assemblies.
7. The method of claim 1 , wherein the structured bill of materials is configured to hierarchically organize multiple sub-assemblies based on manufacturing operations to be utilized to build the wire harness.
8. A system comprising:
a memory system configured to store computer-executable instructions; and
a computing system, in response to execution of the computer-executable instructions, is configured to:
generate a structured bill of materials for a wire harness described in a harness design;
utilize a parameterized signature generated based, at least in part, on a variable parameter corresponding to a physical characteristic for a first sub-assembly in the structured bill of materials for the wire harness to identify a second sub-assembly stored in a library accessible by the computing system; and
substitute the first sub-assembly in the structured bill of materials for the wire harness with the second sub-assembly.
9. The system of claim 8 , wherein the computing system, in response to execution of the computer-executable instructions, is further configured to replace a part number of the first sub-assembly with a part number of the second sub-assembly in the structured bill of materials for the wire harness.
10. The system of claim 9 , wherein the computing system, in response to execution of the computer-executable instructions, is further configured to:
identify a group of one or more sub-assemblies having a same structure as the first sub-assembly except for the physical characteristic corresponding to the variable parameter; and
select the second sub-assembly from the group of one or more sub-assemblies.
11. The system of claim 10 , wherein the computing system, in response to execution of the computer-executable instructions, is further configured to:
generate the parameterized signature, which corresponds to the structure of the first sub-assembly except for the physical characteristic corresponding to the variable parameter; and
compare the parameterized signature against known parameterized signatures of sub-assemblies to identify the group of one or more sub-assemblies.
12. The system of claim 11 , wherein the group of one or more sub-assemblies includes a master sub-assembly, and wherein the second sub-assembly is the master sub-assembly in the group of one or more sub-assemblies.
13. The system of claim 10 , wherein the selection of the second sub-assembly from the group of one or more sub-assemblies is based on at least one of a cost of or a manufacturing availability of the first sub-assembly and each sub-assembly in the group of one or more sub-assemblies.
14. An apparatus comprising at least one non-transitory computer-readable memory device storing instructions configured to cause one or more processing devices to perform operations comprising:
generating a structured bill of materials for a wire harness described in a harness design;
utilizing a parameterized signature generated based, at least in part, on a variable parameter corresponding to a physical characteristic for a first sub-assembly in the structured bill of materials for the wire harness to identify a second sub-assembly stored in a library accessible by the computing system; and
substituting the first sub-assembly in the structured bill of materials for the wire harness with the second sub-assembly.
15. The apparatus of claim 14 , wherein substituting the first sub-assembly in the structured bill of materials for the wire harness with the second sub-assembly further comprises replacing a part number of the first sub-assembly with a part number of the second sub-assembly in the structured bill of materials for the wire harness.
16. The apparatus of claim 15 , further comprising:
identifying, by the computing system, a group of one or more sub-assemblies having a same structure as the first sub-assembly except for the physical characteristic corresponding to the variable parameter; and
selecting, by the computing system, the second sub-assembly from the group of one or more sub-assemblies.
17. The apparatus of claim 16 , wherein identifying the group of one or more sub-assemblies having a same structure as the first sub-assembly except for the physical characteristic corresponding to the variable parameter further comprises:
generating the parameterized signature, which corresponds to the structure of the first sub-assembly except for the physical characteristic corresponding to the variable parameter; and
comparing the parameterized signature against known parameterized signatures of sub-assemblies to identify the group of one or more sub-assemblies.
18. The apparatus of claim 17 , wherein the group of one or more sub-assemblies includes a master sub-assembly, and wherein the second sub-assembly is the master sub-assembly in the group of one or more sub-assemblies.
19. The apparatus of claim 16 , wherein the selection of the second sub-assembly from the group of one or more sub-assemblies is based on at least one of a cost of or a manufacturing availability of the first sub-assembly and each sub-assembly in the group of one or more sub-assemblies.
20. The apparatus of claim 14 , wherein the structured bill of materials is configured to hierarchically organize multiple sub-assemblies based on manufacturing operations to be utilized to build the wire harness.