IP Library Granted Patent US 9,836,043
Granted Patent B2
US 9,836,043 · App. 14/608,611 · Granted Dec 5, 2017

Harness sub-assembly rationalization

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Quick Facts
Patent No.
US 9,836,043
App. No.
14/608,611
Granted
Dec 5, 2017
Kind
B2
Abstract

This application discloses a system implementing tools and mechanisms to generate a structured bill of materials for a wire harness described in a harness design, identify variable parameter corresponding to a physical characteristic for a first sub-assembly in the structured bill of materials for the wire harness, and substitute the first sub-assembly in the structured bill of materials for the wire harness with a second sub-assembly based, at least in part, on the variable parameter for the first sub-assembly.

Claims (43)

1. A method comprising:

generating, by a computing system in response to execution of instructions, a structured bill of materials for a wire harness described in a harness design;

utilizing, by the computing system in response to execution of the instructions, a parameterized signature generated based, at least in part, on a variable parameter corresponding to a physical characteristic for a first sub-assembly in the structured bill of materials for the wire harness to identify a second sub-assembly stored in a library accessible by the computing system; and

substituting, by the computing system in response to execution of the instructions, the first sub-assembly in the structured bill of materials for the wire harness with the second sub-assembly.

2. The method of claim 1 , wherein substituting the first sub-assembly in the structured bill of materials for the wire harness with the second sub-assembly further comprises replacing a part number of the first sub-assembly with a part number of the second sub-assembly in the structured bill of materials for the wire harness.

3. The method of claim 2 , further comprising:

identifying, by the computing system, a group of one or more sub-assemblies having a same structure as the first sub-assembly except for the physical characteristic corresponding to the variable parameter; and

selecting, by the computing system, the second sub-assembly from the group of one or more sub-assemblies.

4. The method of claim 3 , wherein identifying the group of one or more sub-assemblies having a same structure as the first sub-assembly except for the physical characteristic corresponding to the variable parameter further comprises:

generating the parameterized signature, which corresponds to the structure of the first sub-assembly except for the physical characteristic corresponding to the variable parameter; and

comparing the parameterized signature against known parameterized signatures of sub-assemblies to identify the group of one or more sub-assemblies.

5. The method of claim 4 , wherein the group of one or more sub-assemblies includes a master sub-assembly, and wherein the second sub-assembly is the master sub-assembly in the group of one or more sub-assemblies.

6. The method of claim 3 , wherein the selection of the second sub-assembly from the group of one or more sub-assemblies is based on at least one of a cost of or a manufacturing availability of the first sub-assembly and each sub-assembly in the group of one or more sub-assemblies.

7. The method of claim 1 , wherein the structured bill of materials is configured to hierarchically organize multiple sub-assemblies based on manufacturing operations to be utilized to build the wire harness.

8. A system comprising:

a memory system configured to store computer-executable instructions; and

a computing system, in response to execution of the computer-executable instructions, is configured to:

generate a structured bill of materials for a wire harness described in a harness design;

utilize a parameterized signature generated based, at least in part, on a variable parameter corresponding to a physical characteristic for a first sub-assembly in the structured bill of materials for the wire harness to identify a second sub-assembly stored in a library accessible by the computing system; and

substitute the first sub-assembly in the structured bill of materials for the wire harness with the second sub-assembly.

9. The system of claim 8 , wherein the computing system, in response to execution of the computer-executable instructions, is further configured to replace a part number of the first sub-assembly with a part number of the second sub-assembly in the structured bill of materials for the wire harness.

10. The system of claim 9 , wherein the computing system, in response to execution of the computer-executable instructions, is further configured to:

identify a group of one or more sub-assemblies having a same structure as the first sub-assembly except for the physical characteristic corresponding to the variable parameter; and

select the second sub-assembly from the group of one or more sub-assemblies.

11. The system of claim 10 , wherein the computing system, in response to execution of the computer-executable instructions, is further configured to:

generate the parameterized signature, which corresponds to the structure of the first sub-assembly except for the physical characteristic corresponding to the variable parameter; and

compare the parameterized signature against known parameterized signatures of sub-assemblies to identify the group of one or more sub-assemblies.

12. The system of claim 11 , wherein the group of one or more sub-assemblies includes a master sub-assembly, and wherein the second sub-assembly is the master sub-assembly in the group of one or more sub-assemblies.

13. The system of claim 10 , wherein the selection of the second sub-assembly from the group of one or more sub-assemblies is based on at least one of a cost of or a manufacturing availability of the first sub-assembly and each sub-assembly in the group of one or more sub-assemblies.

14. An apparatus comprising at least one non-transitory computer-readable memory device storing instructions configured to cause one or more processing devices to perform operations comprising:

generating a structured bill of materials for a wire harness described in a harness design;

utilizing a parameterized signature generated based, at least in part, on a variable parameter corresponding to a physical characteristic for a first sub-assembly in the structured bill of materials for the wire harness to identify a second sub-assembly stored in a library accessible by the computing system; and

substituting the first sub-assembly in the structured bill of materials for the wire harness with the second sub-assembly.

15. The apparatus of claim 14 , wherein substituting the first sub-assembly in the structured bill of materials for the wire harness with the second sub-assembly further comprises replacing a part number of the first sub-assembly with a part number of the second sub-assembly in the structured bill of materials for the wire harness.

16. The apparatus of claim 15 , further comprising:

identifying, by the computing system, a group of one or more sub-assemblies having a same structure as the first sub-assembly except for the physical characteristic corresponding to the variable parameter; and

selecting, by the computing system, the second sub-assembly from the group of one or more sub-assemblies.

17. The apparatus of claim 16 , wherein identifying the group of one or more sub-assemblies having a same structure as the first sub-assembly except for the physical characteristic corresponding to the variable parameter further comprises:

generating the parameterized signature, which corresponds to the structure of the first sub-assembly except for the physical characteristic corresponding to the variable parameter; and

comparing the parameterized signature against known parameterized signatures of sub-assemblies to identify the group of one or more sub-assemblies.

18. The apparatus of claim 17 , wherein the group of one or more sub-assemblies includes a master sub-assembly, and wherein the second sub-assembly is the master sub-assembly in the group of one or more sub-assemblies.

19. The apparatus of claim 16 , wherein the selection of the second sub-assembly from the group of one or more sub-assemblies is based on at least one of a cost of or a manufacturing availability of the first sub-assembly and each sub-assembly in the group of one or more sub-assemblies.

20. The apparatus of claim 14 , wherein the structured bill of materials is configured to hierarchically organize multiple sub-assemblies based on manufacturing operations to be utilized to build the wire harness.

Assignments (2)
MERGER AND CHANGE OF NAME Recorded Jun 28, 2021
From: MENTOR GRAPHICS CORPORATION; SIEMENS INDUSTRY SOFTWARE INC.
To: SIEMENS INDUSTRY SOFTWARE INC.
Reel/Frame 056696/0081 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 3, 2017
From: YVON, JEAN-MARC
To: MENTOR GRAPHICS CORPORATION
Reel/Frame 044028/0158 →