Through silicon via structure
A system and method for manufacturing a through silicon via is disclosed. An embodiment comprises forming a through silicon via with a liner protruding from a substrate. A passivation layer is formed over the substrate and the through silicon via, and the passivation layer and liner are recessed from the sidewalls of the through silicon via. Conductive material may then be formed in contact with both the sidewalls and a top surface of the through silicon via.
1. A semiconductor device comprising:
a through silicon via protruding from a substrate, the through silicon via having a sidewall;
a liner extending along the sidewall away from the substrate, the liner terminating prior to reaching a top surface of the through silicon via;
a passivation layer comprising a first upper surface a first distance away from the substrate and a second upper surface a second distance away from the substrate, the second distance being greater than the first distance, the second upper surface being adjacent to the liner, wherein the passivation layer is an insulating layer;
a conductive material over and in physical contact with the sidewall and the top surface of the through silicon via; and
a first external device in electrical connection with the through silicon via through the conductive material.
2. The semiconductor device of claim 1 , wherein the first external device is a semiconductor die.
3. The semiconductor device of claim 2 , wherein the semiconductor die is bonded in a flip chip configuration.
4. The semiconductor device of claim 2 , wherein the first external device is in electrical connection with the through silicon via and a second through silicon via through the conductive material.
5. The semiconductor device of claim 1 , further comprising a second passivation layer at least partially covering the conductive material.
6. The semiconductor device of claim 1 , further comprising a second external device bonded in electrical connection with the through silicon via, wherein the second external device is located on an opposite side of the substrate from the first external device.
7. A semiconductor device comprising:
a through silicon via protruding from a substrate, the through silicon via having a sidewall;
a first external device electrically connected to the through silicon via;
a metallization layer located on an opposite side of the substrate than the first external device;
a liner extending along the sidewall away from the substrate, the liner terminating prior to reaching a top surface of the through silicon via;
a passivation layer comprising a first upper surface a first distance away from the substrate and a second upper surface a second distance away from the substrate, the second distance being greater than the first distance, the second upper surface being adjacent to the liner, wherein the passivation layer is an insulating material;
a conductive material over and in physical contact with the sidewall and the top surface of the through silicon via, wherein the first external device is electrically connected to the through silicon via through the conductive material; and
a second external device located on an opposite side of the metallization layer than the first external device, the second external device being electrically connected to the metallization layer.
8. The semiconductor device of claim 7 , further comprising a second passivation layer at least partially covering a sidewall of the conductive material.
9. The semiconductor device of claim 8 , further comprising:
an opening through the second passivation layer; and
a conductive connection extending through the opening, wherein the first external device is electrically connected to the through silicon via through the conductive connection.
10. The semiconductor device of claim 9 , wherein the conductive connection comprises a conductive bump.
11. The semiconductor device of claim 7 , wherein the first external device is bonded in a flip chip configuration.
12. The semiconductor device of claim 7 , wherein the second external device is a printed circuit board.
13. The semiconductor device of claim 7 , wherein the first external device is electrically connected to the through silicon via and a second through silicon via through the conductive material.
14. The semiconductor device of claim 7 , wherein the first external device is a first semiconductor die and the second external device is a second semiconductor die.
15. A semiconductor device comprising:
a through silicon via in a substrate, the through silicon via comprising sidewalls, wherein the through silicon via extends through a metallization layer;
a dielectric liner adjacent to the sidewalls;
a dielectric layer over the substrate and adjacent to the dielectric liner, the dielectric layer having two different thicknesses, wherein the sidewall extends further from the substrate than the dielectric layer; and
a conductive material in contact with the sidewalls of the through silicon via.
16. The semiconductor device of claim 15 , further comprising a passivation layer at least partially covering a sidewall of the conductive material.
17. The semiconductor device of claim 16 , further comprising a conductive connection extending through the passivation layer to make physical contact with the conductive material.
18. The semiconductor device of claim 17 , wherein the conductive connection is a conductive bump.
19. The semiconductor device of claim 17 , further comprising a first external device in electrical connection with the through silicon via through the conductive material.
20. The semiconductor device of claim 19 , further comprising a second external device in electrical connection with the metallization layer, wherein the second external device and the metallization layer are located on a same side of the substrate.