IP Library › Granted Patent US 10,913,258
Granted Patent B2
US 10,913,258 · App. 14/611,580 · Granted Feb 9, 2021

Method and system for providing thermal support in an additive manufacturing process

Inventors: Adam Z. Doherty (Manchester, CT); Christopher F. O'Neill (Hebron, CT); John P. Rizzo, Jr. (Vernon, CT)
Assignee: Raytheon Technologies Corporation
B33Y30/00B22F3/1055B29C64/153B29C64/40B33Y10/00B22F2003/1058B29L2031/757Y02P10/25
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Quick Facts
Patent No.
US 10,913,258
App. No.
14/611,580
Granted
Feb 9, 2021
Kind
B2
Abstract

An additive manufacturing process includes simultaneously constructing a component and a non-contacting thermal support for the component. The non-contacting thermal support includes a three dimensional negative of the component. The non-contacting thermal support transfers heat from the component into a heat sink.

Claims (8)

1. An additive manufacturing process comprising:

simultaneously constructing a component and a non-contacting thermal support for said component by constructing at least one downward facing surface of said component and at least one upward facing surface of said non-contacting thermal support such that a gap is defined between the at least one upward facing surface and the at least one downward facing surface, and wherein said at least one downward facing surface is opposite said at least one upward facing surface across said gap, the downward facing surface having an angle of approximately horizontal relative to gravity, wherein the non-contacting thermal support includes a three dimensional negative of the component, and wherein said gap is in the range of about three to five times an average particle size of a powder particle utilized in said additive manufacturing process; and

dissipating heat from said component through said non-contacting thermal support to a heat sink.

2. The additive manufacturing process of claim 1 , wherein dissipating heat from said component through said non-contacting thermal support to a heat sink comprises providing a thermal passage across the gap.

3. The additive manufacturing process of claim 1 , further comprising constructing said thermal support as a solid component.

4. The additive manufacturing process of claim 1 , further comprising constructing said thermal support as a thermally conductive wall supported by a structural support.

5. The additive manufacturing process of claim 1 , further comprising removing said component from said non-contacting thermal support without mechanically altering said non-contacting thermal support and without chemically altering said non-contacting thermal support.

6. The additive manufacturing process of claim 1 , wherein simultaneously constructing a component and a non-contacting thermal support for said component comprises constructing each of said component and said non-contacting thermal support using a direct metal laser sintering process.

Assignments (5)
CHANGE OF NAME Recorded Jul 27, 2023
From: RAYTHEON TECHNOLOGIES CORPORATION
To: RTX CORPORATION
Reel/Frame 064714/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE AND REMOVE PATENT APPLICATION NUMBER 11886281 AND ADD PATENT APPLICATION NUMBER 14846874. TO CORRECT THE RECEIVING PARTY ADDRESS PREVIOUSLY RECORDED AT REEL: 054062 FRAME: 0001. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF ADDRESS. Recorded Mar 4, 2021
From: UNITED TECHNOLOGIES CORPORATION
To: RAYTHEON TECHNOLOGIES CORPORATION
Reel/Frame 055659/0001 →
CHANGE OF NAME Recorded Sep 4, 2020
From: UNITED TECHNOLOGIES CORPORATION
To: RAYTHEON TECHNOLOGIES CORPORATION
Reel/Frame 054062/0001 →
CHANGE OF NAME Recorded Apr 22, 2020
From: UNITED TECHNOLOGIES CORPORATION
To: RAYTHEON TECHNOLOGIES CORPORATION
Reel/Frame 052472/0871 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 2, 2015
From: DOHERTY, ADAM Z.; O'NEILL, CHRISTOPHER F.; RIZZO, JOHN P., JR.
To: UNITED TECHNOLOGIES CORPORATION
Reel/Frame 034865/0588 →
Continuity (1)
Related Publication 20160221264A1 · Aug 4, 2016
Cited By (1)
US 12,668,025