IP Library › Granted Patent US 9,536,797
Granted Patent B2
US 9,536,797 · App. 14/614,834 · Granted Jan 3, 2017

Substrate treatment apparatus and substrate treatment method

Inventors: Junichi Igarashi (Nagoya, JP); Katsuhiro Sato (Yokkaichi, JP); Keiko Morita (Tama, JP); Hideaki Hirabayashi (Yokohama, JP)
Assignee: KABUSHIKI KAISHA TOSHIBA
H01L22/26H01L22/12
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Quick Facts
Patent No.
US 9,536,797
App. No.
14/614,834
Granted
Jan 3, 2017
Kind
B2
Abstract

A substrate treatment apparatus includes a processing chamber configured to be capable of storing a substrate; a substrate holder disposed in the processing chamber and configured to be capable of holding the substrate; a sublimation removing unit configured to remove, by sublimation, a sublimating material filled between structures formed on a surface of a substrate held by the substrate holder, and a sublimation status detecting unit configured to detect a progress or an end point of sublimation removal of the sublimating material.

Claims (25)

1. A substrate treatment apparatus comprising:

a processing chamber configured to be capable of storing a substrate;

a substrate holder disposed in the processing chamber and configured to be capable of holding the substrate;

a sublimation removing unit configured to remove, by sublimation, a sublimating material filled between structures formed on a surface of a substrate held by the substrate holder;

a sublimation status detecting unit configured to detect a progress or an end point of sublimation removal of the sublimating material;

a liquid supplying unit configured to supply, to a surface of the substrate, a sublimating material containing liquid containing a sublimating material; and

a precipitating unit configured to precipitate the sublimating material between the structures by vaporizing a portion of the sublimating material containing liquid supplied to the surface of the substrate.

2. The apparatus according to claim 1 , wherein the sublimation status detecting unit comprises a flame ionization detector.

3. The apparatus according to claim 1 , wherein the sublimation status detecting unit comprises a photo ionization detector.

4. The apparatus according to claim 1 , wherein the sublimation status detecting unit comprises a photo detector configured to detect light absorption or florescence or light emission of gas produced by the sublimation of the sublimating material.

5. The apparatus according to claim 1 , wherein the sublimation status detecting unit comprises a pressure detector configured to detect a variation of pressure of gas produced by the sublimation of the sublimating material.

6. The apparatus according to claim 1 , wherein the sublimation status detecting unit comprises a substrate weight detector configured to detect a variation of weight of the substrate caused by the sublimation of the sublimating material.

7. The apparatus according to claim 1 , wherein the processing chamber is configured to be capable of simultaneously storing two or more substrates, and

wherein the sublimation removing unit comprises a heating portion configured to be capable of heating an interior of the processing chamber, and

wherein the sublimation status detecting unit is configured to detect the progress or the end point of sublimation removal of the sublimating material based on a reflected light resulting from irradiation of light on a surface of a substrate most distant from the heating portion among the two or more substrates.

8. A method of treating a substrate comprising:

supplying a sublimating material containing liquid containing a sublimating material to a substrate having structures formed on a surface thereof;

precipitating the sublimating material between the structures by vaporizing the sublimating material containing liquid supplied to the surface of the substrate;

removing, by sublimation, the sublimating material existing between the structures; and

detecting a progress or an end point of removing the sublimating material by sublimation.

9. The method according to claim 8 , wherein the detecting includes detecting, by a flame ionization detector, a variation of a component of gas produced by sublimation of the sublimating material.

10. The method according to claim 8 , wherein the detecting includes detecting, by a photo ionization detector, a variation of a component of gas produced by sublimation of the sublimating material.

11. The method according to claim 8 , wherein the detecting includes detecting light absorption or florescence or light emission of gas produced by sublimation of the sublimating material.

12. The method according to claim 8 , wherein the detecting includes detecting a variation of pressure of gas produced by sublimation of the sublimating material.

13. The method according to claim 8 , wherein the detecting includes detecting a variation of a weight of the substrate caused by sublimation of the sublimating material.

Assignments (5)
CHANGE OF NAME AND ADDRESS Recorded Jan 22, 2021
From: K.K. PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 055669/0401 →
MERGER Recorded Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: K.K. PANGEA
Reel/Frame 055659/0471 →
CHANGE OF NAME AND ADDRESS Recorded Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 055669/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 24, 2017
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 043709/0035 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 5, 2015
From: IGARASHI, JUNICHI; SATO, KATSUHIRO; MORITA, KEIKO; HIRABAYASHI, HIDEAKI
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 034897/0539 →
Priority Claims (1)
JP 2014-148780 · Jul 22, 2014 · national
Continuity (1)
Related Publication 20160025410A1 · Jan 28, 2016