High performance III-nitride power device
View Patent ↗A III-nitride semiconductor device which includes a barrier body between the gate electrode and the gate dielectric thereof.
1. A III-nitride power semiconductor device comprising:
a III-nitride heterojunction;
a substrate supporting said heterojunction, said substrate being selected from the group consisting of silicon, SiC, a III-nitride semiconductor, and sapphire;
a gate insulation body over said heterojunction;
a barrier body over said gate insulation body, said barrier body being selected from the group consisting of Ta, W, Si, Mo, Cr, Co, Pd, TiSiN, TaN, TaSiN, WN, WSiN, and WBN;
a gate body over said barrier body, said gate body and said barrier body forming a gate electrode;
first and second electrodes coupled to said heterojunction;
a field insulation body disposed between said first electrode and said gate electrode; and
a portion of said first electrode overlying said field insulation body.
2. The III-nitride power semiconductor device of claim 1 , wherein said gate insulation body comprises silicon dioxide.
3. The III-nitride power semiconductor device of claim 1 , wherein said gate insulation body comprises silicon nitride.
4. The III-nitride power semiconductor device of claim 1 , wherein said field insulation body is thicker than said gate insulation body.
5. The III-nitride power semiconductor device of claim 1 , wherein said field insulation body is disposed between said second electrode and said gate electrode.
6. The III-nitride power semiconductor device of claim 1 , wherein said field insulation body comprises silicon dioxide.
7. The III-nitride power semiconductor device of claim 1 , wherein said barrier body extends from said gate insulation body over a portion of said field insulation body.
8. The III-nitride power semiconductor device of claim 1 , wherein said heterojunction includes a III-nitride channel layer, and a III-nitride barrier layer on said III-nitride channel layer.
9. The III-nitride power semiconductor device of claim 8 , wherein said III-nitride channel layer comprises GaN, and said III-nitride barrier layer comprises AlGaN.
10. A III-nitride power semiconductor device comprising:
a III-nitride heterojunction;
a gate insulation body over said heterojunction;
a barrier body over said gate insulation body, said barrier body being selected from the group consisting of Ta, W, Si, Mo, Cr, Co, Pd, TiSiN, TaN, TaSiN, WN, WSiN, and WBN;
a gate body over said barrier body, said gate body and said barrier body forming a gate electrode, said gate body being selected from the group consisting of N+ GaN, Si, Ge, P+ GaN, and a metal;
first and second electrodes coupled to said heterojunction;
a field insulation body disposed between said first electrode and said gate electrode; and
a portion of said first electrode overlying said field insulation body.
11. The III-nitride power semiconductor device of claim 10 , wherein said gate insulation body comprises silicon dioxide.
12. The III-nitride power semiconductor device of claim 10 , wherein said gate insulation body comprises silicon nitride.
13. The III-nitride power semiconductor device of claim 10 , wherein said field insulation body is thicker than said gate insulation body.
14. The III-nitride power semiconductor device of claim 10 , wherein said field insulation body is disposed between said second electrode and said gate electrode.
15. The III-nitride power semiconductor device of claim 10 , wherein said field insulation body comprises silicon dioxide.
16. The III-nitride power semiconductor device of claim 10 , wherein said barrier body extends from said gate insulation body over a portion of said field insulation body.