Multiple die stacking for two or more die
A microelectronic package can include a substrate having first and second opposed surfaces, and first and second microelectronic elements having front surfaces facing the first surface. The substrate can have a plurality of substrate contacts at the first surface and a plurality of terminals at the second surface. Each microelectronic element can have a plurality of element contacts at the front surface thereof. The element contacts can be joined with corresponding ones of the substrate contacts. The front surface of the second microelectronic element can partially overlie a rear surface of the first microelectronic element and can be attached thereto. The element contacts of the first microelectronic element can be arranged in an area array and are flip-chip bonded with a first set of the substrate contacts. The element contacts of the second microelectronic element can be joined with a second set of the substrate contacts by conductive masses.
1. A microelectronic package, comprising:
a substrate having first and second opposed surfaces, a plurality of substrate contacts at the first surface, and a plurality of terminals at the second surface configured to connect with at least one component external to the substrate; and
first and second microelectronic elements, the first microelectronic element having a first surface facing the first surface of the substrate and a second surface opposite therefrom, the first microelectronic element having a lateral edge extending between the first and second surfaces thereof and extending in the second direction, the second microelectronic element having a front surface facing the first surface of the substrate, each microelectronic element having a plurality of element contacts at the front surface thereof, the element contacts of each microelectronic element being joined with corresponding ones of the substrate contacts, the front surface of the second microelectronic element partially overlying a rear surface of the first microelectronic element and attached thereto, the front surface of the second microelectronic element projecting in the first direction beyond the lateral edge of the first microelectronic element,
the second microelectronic element having first and second opposed edges extending between the front and rear surfaces of the second microelectronic element and extending in the first direction, the front surface of the second microelectronic element having a first outer region adjacent the first edge, a second outer region adjacent the second edge, and a central region disposed between the first and second outer regions, each of the first and second outer regions and the central region having equal width such that the central region extends a middle third of a distance between the first and second edges, the element contacts of the second microelectronic element being disposed in two adjacent parallel rows in the central region,
wherein the element contacts of the first microelectronic element are arranged in an area array and are flip-chip bonded with a first set of the substrate contacts, and the element contacts of the second microelectronic element are joined with a second set of the substrate contacts by elongated solder connects, each elongated solder connect having a width that is less than a distance between the corresponding one of the element contacts and the corresponding one of the substrate contacts to which it is joined.
2. The microelectronic package as claimed in claim 1 , wherein the element contacts of the second microelectronic element project beyond a lateral edge of the first microelectronic element.
3. The microelectronic package as claimed in claim 1 , wherein at least one of the first and second microelectronic elements includes a memory storage element.
4. The microelectronic package as claimed in claim 3 , further comprising a plurality of leads extending from at least some of the substrate contacts to the terminals, wherein the leads are configured to carry an address signal configured to address the memory storage element in at least one of the first and second microelectronic elements.
5. The microelectronic package as claimed in claim 1 , wherein at least some of the terminals are configured to carry at least one of a signal or a reference potential between the respective terminals and each of the first and second microelectronic elements.
6. The microelectronic package as claimed in claim 1 , further comprising a plurality of third microelectronic elements, each third microelectronic element being electrically connected to the substrate.
7. The microelectronic package as claimed in claim 6 , wherein the plurality of third microelectronic elements are arranged in a stacked configuration, each of the third microelectronic elements having a front or rear surface confronting a front or rear surface of an adjacent one of the third microelectronic elements.
8. The microelectronic package as claimed in claim 6 , wherein the plurality of third microelectronic elements are arranged in a planar configuration, each of the third microelectronic elements having a peripheral surface confronting a peripheral surface of an adjacent one of the third microelectronic elements.
9. The microelectronic package as claimed in claim 6 , wherein the second microelectronic element includes volatile RAM, the third microelectronic elements each include nonvolatile flash memory, and the first microelectronic element includes a processor configured to predominantly control transfers of data between an external component and the second and third microelectronic elements.
10. The microelectronic package as claimed in claim 6 , wherein the second microelectronic element includes a volatile frame buffer memory storage element, the third microelectronic elements each include nonvolatile flash memory, and the first microelectronic element includes a graphics processor.
11. A module, comprising:
a module card having a first surface, a second surface, and a plurality of parallel exposed edge contacts adjacent an edge of at least one of the first and second surfaces configured to mate with corresponding contacts of a socket, the module card having a plurality of card contacts at the first surface; and
first and second microelectronic elements, the first microelectronic element having a first surface facing the first surface of the module card and a second surface opposite therefrom, the first microelectronic element having a lateral edge extending between the first and second surfaces thereof and extending in the second direction, the second microelectronic element having a front surface facing the first surface of the module card, each microelectronic element having a plurality of element contacts at the front surface thereof, the element contacts of each microelectronic element being joined with corresponding ones of the card contacts, the front surface of the second microelectronic element partially overlying a rear surface of the first microelectronic element and attached thereto, the front surface of the second microelectronic element projecting in the first direction beyond the lateral edge of the first microelectronic element,
the second microelectronic element having first and second opposed edges extending between the front and rear surfaces of the second microelectronic element and extending in the first direction, the front surface of the second microelectronic element having a first outer region adjacent the first edge, a second outer region adjacent the second edge, and a central region disposed between the first and second outer regions, each of the first and second outer regions and the central region having equal width such that the central region extends a middle third of a distance between the first and second edges, the element contacts of the second microelectronic element being disposed in two adjacent parallel rows in the central region,
wherein the element contacts of the first microelectronic element are arranged in an area array and are flip-chip bonded with a first set of the card contacts, and the element contacts of the second microelectronic element are joined with a second set of the card contacts by elongated solder connects, each elongated solder connect having a width that is less than a distance between the corresponding one of the element contacts and the corresponding one of the card contacts to which it is joined.
12. The module as claimed in claim 11 , wherein the element contacts of the second microelectronic element project beyond a lateral edge of the first microelectronic element.
13. The module as claimed in claim 11 , wherein the edge contacts are exposed at at least one of the first or second surfaces of the module card.
14. The module as claimed in claim 11 , wherein at least one of the first and second microelectronic elements includes a memory storage element.
15. The module as claimed in claim 14 , further comprising a plurality of leads extending from at least some of the card contacts to the edge contacts, wherein the leads are configured to carry an address signal configured to address the memory storage element in at least one of the first and second microelectronic elements.
16. The module as claimed in claim 11 , wherein at least some of the edge contacts are configured to carry at least one of a signal or a reference potential between the respective edge contact and each of the first and second microelectronic elements.
17. The module as claimed in claim 11 , further comprising a plurality of third microelectronic elements, each third microelectronic element being electrically connected to the module card.
18. The module as claimed in claim 17 , wherein the plurality of third microelectronic elements are arranged in a stacked configuration, each of the third microelectronic elements having a front or rear surface confronting a front or rear surface of an adjacent one of the third microelectronic elements.
19. The module as claimed in claim 17 , wherein the plurality of third microelectronic elements are arranged in a planar configuration, each of the third microelectronic elements having a peripheral surface confronting a peripheral surface of an adjacent one of the third microelectronic elements.
20. The module as claimed in claim 17 , wherein the second microelectronic element includes volatile RAM, the third microelectronic elements each include nonvolatile flash memory, and the first microelectronic element includes a processor configured to predominantly control transfers of data between an external component and the second and third microelectronic elements.
21. The module as claimed in claim 17 , wherein the second microelectronic element includes a volatile frame buffer memory storage element, the third microelectronic elements each include nonvolatile flash memory, and the first microelectronic element includes a graphics processor.