Source/drain contacts for non-planar transistors
The present description relates to the field of fabricating microelectronic devices having non-planar transistors. Embodiments of the present description relate to the formation of source/drain contacts within non-planar transistors, wherein a titanium-containing contact interface may be used in the formation of the source/drain contact with a discreet titanium silicide formed between the titanium-containing interface and a silicon-containing source/drain structure.
1. A microelectronic device, comprising:
a silicon-containing non-planar transistor fin;
a source/drain region in the silicon-containing non-planar fin;
a source/drain contact adjacent the source/drain region, wherein the source/drain contact comprises a conductive contact material and a titanium-containing contact interface layer disposed between conductive contact material and the source/drain region;
a titanium silicide interface disposed between the source/drain region and the titanium-containing contact interface layer; and
a non-planar transistor gate over the non-planar transistor fin, wherein the non-planar transistor gate comprises a gate electrode recessed between gate spacers and a capping structure disposed on the recessed gate electrode between the gate spacers, and wherein the titanium-containing contact interface layer abuts at least a portion of one non-planar transistor gate spacer and/or abuts at least a portion of the capping structure.
2. The microelectronic device of claim 1 , wherein the conductive contact material comprises tungsten.
3. The microelectronic device of claim 1 , wherein the titanium silicide interface resides substantially only between the source/drain region and the titanium-containing contact interface layer.
4. A method of fabricating a microelectronic device, comprising:
forming a silicon-containing non-planar transistor fin;
forming a source/drain region in the silicon-containing non-planar fin;
forming a dielectric material over the source/drain region;
forming a contact opening through the dielectric material to expose a portion of the source/drain region;
conformally depositing a titanium-containing contact interface layer within the contact opening to abut the source/drain region;
depositing a conductive contact material within the contact opening to abut the titanium-containing contact interface layer; and
forming a titanium silicide interface between the source/drain region and the titanium-containing contact interface layer.
5. The method of claim 4 , wherein conformally depositing the titanium-containing contact interface layer comprises depositing a substantially pure titanium contact interface layer.
6. The method of claim 4 , wherein depositing a conductive contact material within the contact opening comprises depositing tungsten within the contact opening.
7. The method of claim 4 , wherein forming the titanium silicide interface between the source/drain region and the titanium-containing contact interface layer comprises forming the titanium silicide interface between the source/drain region and the titanium-containing contact interface layer by heating the source/drain region and the titanium-containing contact interface layer.
8. The method of claim 4 , wherein forming the titanium silicide interface comprises forming the titanium silicide substantially only between the source/drain region and the titanium-containing contact interface layer.
9. The method of claim 4 , wherein forming the non-planar transistor gate comprises forming gate spacers, forming a gate electrode recessed between the gate spacers and disposing a capping structure on the recessed gate electrode between the gate spacers.
10. The method of claim 9 , wherein forming a contact opening through the dielectric material to expose at least a portion of the source/drain region further comprises forming a contact opening through the dielectric material to expose a portion of the source/drain region and at least a portion of one non-planar transistor gate spacer.
11. The method of claim 10 , wherein forming the titanium-containing contact interface layer further comprises forming the titanium-containing contact interface layer to abut at least a portion of one non-planar transistor gate spacer.
12. The method of claim 9 , wherein forming a contact opening through the dielectric material to expose at least a portion of the source/drain region further comprises forming a contact opening through the dielectric material to expose a portion of the source/drain region and at least a portion of the capping structure.
13. The method of claim 12 , wherein the forming the titanium-containing contact interface layer further comprises forming the titanium-containing contact interface layer to abut at least a portion of the capping structure.
14. A microelectronic device, comprising:
a silicon-containing non-planar transistor fin;
a source/drain region in the silicon-containing non-planar fin;
a source/drain contact adjacent the source/drain region, wherein the source/drain contact comprises a conductive contact material and a titanium-containing contact interface layer disposed between conductive contact material and the source/drain region, wherein the titanium-containing contact interface layer comprises substantially pure titanium;
a titanium silicide interface disposed between the source/drain region and the titanium- containing contact interface layer; and
a non-planar transistor gate over the non-planar transistor fin, wherein the non-planar transistor gate comprises a gate electrode recessed between gate spacers and a capping structure disposed on the recessed gate electrode between the gate spacers, and wherein the titanium-containing contact interface layer abuts at least a portion of one non-planar transistor gate spacer and/or abuts at least a portion of the capping structure.
15. The microelectronic device of claim 14 , wherein the conductive contact material comprises tungsten.
16. The microelectronic device of claim 14 , wherein the titanium silicide interface resides substantially only between the source/drain region and the titanium-containing contact interface layer.