IP Library Granted Patent US 9,534,135
Granted Patent B2
US 9,534,135 · App. 14/620,935 · Granted Jan 3, 2017

Composition for pattern formation, and pattern-forming method

Inventors: Hiroyuki Komatsu (Tokyo, JP); Takehiko Naruoka (Tokyo, JP); Shinya Minegishi (Tokyo, JP); Tomoki Nagai (Tokyo, JP)
Assignee: JSR CORPORATION
C09D153/00C08F212/08C08F230/08C08F297/026G03F7/0002B05D1/185
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Quick Facts
Patent No.
US 9,534,135
App. No.
14/620,935
Granted
Jan 3, 2017
Kind
B2
Abstract

A composition for pattern formation includes a block copolymer and a solvent. The block copolymer is capable of forming a phase separation structure through directed self-assembly. The block copolymer includes a first block and a second block. The first block includes a first repeating unit which includes at least two silicon atoms. The second block includes a second repeating unit which does not include a silicon atom. A sum of the atomic weight of atoms constituting the first repeating unit is no greater than 700.

Claims (62)

1. A pattern-forming method comprising:

applying a composition directly or indirectly on a substrate such that a directed self-assembling film having a phase separation structure is provided directly or indirectly on the substrate, the phase separation structure comprising a plurality of phases; and

removing a part of the plurality of phases of the directed self-assembling film,

wherein the composition comprises:

a block copolymer capable of forming a phase separation structure through directed self-assembly, the block copolymer comprising:

a first block comprising a first repeating unit which comprises at least two silicon atoms; and

a second block comprising a second repeating unit which does not comprise a silicon atom; and

a solvent,

wherein a sum of the atomic weight of atoms constituting the first repeating unit is no greater than 700,

wherein the first repeating unit is a repeating unit represented by formula (1), a repeating unit represented by formula (2-1), a repeating unit represented by formula (2-2), a repeating unit represented by formula (2-3), a repeating unit represented by formula (2-4), a repeating unit represented by formula (2-5), a repeating unit represented by formula (2-6), a repeating unit represented by formula (2-7), a repeating unit represented by formula (2-8), or a combination thereof:

wherein:

R 1 represents a hydrogen atom or a methyl group;

R 2 represents a divalent hydrocarbon group having 1 to 10 carbon atoms;

R 3 , R 4 and R 5 each independently represent a hydrogen atom, a monovalent hydrocarbon group having 1 to 10 carbon atoms, —SiR′ 3 , —Si 2 R′ 5 or —OSiR′ 3 , or

two of R 3 , R 4 and R 5 taken together represent a ring structure having 3 to 10 ring atoms together with the silicon atom to which the two of R 3 , R 4 and R 5 bond, and the rest of R 3 , R 4 and R 5 represents a hydrogen atom, a monovalent hydrocarbon group having 1 to 10 carbon atoms, —SiR′ 3 , —Si 2 R′ 5 or —OSiR′ 3 ;

each R′ independently represents a hydrogen atom or a monovalent hydrocarbon group having 1 to 10 carbon atoms, wherein at least one of R 3 , R 4 and R 5 represents —SiR′ 3 , —Si 2 R′ 5 or —OSiR′ 3 , and wherein a sum of the number of carbon atoms included in R 3 , R 4 and R 5 is no greater than 20;

each R 6 independently represents a hydrogen atom or a methyl group;

R 7 represents a hydrogen atom or a methyl group; and

Me represents a methyl group, and

wherein a line-and-space pattern is formed, and a molar ratio of the first repeating unit to the second repeating unit is from 35/65 to 65/35.

2. The pattern-forming method according to claim 1 , further comprising:

providing an underlayer film directly or indirectly on the substrate before applying the composition on the substrate.

3. The pattern-forming method according to claim 1 , further comprising:

forming a prepattern directly or indirectly on the substrate before applying the composition on the substrate.

4. The pattern-forming method according to claim 1 , wherein the second block is a polystyrene block comprising an unsubstituted or substituted styrene unit, or a poly(meth)acrylic acid ester block comprising a (meth)acrylic acid ester unit.

5. The pattern-forming method according to claim 1 , wherein the block copolymer is a diblock copolymer or a triblock copolymer.

6. The pattern-forming method according to claim 1 , wherein the lower limit of the number of the silicon atoms included in the first repeating unit is 3.

7. The pattern-forming method according to claim 1 , wherein the lower limit of the number of the silicon atoms included in the first repeating unit is 4.

8. The pattern-forming method according to claim 1 , wherein the upper limit of the number of the silicon atoms included in the first repeating unit is 15.

9. The pattern-forming method according to claim 1 , wherein the upper limit of the number of the silicon atoms included in the first repeating unit is 7.

10. The pattern-forming method according to claim 1 , the sum of the atomic weight of atoms constituting the first repeating unit is no greater than 450.

11. A pattern-forming method comprising:

applying a composition directly or indirectly on a substrate such that a directed self-assembling film having a phase separation structure is provided directly or indirectly on the substrate, the phase separation structure comprising a plurality of phases; and

removing a part of the plurality of phases of the directed self-assembling film,

wherein the composition comprises:

a block copolymer capable of forming a phase separation structure through directed self-assembly, the block copolymer comprising:

a first block comprising a first repeating unit which comprises at least two silicon atoms; and

a second block comprising a second repeating unit which does not comprise a silicon atom; and

a solvent,

wherein a sum of the atomic weight of atoms constituting the first repeating unit is no greater than 700,

wherein the first repeating unit is a repeating unit represented by formula (1), a repeating unit represented by formula (2-1), a repeating unit represented by formula (2-2), a repeating unit represented by formula (2-3), a repeating unit represented by formula (2-4), a repeating unit represented by formula (2-5), a repeating unit represented by formula (2-6), a repeating unit represented by formula (2-7), a repeating unit represented by formula (2-8), or a combination thereof:

wherein:

R 1 represents a hydrogen atom or a methyl group;

R 2 represents a divalent hydrocarbon group having 1 to 10 carbon atoms;

R 3 , R 4 and R 5 each independently represent a hydrogen atom, a monovalent hydrocarbon group having 1 to 10 carbon atoms, —SiR′ 3 , —Si 2 R′ 5 or —OSiR′ 3 , or

two of R 3 , R 4 and R 5 taken together represent a ring structure having 3 to 10 ring atoms together with the silicon atom to which the two of R 3 , R 4 and R 5 bond, and the rest of R 3 , R 4 and R 5 represents a hydrogen atom, a monovalent hydrocarbon group having 1 to 10 carbon atoms, —SiR′ 3 , —Si 2 R′ 5 or —OSiR′ 3 ;

each R′ independently represents a hydrogen atom or a monovalent hydrocarbon group having 1 to 10 carbon atoms, wherein at least one of R 3 , R 4 and R 5 represents —SiR′ 3 , —Si 2 R′ 5 or —OSiR′ 3 , and wherein a sum of the number of carbon atoms included in R 3 , R 4 and R 5 is no greater than 20;

each R 6 independently represents a hydrogen atom or a methyl group;

R 7 represents a hydrogen atom or a methyl group; and

Me represents a methyl group, and

wherein a hole pattern is formed, and a molar ratio of the first repeating unit to the second repeating unit is from 20/80 to 80/20.

12. The pattern-forming method according to claim 11 , further comprising:

providing an underlayer film directly or indirectly on the substrate before applying the composition on the substrate.

13. The pattern-forming method according to claim 11 , further comprising:

forming a prepattern directly or indirectly on the substrate before applying the composition on the substrate.

14. The pattern-forming method according to claim 11 , wherein the second block is a polystyrene block comprising an unsubstituted or substituted styrene unit, or a poly(meth)acrylic acid ester block comprising a (meth)acrylic acid ester unit.

15. The pattern-forming method according to claim 11 , wherein the block copolymer is a diblock copolymer or a triblock copolymer.

16. The pattern-forming method according to claim 11 , wherein the lower limit of the number of the silicon atoms included in the first repeating unit is 3.

17. The pattern-forming method according to claim 11 , wherein the lower limit of the number of the silicon atoms included in the first repeating unit is 4.

18. The pattern-forming method according to claim 11 , wherein the upper limit of the number of the silicon atoms included in the first repeating unit is 15.

19. The pattern-forming method according to claim 11 , wherein the upper limit of the number of the silicon atoms included in the first repeating unit is 7.

20. The pattern-forming method according to claim 11 , the sum of the atomic weight of atoms constituting the first repeating unit is no greater than 450.

Assignments (3)
MERGER Recorded Mar 23, 2026
From: JSR CORPORATION
To: JICC-02, CO., LTD
Reel/Frame 075191/0149 →
CHANGE OF NAME Recorded Mar 23, 2026
From: JICC-02 CO., LTD
To: JSR CORPORATION
Reel/Frame 075192/0023 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 22, 2015
From: KOMATSU, HIROYUKI; NARUOKA, TAKEHIKO; MINEGISHI, SHINYA; NAGAI, TOMOKI
To: JSR CORPORATION
Reel/Frame 035224/0631 →
Priority Claims (2)
JP 2014-025978 · Feb 13, 2014 · national
JP 2014-085946 · Apr 17, 2014 · national
Continuity (1)
Related Publication 20150225601A1 · Aug 13, 2015