Composition for pattern formation, and pattern-forming method
A composition for pattern formation includes a block copolymer and a solvent. The block copolymer is capable of forming a phase separation structure through directed self-assembly. The block copolymer includes a first block and a second block. The first block includes a first repeating unit which includes at least two silicon atoms. The second block includes a second repeating unit which does not include a silicon atom. A sum of the atomic weight of atoms constituting the first repeating unit is no greater than 700.
1. A pattern-forming method comprising:
applying a composition directly or indirectly on a substrate such that a directed self-assembling film having a phase separation structure is provided directly or indirectly on the substrate, the phase separation structure comprising a plurality of phases; and
removing a part of the plurality of phases of the directed self-assembling film,
wherein the composition comprises:
a block copolymer capable of forming a phase separation structure through directed self-assembly, the block copolymer comprising:
a first block comprising a first repeating unit which comprises at least two silicon atoms; and
a second block comprising a second repeating unit which does not comprise a silicon atom; and
a solvent,
wherein a sum of the atomic weight of atoms constituting the first repeating unit is no greater than 700,
wherein the first repeating unit is a repeating unit represented by formula (1), a repeating unit represented by formula (2-1), a repeating unit represented by formula (2-2), a repeating unit represented by formula (2-3), a repeating unit represented by formula (2-4), a repeating unit represented by formula (2-5), a repeating unit represented by formula (2-6), a repeating unit represented by formula (2-7), a repeating unit represented by formula (2-8), or a combination thereof:
wherein:
R 1 represents a hydrogen atom or a methyl group;
R 2 represents a divalent hydrocarbon group having 1 to 10 carbon atoms;
R 3 , R 4 and R 5 each independently represent a hydrogen atom, a monovalent hydrocarbon group having 1 to 10 carbon atoms, —SiR′ 3 , —Si 2 R′ 5 or —OSiR′ 3 , or
two of R 3 , R 4 and R 5 taken together represent a ring structure having 3 to 10 ring atoms together with the silicon atom to which the two of R 3 , R 4 and R 5 bond, and the rest of R 3 , R 4 and R 5 represents a hydrogen atom, a monovalent hydrocarbon group having 1 to 10 carbon atoms, —SiR′ 3 , —Si 2 R′ 5 or —OSiR′ 3 ;
each R′ independently represents a hydrogen atom or a monovalent hydrocarbon group having 1 to 10 carbon atoms, wherein at least one of R 3 , R 4 and R 5 represents —SiR′ 3 , —Si 2 R′ 5 or —OSiR′ 3 , and wherein a sum of the number of carbon atoms included in R 3 , R 4 and R 5 is no greater than 20;
each R 6 independently represents a hydrogen atom or a methyl group;
R 7 represents a hydrogen atom or a methyl group; and
Me represents a methyl group, and
wherein a line-and-space pattern is formed, and a molar ratio of the first repeating unit to the second repeating unit is from 35/65 to 65/35.
2. The pattern-forming method according to claim 1 , further comprising:
providing an underlayer film directly or indirectly on the substrate before applying the composition on the substrate.
3. The pattern-forming method according to claim 1 , further comprising:
forming a prepattern directly or indirectly on the substrate before applying the composition on the substrate.
4. The pattern-forming method according to claim 1 , wherein the second block is a polystyrene block comprising an unsubstituted or substituted styrene unit, or a poly(meth)acrylic acid ester block comprising a (meth)acrylic acid ester unit.
5. The pattern-forming method according to claim 1 , wherein the block copolymer is a diblock copolymer or a triblock copolymer.
6. The pattern-forming method according to claim 1 , wherein the lower limit of the number of the silicon atoms included in the first repeating unit is 3.
7. The pattern-forming method according to claim 1 , wherein the lower limit of the number of the silicon atoms included in the first repeating unit is 4.
8. The pattern-forming method according to claim 1 , wherein the upper limit of the number of the silicon atoms included in the first repeating unit is 15.
9. The pattern-forming method according to claim 1 , wherein the upper limit of the number of the silicon atoms included in the first repeating unit is 7.
10. The pattern-forming method according to claim 1 , the sum of the atomic weight of atoms constituting the first repeating unit is no greater than 450.
11. A pattern-forming method comprising:
applying a composition directly or indirectly on a substrate such that a directed self-assembling film having a phase separation structure is provided directly or indirectly on the substrate, the phase separation structure comprising a plurality of phases; and
removing a part of the plurality of phases of the directed self-assembling film,
wherein the composition comprises:
a block copolymer capable of forming a phase separation structure through directed self-assembly, the block copolymer comprising:
a first block comprising a first repeating unit which comprises at least two silicon atoms; and
a second block comprising a second repeating unit which does not comprise a silicon atom; and
a solvent,
wherein a sum of the atomic weight of atoms constituting the first repeating unit is no greater than 700,
wherein the first repeating unit is a repeating unit represented by formula (1), a repeating unit represented by formula (2-1), a repeating unit represented by formula (2-2), a repeating unit represented by formula (2-3), a repeating unit represented by formula (2-4), a repeating unit represented by formula (2-5), a repeating unit represented by formula (2-6), a repeating unit represented by formula (2-7), a repeating unit represented by formula (2-8), or a combination thereof:
wherein:
R 1 represents a hydrogen atom or a methyl group;
R 2 represents a divalent hydrocarbon group having 1 to 10 carbon atoms;
R 3 , R 4 and R 5 each independently represent a hydrogen atom, a monovalent hydrocarbon group having 1 to 10 carbon atoms, —SiR′ 3 , —Si 2 R′ 5 or —OSiR′ 3 , or
two of R 3 , R 4 and R 5 taken together represent a ring structure having 3 to 10 ring atoms together with the silicon atom to which the two of R 3 , R 4 and R 5 bond, and the rest of R 3 , R 4 and R 5 represents a hydrogen atom, a monovalent hydrocarbon group having 1 to 10 carbon atoms, —SiR′ 3 , —Si 2 R′ 5 or —OSiR′ 3 ;
each R′ independently represents a hydrogen atom or a monovalent hydrocarbon group having 1 to 10 carbon atoms, wherein at least one of R 3 , R 4 and R 5 represents —SiR′ 3 , —Si 2 R′ 5 or —OSiR′ 3 , and wherein a sum of the number of carbon atoms included in R 3 , R 4 and R 5 is no greater than 20;
each R 6 independently represents a hydrogen atom or a methyl group;
R 7 represents a hydrogen atom or a methyl group; and
Me represents a methyl group, and
wherein a hole pattern is formed, and a molar ratio of the first repeating unit to the second repeating unit is from 20/80 to 80/20.
12. The pattern-forming method according to claim 11 , further comprising:
providing an underlayer film directly or indirectly on the substrate before applying the composition on the substrate.
13. The pattern-forming method according to claim 11 , further comprising:
forming a prepattern directly or indirectly on the substrate before applying the composition on the substrate.
14. The pattern-forming method according to claim 11 , wherein the second block is a polystyrene block comprising an unsubstituted or substituted styrene unit, or a poly(meth)acrylic acid ester block comprising a (meth)acrylic acid ester unit.
15. The pattern-forming method according to claim 11 , wherein the block copolymer is a diblock copolymer or a triblock copolymer.
16. The pattern-forming method according to claim 11 , wherein the lower limit of the number of the silicon atoms included in the first repeating unit is 3.
17. The pattern-forming method according to claim 11 , wherein the lower limit of the number of the silicon atoms included in the first repeating unit is 4.
18. The pattern-forming method according to claim 11 , wherein the upper limit of the number of the silicon atoms included in the first repeating unit is 15.
19. The pattern-forming method according to claim 11 , wherein the upper limit of the number of the silicon atoms included in the first repeating unit is 7.
20. The pattern-forming method according to claim 11 , the sum of the atomic weight of atoms constituting the first repeating unit is no greater than 450.