IP Library Granted Patent US 9,645,963
Granted Patent B2
US 9,645,963 · App. 14/623,293 · Granted May 9, 2017

Systems and methods for concurrently testing master and slave devices in a system on a chip

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Quick Facts
Patent No.
US 9,645,963
App. No.
14/623,293
Granted
May 9, 2017
Kind
B2
Abstract

An integrated circuit includes a substrate, a master system on the substrate, a slave system on the substrate that is coupled to communicate with the master system, a first clock signal coupled to the master system, and a second clock signal coupled to the slave system. The master system is configured to isolate the slave system from the master system while a first test of the master system is conducted in parallel with a second test of the slave system. The master system uses the first clock signal during the first test and the slave system uses the second clock signal during the second test.

Claims (46)

1. An integrated circuit (IC) comprising:

a substrate;

a master system on the substrate;

a slave system on the substrate and coupled to communicate with the master system;

a first clock signal coupled to the master system;

a second clock signal coupled to the slave system, wherein

the master system is configured to isolate the slave system from a reset signal from the master system while a first test of the master system is conducted in parallel with a second test of the slave system, and

the master system uses the first clock signal during the first test and the slave system uses the second clock signal during the second test.

2. The IC of claim 1 , wherein the slave system includes:

clock select logic configured to choose between a test clock signal from the master system and the second clock signal.

3. The IC of claim 1 , further comprising:

a memory device on the substrate coupled to communicate with the master and slave systems during the first and second test.

4. The IC of claim 1 , further comprising:

a first set of input/output pads on the substrate and coupled only to the master system; and

a second set of input/output pads on the substrate and coupled only to the slave system.

5. The IC of claim 1 , further comprising:

a debug input/output pad on the substrate coupled to a register in the slave system, wherein the debug input/output pad is used to input a signal to isolate the slave system from the master system.

6. The IC of claim 1 , wherein the master system is a microcontroller and the slave system is a radio system.

7. The IC of claim 6 , wherein the radio system includes a second microcontroller.

8. The IC of claim 1 , wherein the master and the slave systems are microcontrollers.

9. The IC of claim 1 , further comprising:

a master reset signal coupled to the master system; and

an auxiliary reset signal coupled to the slave system, wherein the auxiliary reset signal is enabled only during the second test.

10. The IC of claim 9 , wherein the auxiliary reset signal is used by a second microcontroller in the slave system.

11. The IC of claim 1 , further comprising:

a first logic gate configured to block a reset signal to the slave system when reset blocking is enabled.

12. The IC of claim 11 , further comprising:

a second logic gate configured to block interrupt signals from the slave system to the master system when slave output blocking is enabled.

13. A method of testing an integrated circuit device comprising:

isolating a slave device from a master device by blocking a reset signal to the slave device during a test period;

providing a first clock signal to the master device;

providing a second clock signal to the slave device during the test period;

testing the slave device in parallel with testing the master device during the test period; and

using the first clock signal to operate the slave device and the master device during normal operation.

14. The method of claim 13 further comprising:

sharing a memory device between the master device and the slave device during the test period.

15. The method of claim 13 , further comprising:

blocking interrupt signals from the slave system to the master system when slave output blocking is enabled.

16. The method of claim 13 , wherein:

the master system is a microcontroller and the slave system is at least one of a group consisting of a radio system and a second microcontroller.

17. The method of claim 13 , further comprising:

configuring the slave system for the test period before blocking the reset signal.

18. The method of claim 13 , further comprising:

utilizing an auxiliary reset signal for the slave device during the test period.

19. The method of claim 13 , wherein:

isolating the slave system from the master system includes using a debug input/output pad to provide a signal to indicate whether to block the reset signal.

Assignments (15)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 040626 FRAME: 0683. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME EFFECTIVE NOVEMBER 7, 2016. Recorded Jan 12, 2017
From: NXP SEMICONDUCTORS USA, INC. (MERGED INTO); FREESCALE SEMICONDUCTOR, INC. (UNDER)
To: NXP USA, INC.
Reel/Frame 041414/0883 →
CHANGE OF NAME Recorded Nov 16, 2016
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 040626/0683 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 7, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037458/0341 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 7, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037458/0359 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0974 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded May 4, 2015
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 035571/0080 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded May 4, 2015
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 035571/0095 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded May 4, 2015
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 035571/0112 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 16, 2015
From: STOLL, CHRIS N.; NAPPI, CHRIS P.; REDFORD, GEORGE R.; VOGLER, JAYSON D.; WAHEED, KHURRAM
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 034968/0253 →