IP Library Granted Patent US 9,431,554
Granted Patent B2
US 9,431,554 · App. 14/624,679 · Granted Aug 30, 2016

Semiconductor light trap device

Inventor: Thoralf Kautzsch (Dresden, DE)
Assignee: Infineon Technologies Dresden GmbH
H01L31/02327H01L31/02363H01L31/0352Y02E10/50
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Quick Facts
Patent No.
US 9,431,554
App. No.
14/624,679
Granted
Aug 30, 2016
Kind
B2
Abstract

Buried structures for silicon devices which alter light paths and thereby form light traps. The lights traps couple more light to a photosensitive surface of the device, rather than reflecting the light or absorbing it more deeply within the device.

Claims (11)

1. A device comprising:

a semiconductor structure having an exposed surface to be exposed to light rays;

a photoelectrically active portion located beneath the exposed surface within the semiconductor structure; and

an internal structure located beneath the active photoelectrically portion, the internal structure having an interface surface generally parallel to the exposed surface at which total internal reflection of light rays occurs such that at least some the light rays are redirected toward the photoelectrically active portion.

2. The device of claim 1 , wherein the exposed surface further comprises refractive facets that are angled relative to the interface surface so as to be non-parallel relative to the interface surface.

3. The device of claim 1 , wherein the internal structure comprises a cavity.

4. The device of claim 3 , wherein the cavity is defined, at least in part, by the interface surface and a second surface that is separated from and substantially parallel to the interface surface.

5. The device of claim 1 , further comprising a perimeter trench proximate a perimeter of the semiconductor structure having an internal interface surface that is oriented substantially perpendicular to the interface surface.

6. The device of claim 1 , further comprising scattering facets located within the semiconductor structure above or within the photoelectrically active portion, wherein the scattering facets redirect light rays by total internal reflection.

7. The device of claim 6 , wherein the scattering facets are formed at the interfaces of cavities within the semiconductor structure and the cavities are adjacent one another and spaced from one another.

8. The device of claim 7 , wherein the cavities are substantially diamond shaped in cross section.

Assignments (1)
CHANGE OF NAME Recorded Jun 12, 2024
From: INFINEON TECHNOLOGIES DRESDEN GMBH
To: INFINEON TECHNOLOGIES DRESDEN GMBH & CO. KG
Reel/Frame 067699/0648 →
Continuity (2)
Continuation 13930167 · Jun 28, 2013
Related Publication 20150162464A1 · Jun 11, 2015