IP Library › Granted Patent US 10,492,664
Granted Patent B2
US 10,492,664 · App. 14/625,316 · Granted Dec 3, 2019

Electronic endoscope and electronic endoscope device

Inventor: Satoshi Narita (Ashigarakami-gun, JP)
Assignee: FUJIFILM Corporation
A61B1/00124
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Quick Facts
Patent No.
US 10,492,664
App. No.
14/625,316
Granted
Dec 3, 2019
Kind
B2
Abstract

There is provided an electronic endoscope and an electronic endoscope device with increased noise resistance. An electronic endoscope includes a connector that is connected to a processor device, and transmission and reception of electric power and signals are performed between the connector and the processor device. In the connector, an input and output portion for transmission and reception of electric power and signals is insulated from the processor device, and only a contact portion connected to a ground of the electronic endoscope is electrically connected to a ground of the processor device.

Claims (21)

1. An electronic endoscope, comprising:

a connector that is connected to a processor device, the connector performing transmission and reception of electric power and signals to and from the processor device,

wherein, in the connector, an input and output portion for the transmission and reception of electric power and signals is insulated from the processor device, and only a contact portion connected to a ground of the electronic endoscope is electrically connected to a ground of the processor device,

wherein the input and output portion includes a coil that transmits electric power using electromagnetic induction and a light receiving element and a light emitting element that transmits signals using light communication, and performs transmission and reception of electric power and signals in the state of being insulated from the processor device,

wherein the connector includes a fitting portion protruding from the connector on which the contact portion is provided and covers an outer curved circumferential surface of the fitting portion that fits to the processor device and is covered by the processor device.

2. An electronic endoscope device, comprising:

the electronic endoscope according to claim 1 ; and

a processor device to which the connector of the electronic endoscope is connected, the processor device performing transmission and reception of electric power and signals to and from the connector.

3. The electronic endoscope device according to claim 2 ,

wherein the contact portion of the connector and a ground of the processor device electrically connected to the contact portion are electrically connected to each other by capacitive coupling in an AC manner.

4. The electronic endoscope device according to claim 3 ,

wherein the processor device includes an input and output portion that transmits and receives electric power and signals to and from the input and output portion of the electronic endoscope and a circuit portion that generates the electric power and processes the signal, and

a ground of the input and output portion and a ground of the circuit portion are common.

5. The electronic endoscope according to claim 1 ,

wherein the fitting portion is formed in a protruding shape and is provided at a center part of the connector.

6. The electronic endoscope according to claim 1 ,

wherein the coil and the light receiving element or the light emitting element are provided on the sides opposite to each other with the contact portion interposed therebetween.

7. The electronic endoscope device according to claim 2 ,

wherein the processor device includes an input and output portion that transmits and receives electric power and signals to and from the input and output portion of the electronic endoscope and a circuit portion that generates the electric power and processes the signal, and

a ground of the input and output portion and a ground of the circuit portion are common.

8. The electronic endoscope according to claim 1 , wherein the connector includes the fitting portion protruding from the connector on which the contact portion is provided and covers the outer curved circumferential surface of the fitting portion to increase a contact area of the ground of the electronic endoscope and the ground of the processor device to connect to each other.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 19, 2015
From: NARITA, SATOSHI
To: FUJIFILM CORPORATION
Reel/Frame 034988/0677 →
Priority Claims (1)
JP 2014-066321 · Mar 27, 2014 · national
Continuity (1)
Related Publication 20150272426A1 · Oct 1, 2015