Memory device with combined non-volatile memory (NVM) and volatile memory
View Patent ↗The present disclosure provides embodiments for methods and memory devices. One embodiment of a memory device includes a first volatile memory cell having a first volatile access transistor with a current electrode coupled with a first volatile bit line; a first non-volatile memory cell having a first non-volatile access transistor with a current electrode coupled with a first non-volatile bit line; and a transfer circuit coupled between the first volatile bit line and the first non-volatile bit line. The transfer circuit is configured to: couple data latched from the first volatile bit line with the first non-volatile bit line during a store operation, and couple the first volatile bit line with the first non-volatile bit line during a restore operation.
1. A memory device comprising:
a first volatile memory cell having
a first volatile access transistor with a current electrode coupled with a first volatile bit line;
a first non-volatile memory cell having
a first non-volatile access transistor with a current electrode coupled with a first non-volatile bit line; and
a transfer circuit coupled between the first volatile bit line and the first non-volatile bit line, wherein
the transfer circuit comprises a latch device coupled between the first volatile bit line and a connective device, the latch device is configured to latch data from the first volatile bit line, and the transfer circuit is configured to:
couple data latched from the first volatile bit line with the first non-volatile bit line during a store operation, and
couple the first volatile bit line with the first non-volatile bit line during a restore operation,
couple data latched from the first volatile bit line with the first non-volatile bit line during the store operation via the connective device having a control electrode coupled to a store signal.
2. The memory device of claim 1 , wherein the transfer circuit is configured to couple the first volatile bit line with the first non-volatile bit line during the restore operation via a connective device having a control electrode coupled to a restore signal.
3. The memory device of claim 1 , wherein the transfer circuit further comprises a level shifter coupled between the latch device and the connective device, the level shifter configured to output a shifted voltage in response to an input voltage of the level shifter.
4. The memory device of claim 1 , wherein the first volatile memory cell further comprises a second volatile access transistor with a current electrode coupled with a second volatile bit line, and the second volatile bit line is complementary to the first volatile bit line.
5. The memory device of claim 4 , wherein the first non-volatile memory cell further comprises a second non-volatile access transistor with a current electrode coupled with a second non-volatile bit line.
6. The memory device of claim 5 , wherein
the first non-volatile memory cell further comprises
a first resistive element coupled between the first non-volatile access transistor and the first non-volatile bit line, and
a second resistive element coupled between the second non-volatile access transistor and the second non-volatile bit line, and
the first resistive element is configured to store a first resistive state and the second resistive element is configured to store a second resistive state that is complementary to the first resistive state.
7. The memory device of claim 5 , wherein
the transfer circuit is further coupled between the second volatile bit line and the second non-volatile bit line, and
the transfer circuit is further configured to
couple data latched from the second volatile bit line with the second non-volatile bit line during the store operation, and
couple the second volatile bit line with the second non-volatile bit line during the restore operation.
8. The memory device of claim 1 , wherein the first non-volatile memory cell further comprises a resistive element coupled between the first non-volatile access transistor and the first non-volatile bit line, the resistive element configured to store a resistive state.
9. The memory device of claim 1 , wherein
the memory device further comprises:
a second volatile memory cell having
a second volatile access transistor with a current electrode coupled with a second volatile bit line;
a second non-volatile memory cell having
a second non-volatile access transistor with a second current electrode coupled with a second non-volatile bit line, wherein
a control electrode of the first non-volatile access transistor and a control electrode of the second non-volatile access transistor are coupled to a same non-volatile word line; and
a second transfer circuit is coupled between the second volatile bit line and the second non-volatile bit line.
10. The memory device of claim 9 , wherein
the first volatile memory cell and the second volatile memory cell are located in a same volatile memory cell array.
11. The memory device of claim 9 , wherein
the first volatile memory cell and the second volatile memory cell are located in different volatile memory cell arrays.
12. A memory device comprising:
a first volatile memory array having a plurality of volatile memory cells arranged in a plurality of rows of volatile memory cells;
a first non-volatile memory array having a plurality of non-volatile memory cells arranged in a plurality of rows of non-volatile memory cells; and
a first transfer system coupled between the first volatile memory array and the first non-volatile memory array, the first transfer system having a first row of transfer circuits that each include a latch device coupled between a respective volatile bit line and a respective non-volatile bit line, wherein
each volatile memory cell in a first row of volatile memory cells of the first volatile memory array is coupled with a respective transfer circuit in the first row of transfer circuits of the first transfer system,
each transfer circuit in the first row of transfer circuits is coupled with a respective non-volatile memory cell in a first row of non-volatile memory cells of the first non-volatile memory array,
the first row of transfer circuits is configured to couple data latched from the first row of volatile memory cells with the first row of non-volatile memory cells in response to a combination of a selection of a first volatile word line coupled to the first row of volatile memory cells, a selection of a first non-volatile word line coupled to the first row of non-volatile memory cells, and a selection of a first store signal line coupled to the first row of transfer circuits, and
the first row of transfer circuits is further configured to couple the first row of volatile memory cells with the first row of non-volatile memory cells in response to a combination of the selection of the first volatile word line, the selection of the first non-volatile word line, and a selection of a first restore signal line coupled to the first row of transfer circuits.
13. The memory device of claim 12 , further comprising:
a second volatile memory array having another plurality of rows of volatile memory cells; and
a second transfer system coupled between the second volatile memory array and the first non-volatile memory array, the second transfer system having a second row of transfer circuits that each include a first latch device coupled between a respective volatile bit line and a respective non-volatile bit line and a second latch device coupled between a respective complementary volatile bit line and a respective complementary non-volatile bit line, wherein
each volatile memory cell in a second row of volatile memory cells of the second volatile memory array is coupled with a respective transfer circuit in the second row of transfer circuits of the second transfer system,
the first row of non-volatile memory cells in the first non-volatile memory array includes a first set of non-volatile memory cells and a second set of non-volatile memory cells,
each transfer circuit in the first row of transfer circuits of the first transfer system is coupled with a respective non-volatile memory cell in the first set of non-volatile memory cells, and
each transfer circuit in the second row of transfer circuits of the second transfer system is coupled with a respective non-volatile memory cell in the second set of non-volatile memory cells.
14. The memory device of claim 13 , wherein:
the second row of transfer circuits is configured to couple data latched from the second row of volatile memory cells with the second set of non-volatile memory cells in response to a combination of a selection of a second volatile word line coupled to the second row of volatile memory cells, a selection of the first non-volatile word line coupled to the first row of non-volatile memory cells, and a selection of a second store signal line coupled to the second row of transfer circuits, and
the second row of transfer circuits is further configured to couple the second row of volatile memory cells with the second set of non-volatile memory cells in response to a combination of the selection of the second volatile word line, the selection of the first non-volatile word line, and a selection of a second restore signal line coupled to the second row of transfer circuits.
15. The memory device of claim 13 , wherein:
each volatile memory cell of the first row of volatile memory cells is coupled with the respective volatile bit line and the respective complementary volatile bit line,
each transfer circuit of the first row of transfer circuits is configured to couple the respective volatile bit line with the respective non-volatile bit line via a first connective device having a control electrode coupled to the first restore signal line,
each transfer circuit of the first row of transfer circuits is further configured to couple the respective complementary volatile bit line with a reference resistive element via a second connective device having a control electrode coupled to the first restore signal line,
each non-volatile memory cell of the first row of non-volatile memory cells includes a resistive element configured to store one of a low resistive state value and a high resistive state value, and
the reference resistive element is configured to store a resistive state value between the low resistive state value and the high resistive state value.
16. The memory device of claim 12 , wherein:
the plurality of volatile memory cells are further arranged in a plurality of columns of volatile memory cells,
the plurality of non-volatile memory cells are further arranged in a plurality of columns of non-volatile memory cells,
each volatile memory cell in a first column of the plurality of columns of volatile memory cells is coupled with a first transfer circuit in the first row of transfer circuits, and
each non-volatile memory cell in a first column of the plurality of columns of non-volatile memory cells is coupled with the first transfer circuit.
17. A method comprising:
during a store operation performed by a transfer circuit coupled between a volatile memory cell and a non-volatile memory cell:
enabling a latch to store first data of the volatile memory cell,
coupling the latch with the non-volatile memory cell, and
programming the non-volatile memory cell to store the first data; and
during a restore operation performed by the transfer circuit:
coupling the non-volatile memory cell with the volatile memory cell, wherein
the non-volatile memory cell stores second data, and
the coupling the non-volatile memory cell with the volatile memory cell results in the volatile memory cell storing the second data;
wherein
a level shifter is coupled between the latch and the non-volatile memory cell,
the level shifter is configured to output a voltage in proportion to the first data stored in the latch, and
the programming the non-volatile memory cell to store the first data comprises:
utilizing the voltage to program a resistive element of the first non-volatile memory cell to store a resistive state corresponding to the first data.