IP Library Granted Patent US 10,269,429
Granted Patent B2
US 10,269,429 · App. 14/626,540 · Granted Apr 23, 2019

Architecture for 3-D NAND memory

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Quick Facts
Patent No.
US 10,269,429
App. No.
14/626,540
Granted
Apr 23, 2019
Kind
B2
Abstract

Apparatuses are described that include stacked arrays of memory cell strings and their methods of operation. Apparatuses include architectures that reduce the use of several common components, allowing greater device density and smaller device size for a given semiconductor area.

Claims (9)

1. An apparatus, comprising:

a plurality of stacked memory arrays, including a first array of memory cell strings and a second array of memory cell strings stacked on top of the first array;

a data plate associated with multiple rows of memory cell strings of at least one of the plurality of stacked memory arrays; and

for each of the memory cell strings associated with the data plate, a plurality of select gates coupled between a memory cell region of the memory cell string and the data plate,

wherein the plurality of select gates includes a first select gate to select a respective row of blocks, wherein a block in the respective row of blocks includes a memory cell string from the first array and a memory cell string from the second array, wherein the data plate is located between the first array and the second array and shared by all of the memory cell strings in the first array and the second array, and wherein the memory cell strings are vertically aligned with a vertical axis of the plurality of stacked memory arrays.

2. The apparatus of claim 1 , wherein the memory cell strings include NAND memory cell strings.

3. The apparatus of claim 1 , wherein each of the memory cell strings includes a memory cell region, with a drain select gate disposed between the memory cell region and a data line to which the memory cell string is coupled.

4. The apparatus of claim 3 , wherein the drain select gate comprises a plurality of hierarchical select gates coupled between the memory cell region of the memory cell string and the data line to which the memory cell string is coupled.

5. The apparatus of claim 1 , wherein each of the memory cell strings includes a source select gate disposed between a memory cell region and a source to which the memory cell string is coupled.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →