Resistive switching memory with cell access by analog signal controlled transmission gate

1. A semiconductor memory device, comprising a plurality of resistive switching memory cells, wherein each resistive switching memory cell comprises:

a) a programmable impedance element having an anode and a cathode;

b) a word line pair configured to control access to the programmable impedance element, wherein the word line pair comprises first and second word lines;

c) a word line driver configured to independently control the first and second word lines;

d) a PMOS transistor having a first source/drain terminal coupled to the cathode, a second source/drain terminal coupled to a bit line, and a gate coupled to the first word line; and

e) an NMOS transistor having a first source/drain terminal coupled to the bit line, a second source/drain terminal coupled to the cathode, and a gate coupled to the second word line, wherein the programmable impedance element is configured to be accessed when a first voltage across the first source/drain terminal and the gate of the PMOS transistor reaches a predetermined value greater than a threshold voltage of the PMOS transistor, or a second voltage across the gate and the first source/drain terminal of the NMOS transistor reaches the predetermined value greater than a threshold voltage of the NMOS transistor.

2. The semiconductor memory device of claim 1 , wherein the first and second word lines are substantially mirror image waveforms.

3. The semiconductor memory device of claim 1 , wherein the first and second voltages reach the predetermined value greater than a corresponding threshold voltage at substantially a same time.

4. The semiconductor memory device of claim 1 , wherein the plurality of resistive switching memory cells are coupled together by the anode.

5. The semiconductor memory device of claim 1 , wherein each of the PMOS transistor and the NMOS transistor comprises FinFET devices.

6. The semiconductor memory device of claim 1 , wherein the programmable impedance element comprises:

a) an inert electrode coupled to a first side of a solid electrolyte;

b) an active electrode coupled to a second side of the solid electrolyte, wherein the programmable impedance element is programmed by formation of a conductive path between the active and inert electrodes; and

c) a plurality of mobile elements derived from the active electrode, wherein the plurality of mobile elements are reduced in the solid electrolyte to form the conductive path.

7. The semiconductor memory device of claim 6 , wherein the conductive path in the programmable impedance element is formed by application of a first voltage across the active and inert electrodes, the conductive path remaining once formed after the first voltage is removed.

8. The semiconductor memory device of claim 6 , wherein at least a portion of the conductive path is dissolved to erase the programmable impedance element by application of a second voltage across the active and inert electrodes.

9. A semiconductor memory device, comprising a plurality of resistive switching memory cells, wherein each resistive switching memory cell comprises:

a) a programmable impedance element having an anode and a cathode;

b) a word line pair configured to control access to the programmable impedance element, wherein the word line pair comprises first and second word lines;

c) a word line driver configured to independently control the first and second word lines;

d) a PMOS transistor having a first source/drain terminal coupled to a bit line, a second source/drain terminal coupled to the anode, and a gate coupled to the first word line; and

e) an NMOS transistor having a first source/drain terminal coupled to the bit line, a second source/drain terminal coupled to the anode, and a gate coupled to the second word line, wherein the programmable impedance element is configured to be accessed when a first voltage across the first source/drain terminal and the gate of the PMOS transistor reaches a predetermined value greater than a threshold voltage of the PMOS transistor, or a second voltage across the gate and the second source/drain terminal of the NMOS transistor reaches the predetermined value greater than a threshold voltage of the NMOS transistor.

10. The semiconductor memory device of claim 9 , wherein the first and second word lines are substantially mirror image waveforms.

11. The semiconductor memory device of claim 9 , wherein the first and second voltages reach the predetermined value greater than a corresponding threshold voltage at substantially a same time.

12. The semiconductor memory device of claim 9 , wherein the plurality of resistive switching memory cells are coupled together by the cathode.

13. The semiconductor memory device of claim 9 , wherein each of the PMOS transistor and the NMOS transistor comprises FinFET devices.

14. The semiconductor memory device of claim 9 , wherein the programmable impedance element comprises:

a) an inert electrode coupled to a first side of a solid electrolyte;

b) an active electrode coupled to a second side of the solid electrolyte, wherein the programmable impedance element is programmed by formation of a conductive path between the active and inert electrodes; and

c) a plurality of mobile elements derived from the active electrode, wherein the plurality of mobile elements are reduced in the solid electrolyte to form the conductive path.

15. The semiconductor memory device of claim 14 , wherein the conductive path in the programmable impedance element is formed by application of a first voltage across the active and inert electrodes, the conductive path remaining once formed after the first voltage is removed.

16. The semiconductor memory device of claim 14 , wherein at least a portion of the conductive path is dissolved to erase the programmable impedance element by application of a second voltage across the active and inert electrodes.