Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
A technique includes forming a film containing a first element, a second element, and carbon on a substrate by performing a cycle a predetermined number of times. The cycle includes non-simultaneously performing: forming a first solid layer containing the first element and carbon, and having a thickness of more than one atomic layer and equal to or less than several atomic layers, by supplying a precursor gas having a chemical bond of the first element and carbon to the substrate and confining the precursor gas within the process chamber, under a condition in which the precursor gas is autolyzed and at least a part of the chemical bond of the first element and carbon is maintained without being broken; and forming a second solid layer by supplying a reaction gas containing the second element to the substrate to modify the first solid layer.
1. A method of manufacturing a semiconductor device, comprising forming a film containing a first element, a second element, and carbon on a substrate by performing a cycle a predetermined number of times, wherein the cycle includes non-simultaneously performing:
forming a first solid layer containing the first element and carbon, and having a thickness of more than one atomic layer and equal to or less than several atomic layers, by supplying a precursor gas having a chemical bond of the first element and carbon, to the substrate in a process chamber and confining the precursor gas within the process chamber, under a condition in which the precursor gas is autolyzed and at least a part of the chemical bond of the first element and carbon included in the precursor gas is maintained without being broken;
exhausting the precursor gas in the process chamber through an exhaust system;
forming a second solid layer containing the first element, the carbon and the second element by supplying a first reaction gas containing the second element to the substrate in the process chamber and confining the first reaction gas within the process chamber to modify the first solid layer; and
exhausting the first reaction gas in the process chamber through the exhaust system,
wherein in the act of forming the second solid layer, the exhaust system is sealed.
2. The method of claim 1 , wherein in the act of forming the first solid layer, the exhaust system is closed.
3. The method of claim 1 , wherein in the act of forming the first solid layer, the exhaust system is sealed.
4. The method of claim 1 , wherein in the act of forming the first solid layer, an exhaust flow path of the exhaust system is fully closed.
5. The method of claim 1 , wherein in the act of forming the first solid layer, an exhaust flow path opening/closing unit installed in the exhaust system is fully closed.
6. The method of claim 1 , wherein in the act of forming the first solid layer, at least a part of the chemical bond of the first element and carbon included in the precursor gas is introduced into the first solid layer while the at least a part of the chemical bond of the first element and carbon is maintained without being broken.
7. The method of claim 1 , wherein the first solid layer is a deposition layer in which the first element and carbon are deposited.
8. The method of claim 1 , wherein a thickness of the first solid layer is greater than a thickness of a chemisorption layer which is formed by a chemisorption of the precursor gas being saturated.
9. The method of claim 1 , wherein the act of forming the first solid layer is performed under a condition in which a CVD reaction occurs.
10. The method of claim 1 , wherein the act of forming the first solid layer is performed under a condition in which a gas phase reaction occurs.
11. The method of claim 1 , wherein, in the act of forming the second solid layer, the first reaction gas is supplied to the substrate in the process chamber, under a condition in which at least a part of the chemical bond of the first element and carbon included in the first solid layer is maintained without being broken.
12. The method of claim 1 , wherein the cycle further includes performing:
supplying a second reaction gas containing a third element to the substrate in the process chamber; and
exhausting the second reaction gas in the process chamber through the exhaust system,
wherein the cycle is performed a predetermined number of times to form a film containing the first element, the second element, the third element and carbon on the substrate.
13. The method of claim 1 , wherein the cycle further includes non-simultaneously performing:
forming a third solid layer by supplying a second reaction gas containing a third element to the substrate in the process chamber to modify the second solid layer; and
exhausting the second reaction gas in the process chamber through the exhaust system,
wherein the cycle is performed a predetermined number of times to form a film containing the first element, the second element, the third element and carbon.
14. The method of claim 1 , wherein the precursor gas contains the first element, carbon, and a halogen element.
15. The method of claim 1 , wherein the precursor gas has at least two chemical bonds of the first element and carbon in one molecule of the precursor gas.
16. The method of claim 1 , wherein the first reaction gas comprises at least one selected from a group consisting of a nitrogen-containing gas, a carbon-containing gas, a nitrogen- and carbon-containing gas, an oxygen-containing gas, a boron-containing gas, and a boron-, nitrogen- and carbon-containing gas.
17. The method of claim 1 , wherein the cycle is performed a predetermined number of times under a non-plasma condition.
18. A non-transitory computer-readable recording medium storing a program that causes a computer to perform a process of forming a film containing a first element, a second element, and carbon on a substrate by performing a cycle a predetermined number of times, wherein the cycle includes non-simultaneously performing:
forming a first solid layer containing the first element and carbon, and having a thickness of more than one atomic layer and equal to or less than several atomic layers, by supplying a precursor gas having a chemical bond of the first element and carbon to the substrate in a process chamber and confining the precursor gas within the process chamber, under a condition in which the precursor gas is autolyzed and at least a part of the chemical bond of the first element and carbon included in the precursor gas is maintained without being broken;
exhausting the precursor gas in the process chamber through an exhaust system;
forming a second solid layer by supplying a reaction gas containing the second element and confining the first reaction gas within the process chamber to the substrate in the process chamber to modify the first solid layer; and
exhausting the reaction gas in the process chamber through the exhaust system,
wherein in the act of forming the second solid layer, the exhaust system is sealed.
19. The method of claim 1 , wherein the first reaction gas includes carbon.