IP Library › Granted Patent US 9,942,502
Granted Patent B2
US 9,942,502 · App. 14/633,552 · Granted Apr 10, 2018

Imaging sensor with in-pixel amplification

Inventor: Jonathan Borremans (Lier, BE)
Assignee: IMEC vzw
H04N5/378H04N5/355H04N5/363H04N5/3745H04N5/37452
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Quick Facts
Patent No.
US 9,942,502
App. No.
14/633,552
Granted
Apr 10, 2018
Kind
B2
Abstract

A pixel architecture having an in-pixel amplifier comprising an NMOS transistor and a depletion-mode NMOS load is disclosed. In one aspect, the pixel architecture comprises a pixel core including a pixel photodiode for generating an output signal in accordance with incident light. Further, the in-pixel amplifier is connected to a pixel core to amplify the output signal before it is stored in a column buffer before being read out at output of the pixel architecture. By having an in-pixel amplifier that can be used for amplification of the output signal inside the pixel architecture, a larger output value is obtained which may be stored inside the pixel architecture on a small capacitor with improved signal-to-noise performance. This in-pixel amplification can also improve the quality of stored signals for global shutter operation.

Claims (14)

1. A pixel architecture comprising:

a photodiode element operable for generating a signal;

an in-pixel amplifier configured to amplify the generated signal and having a gain greater than one, the in-pixel amplifier comprising an NMOS amplifier with a depletion-mode NMOS load transistor, wherein the depletion-mode NMOS load transistor functions as a load of the NMOS amplifier;

an output for outputting the amplified signal.

2. The pixel architecture according to claim 1 , further comprising at least one storage element connected to the in-pixel amplifier for storing the amplified signal.

3. The pixel architecture according to claim 1 , further comprising a plurality of storage elements connected to the in-pixel amplifier for storing the amplified signal, wherein one of the storage elements is provided for storing the amplified signal for each frame of a plurality of imaging frames, the storage elements being connected in parallel to the in-pixel amplifier and to the output.

4. The pixel architecture according to claim 1 , further comprising a column buffer connected to the output, the column buffer including at least one transistor for reading out signals for the output.

5. The pixel architecture according to claim 1 , wherein the photodiode element forms part of a pixel core, the pixel core including a floating diffusion region, a conversion capacitor, and at least one control transistor, the output from the pixel core forming an input for the in-pixel amplifier.

6. The pixel architecture according to claim 5 , wherein the in-pixel amplifier comprises an active amplifier forming part of a double sampling arrangement.

7. The pixel architecture according to claim 6 , wherein the double sampling arrangement comprises an input sampling capacitor connected to the pixel core and to the active amplifier, and a feedback capacitor connected between an input and an output of the active amplifier.

8. The pixel architecture according to claim 5 , wherein the at least one control transistor comprises a reset gate for resetting the photodiode element.

9. The pixel architecture according to claim 5 , wherein the at least one control transistor comprises a transfer gate for transferring the charge from the photodiode element to the floating diffusion region and a reset gate for resetting the photodiode element.

10. An imaging sensor comprising a plurality of pixels having a pixel architecture according to claim 1 .

11. The imaging sensor according to claim 10 , comprising a global shutter imaging sensor.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 31, 2015
From: BORREMANS, JONATHAN
To: IMEC VZW
Reel/Frame 035299/0214 →
Priority Claims (1)
EP 14161550 · Mar 25, 2014 · regional
Continuity (1)
Related Publication 20150312502A1 · Oct 29, 2015