Semiconductor device and method for fabricating the same
View Patent ↗A method for fabricating semiconductor device is disclosed. The method includes the steps of: providing a substrate having at least one fin-shaped structure thereon, wherein the fin-shaped structure comprises a top portion and a bottom portion; removing part of the bottom portion of the fin-shaped structure; forming an epitaxial layer on the substrate to surround the bottom portion of the fin-shaped structure; transforming the bottom portion of the fin-shaped structure into the epitaxial layer; and removing part of the epitaxial layer.
1. A semiconductor device, comprising:
a substrate having a NMOS region and a PMOS region thereon;
a first fin-shaped structure on the NMOS region of the substrate, wherein the first fin-shaped structure comprises a top portion and a bottom portion, the top portion and the bottom portion comprise different material, and one of the top portion or the bottom portion of the first fin-shaped structure comprises semiconductor material; and
a second fin-shaped structure on the PMOS region of the substrate, wherein the second fin-shaped structure comprises a top portion and a bottom portion, and the top portion and the bottom portion comprise different material.
2. The semiconductor device of claim 1 , wherein the top portion of the first fin-shaped structure and the bottom portion of the second fin-shaped structure comprise same material, and the bottom portion of the first fin-shaped structure and the top portion of the second fin-shaped structure comprise same material.
3. The semiconductor device of claim 1 , wherein the top portion of the first fin-shaped structure comprises silicon and the bottom portion of the first fin-shaped structure comprises silicon germanium.
4. The semiconductor device of claim 1 , wherein the top portion of the second fin-shaped structure comprises silicon germanium and the bottom portion of the second fin-shaped structure comprises silicon.