IP Library Granted Patent US 9,461,105
Granted Patent B2
US 9,461,105 · App. 14/636,311 · Granted Oct 4, 2016

Semiconductor device and a method of manufacturing the same

Inventors: Yoshiyuki Kawashima (Tokyo, JP); Koichi Toba (Tokyo, JP); Yasushi Ishii (Tokyo, JP); Toshikazu Matsui (Tokyo, JP); Takashi Hashimoto (Tokyo, JP)
Assignee: Renesas Electronics Corporation
H01L28/60H01L27/0629H01L27/0805H01L27/105H01L27/10805H01L27/11526H01L27/11531H01L28/40
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Quick Facts
Patent No.
US 9,461,105
App. No.
14/636,311
Granted
Oct 4, 2016
Kind
B2
Abstract

In connection with a semiconductor device including a capacitor element there is provided a technique capable of improving the reliability of the capacitor element. A capacitor element is formed in an element isolation region formed over a semiconductor substrate. The capacitor element includes a lower electrode and an upper electrode formed over the lower electrode through a capacitor insulating film. Basically, the lower electrode and the upper electrode are formed from polysilicon films and a cobalt silicide film formed over the surfaces of the polysilicon films. End portions of the cobalt silicide film formed over the upper electrode are spaced apart a distance from end portions of the upper electrode. Besides, end portions of the cobalt silicide film formed over the lower electrode are spaced apart a distance from boundaries between the upper electrode and the lower electrode.

Claims (10)

1. A semiconductor device comprising:

(a) a semiconductor substrate;

(b) an element isolation region formed over the semiconductor substrate; and

(c) a capacitor element formed over the element isolation region,

the capacitor element (c) including:

(c1) a lower electrode formed over the element isolation region;

(c2) a capacitor insulating film formed over the lower electrode; and

(c3) an upper electrode formed over the capacitor insulating film,

wherein the length of the upper electrode in a first direction is larger than that of the lower electrode in the direct direction, the length of the upper electrode in a second direction intersecting the first direction is smaller than that of the lower electrode in the second direction, the capacitor element is formed in a region where the upper electrode and the lower electrode overlap each other planarly, and

wherein, over a surface of the upper electrode, there exist a region where a metal silicide film is formed and a region where the metal silicide film is not formed, the metal silicide film-formed region comprising a region spaced apart from an end region of the upper electrode in the second direction and a region spaced apart from a stepped region of the upper electrode in the first direction.

Assignments (1)
CHANGE OF ADDRESS Recorded Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
Priority Claims (1)
JP 2007-267398 · Oct 15, 2007 · national
Continuity (5)
Continuation 13867213 · Apr 22, 2013
Continuation 13587008 · Aug 16, 2012
Division 13307424 · Nov 30, 2011
Division 12239807 · Sep 28, 2008
Related Publication 20150171160A1 · Jun 18, 2015