Active control for two-phase cooling
Methods and devices for active control for two-phase cooling include a cooling volume that has cavities and active coolant flow controls in the cavities configured to adjust coolant flow through the cavities. A reservoir in fluid communication with the cavities and there is a two-phase coolant in the reservoir and cavities. The two-phase coolant has a phase transition temperature between an ambient temperature and an expected device temperature. A coolant sensor is configured to determine a coolant phase condition in the cavities. A control module is configured to adjust the active coolant flow controls in response to the determined coolant phase condition.
1. A cooling device, comprising:
a cooling volume comprising:
cavities; and
active coolant flow controls in the cavities configured to adjust coolant flow through the cavities;
a reservoir in fluid communication with the cavities;
a two-phase coolant in the reservoir and the cavities, wherein the two-phase coolant has a phase transition temperature between an ambient temperature and an expected device temperature;
a capacitance sensor configured to measure a capacitance of the coolant in the cavities; and
a control module configured to determine a vapor quality and void fraction of the coolant based on the measured capacitance and to adjust the active coolant flow controls in response to the vapor quality and void fraction.
2. The cooling device of claim 1 , wherein the control module is configured to increase coolant flow if the determined vapor quality and void fraction indicate a dry-out condition.
3. The cooling device of claim 1 , wherein the reservoir comprises a liquid outlet and an inlet for a gas or a gas-liquid mixture.
4. The cooling device of claim 3 , further comprising a pump configured to pump liquid coolant from the reservoir into the cavities.
5. The cooling device of claim 4 , wherein the pump is embedded in the device.
6. The cooling device of claim 1 , wherein the cavities comprise a wicking material.
7. The cooling device of claim 1 , wherein the cooling device is a single, field-replaceable unit.