Method of manufacturing semiconductor device, and recording medium
A method of manufacturing a semiconductor device includes performing a cycle a predetermined number of times, the cycle including supplying a first precursor containing a specific element and a halogen group to form a first layer and supplying a second precursor containing the specific element and an amino group to modify the first layer into a second layer. A temperature of the substrate is set such that a ligand containing the amino group is separated from the specific element in the second precursor, the separated ligand reacts with the halogen group in the first layer to remove the halogen group from the first layer, the separated ligand is prevented from being bonded to the specific element in the first layer, and the specific element from which the ligand is separated in the second precursor is bonded to the specific element in the first layer.
1. A method of manufacturing a semiconductor device, the method comprising:
(a) forming a seed layer consisting of a specific element on a substrate by performing a cycle a predetermined number of times, the cycle comprising:
supplying a first precursor containing the specific element and a halogen group to the substrate to form a first layer containing the specific element and the halogen group; and
supplying a second precursor containing the specific element and an amino group to the substrate to modify the first layer to form a second layer, the second precursor containing one amino group in each molecule of the second precursor; and
(b) forming a thin film consisting of the specific element on the seed layer by supplying a third precursor containing the specific element and hydrogen,
wherein the seed layer and the thin film contain no carbon and nitrogen.
2. The method of claim 1 , wherein a temperature of the substrate is set to fall within a range of 300 to 450 degrees C. in the (a), and the temperature of the substrate is set to fall within a range of 350 to 700 degrees C. in the (b).
3. The method of claim 1 , wherein a temperature of the substrate is set to fall within a range of 350 to 450 degrees C. in the (a), and the temperature of the substrate is set to fall within a range of 350 to 700 degrees C. in the (b).
4. The method of claim 1 , wherein the thin film consisting of the specific element is formed by a chemical vapor deposition method.
5. The method of claim 1 , wherein the specific element comprises a semiconductor element or a metal element.
6. The method of claim 1 , wherein the specific element comprises silicon, and the thin film comprises a silicon film.
7. The method of claim 6 , wherein the second precursor comprises monoaminosilane.
8. The method of claim 7 , wherein the first precursor comprises chlorosilane.
9. The method of claim 8 , wherein the third precursor comprises an inorganic silane-based gas.
10. The method of claim 8 , wherein the third precursor comprises a silane-based gas containing no chlorine.
11. The method of claim 8 , wherein the third precursor comprises at least one selected from a group consisting of monosilane, disilane and trisilane.
12. A method of manufacturing a semiconductor device, the method comprising:
(a) forming a silicon seed layer on a substrate by performing a cycle a predetermined number of times, the cycle comprising:
supplying a first precursor containing silicon and a halogen group to the substrate to form a first layer containing the silicon and the halogen group; and
supplying a second precursor containing silicon and an amino group to the substrate to modify the first layer to form a second layer, the second precursor containing one amino group in each molecule of the second precursor; and
(b) forming a silicon film on the seed layer by supplying a third precursor containing silicon and hydrogen,
wherein the seed layer and the thin film contain no carbon and nitrogen.
13. The method of claim 12 , wherein a temperature of the substrate is set to fall within a range of 300 to 450 degrees C. in the (a), and the temperature of the substrate is set to fall within a range of 350 to 700 degrees C. in the (b).
14. The method of claim 12 , wherein a temperature of the substrate is set to fall within a range of 350 to 450 degrees C. in the (a), and the temperature of the substrate is set to fall within a range of 350 to 700 degrees C. in the (b).
15. A non-transitory computer-readable recording medium storing a program that causes a computer to perform:
(a) forming a seed layer consisting of a specific element on a substrate by performing a cycle a predetermined number of times, the cycle comprising:
supplying a first precursor containing the specific element and a halogen group to the substrate to form a first layer containing the specific element and the halogen group; and
supplying a second precursor containing the specific element and an amino group to the substrate to modify the first layer to form a second layer, the second precursor containing one amino group in each molecule of the second precursor; and
(b) forming a thin film consisting of the specific element on the seed layer by supplying a third precursor containing the specific element and hydrogen,
wherein the seed layer and the thin film contain no carbon and nitrogen.