Bilateral cooling type semiconductor laser system for medical beauty use
Disclosed is a bilateral cooling type semiconductor laser system for medical beauty use, the contact window of which can make direct contact with the skin. The bilateral cooling type semiconductor laser system for medical beauty use comprises a semiconductor laser array, an optical waveguide located on the front end of the light emitting surface of the semiconductor laser array, a transparent contact window abutting against the light outlet end of the optical waveguide, a pair of cooling blocks and a first water throughflow block. The first water throughflow block is divided into a basal part and a U-shaped head located above the basal part, and the middle part and back part of the optical waveguide are embedded in the U-type header. A fixed block is provided above the corresponding optical waveguide to press and fix the optical waveguide. There is still a space between the optical waveguide and the side wall of the U-type header. The pair of cooling blocks extends to the forepart of the optical waveguide and encircles the side wall of the contact window and the forepart of the optical waveguide. The system uses a unique cooling structure design, so that the temperature of the working end face which is in direct contact with the skin can be close to freezing point, and the system has a compact and stable structure.
1. A bilateral cooling type semiconductor laser system for medical beauty use, comprising:
a semiconductor laser array comprising a plurality of stacked semiconductor lasers,
an optical waveguide disposed in front of a light emitting surface of the semiconductor laser array,
a transparent contact window abutting against a light outlet end of the optical waveguide,
a pair of cooling blocks for conduction cooling of the contact window, and a first water throughflow block;
wherein,
the semiconductor laser array is disposed on the second water throughflow block and an insulating barrier is disposed therebetween;
the first water throughflow block comprises a base and a U-shaped head located on the base; middle and rear parts of the optical waveguide are embedded in the U-shaped head; a fixed block is disposed on a corresponding part of the optical waveguide to tightly press and fix the optical waveguide;
a gap is provided between the optical waveguide and side walls of the U-shaped head; a pair of thermoelectric coolers and a pair of cooling blocks are sequentially and symmetrically disposed at outer sides of the U-shaped head; the pair of cooling blocks extends to a forepart of the optical waveguide and encircles side walls of the contact window and the forepart of the optical waveguide.
2. The system of claim 1 , wherein a guide channel is provided on a surface of a base of the first water throughflow block to guide excess water to discharge.
3. The system of claim 1 , wherein the optical waveguide as a whole is a prism or a frustum of a prism.
4. The system of claim 1 , wherein the contact window is made of sapphire, K9 glass, quartz glass or diamond; the optical waveguide is made of sapphire, K9 glass, or diamond.
5. The system of claim 1 , wherein the contact window and the optical waveguide are an integrated structure of sapphire.
6. The system of claim 1 , wherein the contact window and foreparts of the cooling blocks present a boss structure as a whole.
7. The system of claim 1 , wherein liquid cooling channels of the first water throughflow block and the second water throughflow block are connected in series or are independent from each other.
8. The system of claim 1 , wherein the cooling blocks are made of copper, aluminum, iron, gold-plated copper, gold-plated aluminum, stainless steel or diamond.
9. The system of claim 1 , wherein the first water throughflow block and the second water throughflow block are made of copper, aluminum, stainless steel, hard anodized aluminum or plastic.
10. The system of claim 1 , wherein the semiconductor lasers each comprise bar chips packaged on a heat sink, and the heat sink is a micro-channel heat sink, a macro-channel heat sink or a metal block; the bar chips comprise a single luminous point or a plurality of luminous points.
11. The system of claim 1 , wherein a collimating lens is disposed in front of the semiconductor lasers for fast axis collimation or for fast and slow axis collimation simultaneously.
12. The system of claim 11 , wherein the optical waveguide is replaced by a pair of light barriers which are perpendicular to the slow axis and are plated with high-reflective films on inner sides thereof.
13. The system of claim 12 , wherein the light barriers are made of gold-plated copper or silver-plated copper.