Via for electrical contact passing through layers of optical waveguide in multilayer structure including electrical substrate and laminated layers of optical waveguide
A structure is formed which is prepared as a via for electrical contact passing through layers of an optical waveguide, in a multilayer structure including an electrical substrate and the laminated layers of the optical waveguide. The surface of an electrode pad is plated with solder. The layers of the optical waveguide are formed above the portion plated with solder are removed to expose the portion plated with solder. A device is prepared having both a light-emitter or photoreceptor in optical contact with the optical waveguide, and a stud (pillar). The stud (pillar) is inserted into the portion in which layers of the optical waveguide have been removed, and the plated solder is melted to bond the electrode pad on top of the electrical substrate to the tip of the inserted stud (pillar).
1. A method of forming a structure prepared as a via for electrical contact passing through layers of an optical waveguide in a multilayer structure including an electrical substrate and the laminated layers of the optical waveguide, the method comprising the steps of:
preparing a resist pattern above an electrode pad on top of the electrical substrate;
plating the surface of the electrode pad with solder in accordance with the resist pattern;
removing the prepared resist pattern;
forming the layers of the optical waveguide on top of the electrical substrate, covering the portion plated with solder; and
removing the layers of the optical waveguide above the portion plated with solder, exposing the portion plated with solder.
2. The method according to claim 1 further comprising the steps of:
preparing a device having both a light-emitter or photoreceptor in optical contact with the optical waveguide, and a stud (pillar) long enough to reach the electrode plated with solder on top of the electrical substrate;
inserting the stud (pillar) into the portion in which layers of the optical waveguide have been removed; and
melting the plated solder to bond the electrode pad on top of the electrical substrate to the tip of the inserted stud (pillar).
3. The method according to claim 1 , wherein the step of forming the layers of the optical waveguide on top of the electrical substrate, covering the portion plated with solder, is performed by forming a laminated optical waveguide (having a core interposed between an underclad layer and an overclad layer) on top of the electrical substrate.
4. The method according to claim 3 , wherein the laminated optical waveguide is configured so the layers of the optical waveguide above the portion plated with solder are removed beforehand, and the portion plated with solder remains exposed during lamination.
5. The method according to claim 1 , wherein the step of forming the layers of the optical waveguide on top of the electrical substrate, covering the portion plated with solder, is performed by laminating a photocurable resin.