Heat flow sensor

1. A heat flow sensor, comprising an active sensor element, which comprises thermoelectric materials of the n-type ( 3 ) and the p-type ( 4 ) in the form of columns forming thermopiles ( 3 , 4 ), wherein the columns are orientated in parallel with one another and normal to end faces of the active sensor element, wherein the columns of thermopiles ( 3 , 4 ) are embedded in a matrix ( 2 ) as a cladding material and the thermopiles ( 3 , 4 ) are electrically connected on end faces of the thermopile on a cold side and on a hot side by means of electrical connections ( 5 ) and the end faces of the active sensor element is provided on the cold side and on the hot side with a thermally conductive heat-conducting element wherein the active sensor element ( 1 ) is coated or clad with a thin, from 0.1 μm to 20 μm thick, electrically insulating, chemically inert and adhesive protective layer ( 6 ), wherein the sections of the matrix ( 2 ) facing the heat-conducting elements ( 8 , 9 ) and the connections ( 5 ) are covered by the adhesive protection layer and the active sensor element ( 1 ) thus has a reduced thermal invasiveness or reduced thermal resistance.

2. The heat flow sensor in accordance with claim 1 , wherein the heat-conducting elements ( 8 , 9 ) are adhesively bonded by means of an adhesive ( 15 ) on the protective layer ( 6 ) of the sensor element ( 1 ) at right angles to the heat flow ( 13 ).

3. The heat flow sensor in accordance with claim 2 , wherein the adhesive ( 15 ) is made of the same material as the thin protective layer.

4. The heat flow sensor in accordance with claim 2 , wherein the thickness of the adhesive protective layer amounts to 1 μm to 100 μm.

5. The heat flow sensor in accordance with claim 2 , wherein the thickness of the adhesive protective layer amounts to 5 μm to 30 μm.

6. The heat flow sensor n accordance with claim 1 , wherein the matrix ( 2 ) is a foil.

7. The heat flow sensor in accordance with claim 1 , wherein at least one thermopile is internally hollow.

8. The heat flow sensor in accordance with claim 7 , wherein the inner wall of the hollow thermopiles are coated with the thin protective layer with a thickness between 0.1 μm and 20 μm, or are completely filled with the material of the protective layer or another electrically insulating material.

9. The heat flow sensor in accordance with claim 1 , wherein the thickness of the protective layer ( 6 ) amounts to 0.1 to 10 μm.

10. The heat flow sensor in accordance with claim 1 , wherein the protective layer ( 6 ) is formed from a protective lacquer, an epoxide, a silicone, or ceramic.

11. The heat flow sensor in accordance with claim 1 , wherein the heat-conducting element ( 8 , 9 ) is made of Cu, Au, Pd, Al, Sb, steel or another metal or is formed from ceramic or graphite or is a combination of these materials.

12. The heat flow sensor in accordance with claim 1 , wherein the heat-conducting element is coated with a functional layer ( 18 ), which absorbs electromagnetic radiation in the wavelength range from 0.1 μm to 10.6 μm.

13. The heat flow sensor in accordance with claim 12 , in which the functional layer ( 18 ) is made of antibodies.

14. The heat flow sensor in accordance with claim 13 , wherein the functional layer ( 18 ) strongly absorbs electromagnetic radiation in the wavelength range from 0.1 μm to 0.4 μm.

15. The heat flow sensor in accordance with claim 1 , wherein the heat-conducting element is coated with a functional layer ( 18 ), which is made of biomolecules or biocells.

16. The heat flow sensor in accordance with claim 1 , wherein the heat-conducting element ( 8 , 9 ) is configured such that it projects beyond the dimensions of the sensor element ( 1 ).

17. The heat flow sensor in accordance with claim 1 , wherein the heat-conducting element ( 8 , 9 ) is divided into surface segments.

18. The heat flow sensor in accordance with claim 1 , wherein the thickness of the protective layer ( 6 ) is 0.1 μm to 7 μm.