Fabricating thin-film optoelectronic devices with added potassium
A method ( 200 ) and deposition zone apparatus ( 300 ) for fabricating thin-film optoelectronic devices ( 100 ), the method comprising: providing a potassium-nondiffusing substrate ( 110 ), forming a back-contact layer ( 120 ); forming at least one absorber layer ( 130 ) made of an ABC chalcogenide material, adding at least two different alkali metals, and forming at least one front-contact layer ( 150 ) wherein one of said at least two different alkali metals is potassium and where, following forming said front-contact layer, in the interval of layers ( 470 ) from back-contact layer ( 120 ), exclusive, to front-contact layer ( 150 ), inclusive, the comprised amounts resulting from adding at least two different alkali metals are, for potassium, in the range of 500 to 10000 ppm and, for the other of said at least two different alkali metals, in the range of 5 to 2000 ppm and at most ½ and at least 1/2000 of the comprised amount of potassium. The method ( 200 ) and apparatus ( 300 ) are advantageous for more environmentally-friendly production of photovoltaic devices ( 100 ) on flexible substrates with high photovoltaic conversion efficiency and faster production rate.
1. A method of fabricating thin-film optoelectronic devices, comprising:
forming a back-contact layer over a substrate;
forming an absorber layer over the back-contact layer, wherein the absorber layer comprises a chalcogenide material;
adding at least two different alkali metals to the absorber layer;
forming a buffer layer comprising potassium (K) over the absorber layer; and
forming a front-contact layer over the buffer layer, wherein one of the at least two different alkali metals added to the absorber layer comprises a first alkali metal comprising potassium (K).
2. The method according to claim 1 , wherein in the absorber layer comprises a plurality of absorber films that each comprise an amount of potassium in a range of 1000 to 2000 ppm.
3. The method according to claim 1 , wherein the at least two different alkali metals further comprise a second alkali metal that comprises sodium (Na) that has a concentration in the absorber layer in a range of 5 to 500 ppm.
4. The method according to claim 3 , wherein an atomic ratio of K/Na in the absorber layer is in a range of 2 to 2000.
5. The method according to claim 4 , wherein the atomic ratio of K/Na in the absorber layer is in a range of 10 to 100.
6. The method according to claim 1 , wherein forming the absorber layer comprises depositing the absorber layer using a physical vapor deposition process at a substrate temperature in a range of 100° C. to 500° C.
7. The method according to claim 1 , wherein the absorber layer comprises Cu(In,Ga)Se 2 .
8. The method according to claim 1 , wherein adding the at least two different alkali metals comprises separately adding the at least two different alkali metals.
9. The method according to claim 1 , wherein adding the at least two different alkali metals comprises exposing the absorber layer to a vapor comprising potassium fluoride (KF) at a substrate temperature in the range of 300° C. to 400° C.
10. The method according to claim 1 , wherein adding the at least two different alkali metals is performed while a vapor of at least one element selected from a group consisting of sulfur (S), selenium (Se), and tellurium (Te) is present.
11. The method according to claim 1 , wherein the at least two different alkali metals further comprise sodium (Na), and adding at least two different alkali metals comprises exposing the absorber layer to sodium fluoride (NaF) and potassium fluoride (KF) in the presence of a vapor of selenium (Se).
12. The method according to claim 1 , wherein the buffer layer comprises a material selected from a group consisting of cadmium sulfide (CdS), zinc oxides, zinc sulfides, Zn(O,S), indium sulfides and indium selenides, or variations thereof.
13. The method according to claim 1 , further comprising forming an intermediary layer between the buffer layer and the absorber layer, wherein the intermediary layer consists essentially of one or more of potassium (K) and selenium (Se).
14. The method according to claim 1 , further comprising adding at least two alkali metals to the buffer layer.
15. The method according to claim 1 , further comprising forming an additional layer comprising potassium between the buffer layer and the front contact layer.
16. A method of fabricating thin-film optoelectronic devices, comprising:
forming an absorber layer on a surface of a substrate assembly, wherein
the substrate assembly comprises a substrate and a back-contact layer that is disposed over a surface of the substrate,
the absorber layer comprises a chalcogenide material, and is disposed on the back-contact layer, and
the materials used to form the substrate assembly do not contain potassium (K) or sodium (Na);
forming a buffer layer over the absorber layer, wherein the formed buffer layer comprises an alkali metal; and
forming a front-contact layer over the buffer layer.
17. The method according to claim 16 , wherein the buffer layer comprises cadmium (Cd).
18. The method according to claim 17 , wherein the alkali metal comprises potassium (K).
19. A method of fabricating thin-film optoelectronic devices, comprising:
forming a back-contact layer over a substrate;
forming an absorber layer over the back-contact layer, wherein the absorber layer comprises a chalcogenide material including one or more of copper, indium, and gallium;
forming a buffer layer over the absorber layer;
forming an intermediary layer between the absorber layer and the buffer layer, wherein the intermediary layer consists essentially of selenium (Se) and one or more alkali metals; and
forming a front-contact layer over the buffer layer.
20. The method of claim 19 , wherein forming the intermediary layer comprises a vapor deposition process of a potassium fluoride (KF).
21. The method of claim 20 , wherein the vapor deposition process is performed in a presence of a selenium (Se) vapor.