IP Library Granted Patent US 9,610,794
Granted Patent B2
US 9,610,794 · App. 14/655,697 · Granted Apr 4, 2017

Thermal transfer film, and organic electroluminescent device prepared using same

Inventors: Se Hyun Park (Uiwang-si, KR); Kyoung Ku Kang (Uiwang-si, KR); Jung Hyo Lee (Uiwang-si, KR); Min Hye Kim (Uiwang-si, KR); Sung Han Kim (Uiwang-si, KR); Si Kyun Park (Uiwang-si, KR); Eun Su Lee (Uiwang-si, KR); Seong Heun Cho (Uiwang-si, KR); Jin Hee Choi (Uiwang-si, KR)
Assignee: SAMSUNG SDI CO., LTD.
B41M5/42B41M5/38207B41M5/38214H01L51/0013B41M2205/30B41M2205/34B41M2205/36B41M2205/38B41M2205/40H01L51/5012
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Quick Facts
Patent No.
US 9,610,794
App. No.
14/655,697
Granted
Apr 4, 2017
Kind
B2
Abstract

The present invention relates to a thermal transfer film and to an organic electroluminescent device prepared using same, wherein the thermal transfer film includes a base film and an outermost layer which is formed on the base film and has 2% or more of a thickness change ratio expressed by formula 1.

Claims (29)

1. A thermal transfer film comprising:

a base film; and

an outermost layer formed on the base film,

wherein the outermost layer has a thickness change rate of about 0.5% or more, as calculated according to Equation 1:

Thickness change rate (%)=( T 2− T 1)/ T 1×100,  <Equation 1>

(wherein Equation 1, T 1 is an initial thickness of the outermost layer,

T 2 is a maximum thickness of the outermost layer, as measured within a temperature range from 25° C. to 170° C. while the thermal transfer film is heated at a heating rate of 5° C./min from a starting temperature of 25° C. to a final temperature of 170° C.).

2. The thermal transfer film according to claim 1 , wherein the outermost layer is a light-to-heat conversion layer, and

the thermal transfer film comprises the base film and the light-to-heat conversion layer formed on the base film.

3. The thermal transfer film according to claim 2 , wherein the light-to-heat conversion layer has a coefficient of thermal expansion of about 100 μm/m·° C. or more, as measured after the light-to-heat conversion layer is heated at a heating rate of 5° C./min from a starting temperature of 25° C. to a final temperature of 170° C.

4. The thermal transfer film according to claim 2 , wherein the light-to-heat conversion layer comprises a cured product of a composition, the composition comprising a polyalkyl (meth)acrylate or (meth)acrylate resin, having a weight average molecular weight from about 15,000 g/mol to about 70,000 g/mol.

5. The thermal transfer film according to claim 4 , wherein the polyalkyl (meth)acrylate or (meth)acrylate resin has a glass transition temperature (Tg) from about 35° C. to about 100° C.

6. The thermal transfer film according to claim 4 , wherein the composition further comprises a UV curable resin, a polyfunctional monomer, a light-to-heat conversion material, and an initiator.

7. The thermal transfer film according to claim 6 , wherein the light-to-heat conversion material comprises at least one of carbon black and tungsten oxide particles.

8. The thermal transfer film according to claim 1 , comprising the base film, a light-to-heat conversion layer, and the outermost layer sequentially stacked thereon in this order.

9. The thermal transfer film according to claim 8 , wherein the outermost layer has a coefficient of thermal expansion of about 100 μm/m·° C. or more, as measured after the outermost layer is heated at a heating rate of 5° C./min from a starting temperature of 25° C. to a final temperature of 170° C.

10. The thermal transfer film according to claim 8 , wherein the outermost layer comprises a cured product of a composition, the composition comprising a polyalkyl (meth)acrylate or (meth)acrylate resin, having a weight average molecular weight (Mw) from about 15,000 g/mol to about 70,000 g/mol.

11. The thermal transfer film according to claim 10 , wherein the polyalkyl (meth)acrylate or (meth)acrylate resin has a glass transition temperature from about 35° C. to about 100° C.

12. The thermal transfer film according to claim 10 , wherein the polyalkyl (meth)acrylate or (meth)acrylate resin is included in an amount of about 30 wt % to about 50 wt % in the composition in terms of solid content.

13. The thermal transfer film according to claim 10 , wherein the composition further comprises a UV curable resin, a polyfunctional monomer and an initiator.

14. The thermal transfer film according to claim 13 , wherein the UV curable resin comprises at least one of trifunctional to hexafunctional epoxy (meth)acrylates and urethane (meth)acrylates.

15. The thermal transfer film according to claim 14 , wherein the at least one of trifunctional to hexafunctional epoxy (meth)acrylates and urethane (meth)acrylates is included in an amount of about 30 wt % to about 50 wt % in the composition in terms of solid content.

16. The thermal transfer film according to claim 13 , wherein the composition comprises about 60 wt % to about 90 wt % of total of the polyalkyl (meth)acrylate or (meth)acrylate resin and the UV curable resin, about 10 wt % to about 25 wt % of the polyfunctional monomer, and about 1 wt % to about 5 wt % of the initiator in terms of solid content.

17. The thermal transfer film according to claim 13 , wherein the composition further comprises at least one of a UV curable fluorine compound and a UV curable siloxane compound.

18. The thermal transfer film according to claim 8 , wherein the outermost layer has a thickness from about 1 μm to about 10 μm.

19. The thermal transfer film according to claim 8 , wherein the light-to-heat conversion layer comprises at least one of a dye and a pigment.

20. The thermal transfer film according to claim 8 , wherein the light-to-heat conversion layer comprises at least one of carbon black and tungsten oxide particles.

21. The thermal transfer film according to claim 1 , wherein the base film comprises at least one of polyesters, polyacrylics, polyepoxys, polyethylenes, polypropylenes, and polystyrenes.

22. An organic electroluminescent device comprising, a pixel definition layer prepared using the thermal transfer film according to claim 1 as a donor film.

Assignments (2)
MERGER Recorded Feb 21, 2017
From: CHEIL INDUSTRIES INC
To: SAMSUNG SDI CO., LTD.
Reel/Frame 041772/0642 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 26, 2015
From: PARK, SE HYUN; KANG, KYOUNG KU; LEE, JUNG HYO; KIM, MIN HYE; KIM, SUNG HAN; PARK, SI KYUN; LEE, EUN SU; CHO, SEONG HEUN; CHOI, JIN HEE
To: CHEIL INDUSTRIES INC.
Reel/Frame 036022/0072 →
Priority Claims (1)
KR 10-2012-0155619 · Dec 27, 2012 · national
Continuity (1)
Related Publication 20150360496A1 · Dec 17, 2015