IP Library › Granted Patent US 10,282,041
Granted Patent B2
US 10,282,041 · App. 14/661,368 · Granted May 7, 2019

Sensor device, input device, and electronic apparatus

Inventors: Shogo Shinkai (Kanagawa, JP); Hiroto Kawaguchi (Kanagawa, JP); Hiroshi Mizuno (Kanagawa, JP); Taizo Nishimura (Kanagawa, JP); Fumihiko Iida (Kanagawa, JP); Kei Tsukamoto (Kanagawa, JP); Hayato Hasegawa (Kanagawa, JP); Tomoko Katsuhara (Kanagawa, JP)
Assignee: Sony Corporation
G06F3/044G06F3/04886H03K17/9622G06F2203/04102
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Quick Facts
Patent No.
US 10,282,041
App. No.
14/661,368
Granted
May 7, 2019
Kind
B2
Abstract

Provided is a sensor device, including: a deformable first surface; a second surface facing the first surface; an electrode board between the first surface and the second surface, the electrode board including a plurality of capacitive elements arranged in a matrix; a support including a first support layer and a second support layer, the first support layer including a plurality of first columns, the second support layer being layered on the first support layer, the support being deformable following deformation of the first surface, the support connecting at least one of the first surface and the second surface to the electrode board; and a conductor layer supported by the support.

Claims (59)

1. A sensor device, comprising:

a deformable first surface;

a second surface facing the deformable first surface;

an electrode board between the deformable first surface and the second surface, the electrode board including a plurality of capacitive elements arranged in a matrix;

a support apparatus including a first support layer and a second support layer, the first support layer including a plurality of first columns, the second support layer being layered on the first support layer, the support apparatus being deformable following deformation of the deformable first surface, the support apparatus connecting at least one of the deformable first surface and the second surface to the electrode board, wherein the support apparatus connects the deformable first surface and the electrode board; and

a conductor layer supported by the support apparatus,

wherein the support apparatus is between the electrode board and the conductor layer.

2. The sensor device according to claim 1 , wherein

the support apparatus is on the electrode board.

3. The sensor device according to claim 2 , wherein

the conductor layer is deformable.

4. The sensor device according to claim 3 , wherein

the conductor layer includes the deformable first surface.

5. The sensor device according to claim 3 , wherein

the conductor layer is between the first support layer and the second support layer.

6. The sensor device according to claim 2 , further comprising:

a conductor layer including the second surface, wherein

the support apparatus connects the second surface to the electrode board, and the electrode board is deformable.

7. The sensor device according to claim 2 , wherein

the second support layer includes a plurality of second columns between the plurality of first columns.

8. The sensor device according to claim 2 , wherein

the second support layer includes an elastically-deformable portion made of an elastic material.

9. The sensor device according to claim 2 , wherein

the second support layer includes a structural material and a plurality of holes, the structural material including the plurality of holes.

10. The sensor device according to claim 9 , wherein

the structural material is made of a conductive material.

11. The sensor device according to claim 1 , wherein

the first support layer and the second support layer are on the electrode board,

the electrode board is deformable, and

the support apparatus further includes a third support layer, the third support layer facing the first support layer and the second support layer, the electrode board being interposed between the third support layer and the first and second support layers, the support apparatus connecting the first and second surfaces and the electrode board.

12. The sensor device according to claim 11 , wherein

the conductor layer is between the first support layer and the second support layer, the conductor layer being deformable.

13. The sensor device according to claim 11 , wherein

the third support layer includes a plurality of third columns, the plurality of third columns being capable of arranged between the plurality of first columns.

14. The sensor device according to claim 11 , wherein

the second support layer includes a plurality of second columns, the plurality of second columns being capable of arranged between the plurality of first columns.

15. The sensor device according to claim 11 , wherein

the second support layer includes an elastically-deformable portion made of an elastic material.

16. The sensor device according to claim 11 , wherein

the second support layer includes a structural material and a plurality of holes, the structural material including the plurality of holes.

17. The sensor device according to claim 1 , wherein

the electrode board includes the second support layer.

18. An input device, comprising:

an operated apparatus including a first surface and a second surface, the first surface receiving operation from a user, the second surface being opposite to the first surface, the operated apparatus being deformable, the operated apparatus being a sheet;

a third surface facing the second surface;

an electrode board between the second surface and the third surface, the electrode board including a plurality of capacitive elements arranged in a matrix;

a support apparatus including a first support layer and a second support layer, the first support layer including a plurality of first columns, the second support layer being layered on the first support layer, the support apparatus connecting at least one of the second surface and the third surface to the electrode board, the support apparatus being deformable following deformation of the operated apparatus, wherein the support apparatus connects the operated apparatus and the electrode board; and

a conductor layer supported by the support apparatus,

wherein the support apparatus is between the electrode board and the conductor layer.

19. An electronic apparatus, comprising:

an operated apparatus including a first surface and a second surface, the first surface receiving operation from a user, the second surface being opposite to the first surface, the operated apparatus being deformable, the operated apparatus being a sheet;

a third surface facing the second surface;

an electrode board between the second surface and the third surface, the electrode board including a plurality of capacitive elements arranged in a matrix;

a support apparatus including a first support layer and a second support layer, the first support layer including a plurality of first columns, the second support layer being layered on the first support layer, the support apparatus connecting at least one of the second surface and the third surface to the electrode board, the support apparatus being deformable following deformation of the operated apparatus, wherein the support apparatus connects the operated apparatus and the electrode board;

a conductor layer supported by the support apparatus; and

a controller, the controller being electrically connected to the electrode board, the controller being capable of generating information on operation input in the operated apparatus based on output from the electrode board,

wherein the support apparatus is between the electrode board and the conductor layer.

20. The electronic apparatus according to claim 19 , wherein

the second support layer is layered directly on the first support layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 18, 2015
From: SHINKAI, SHOGO; KAWAGUCHI, HIROTO; MIZUNO, HIROSHI; NISHIMURA, TAIZO; IIDA, FUMIHIKO; TSUKAMOTO, KEI; HASEGAWA, HAYATO; KATSUHARA, TOMOKO
To: SONY CORPORATION
Reel/Frame 035223/0285 →
Priority Claims (1)
JP 2014-068427 · Mar 28, 2014 · national
Continuity (1)
Related Publication 20150277626A1 · Oct 1, 2015