Semiconductor device having gate electrode with spacers on fin structure and silicide layer filling the recess
An semiconductor device is provided. A fin is disposed on a substrate, extending in a lengthwise direction. A first recess is disposed on a sidewall of the fin so that the fin and the first recess is arranged in a straight line along the lengthwise direction. A gate structure crosses the fin in the first direction crossing the lengthwise direction. A spacer is disposed on sidewalk of the gate structure. A source/drain region is disposed in the first recess. The source/drain region is formed under the spacer. A silicide layer is disposed on the source/drain region. The silicide layer and the source/drain region fill the first recess.
1. A semiconductor device comprising:
a substrate;
a fin disposed on the substrate to extend in a first direction;
a trench disposed on the fin, wherein the trench is arranged in a straight line along a second direction crossing the first direction;
a gate structure crossing the fin in the first direction;
a spacer disposed on sidewalls of the gate structure;
a source/drain region disposed in the trench, on at least one side of the gate structure to be disposed in the fin and including a first recess, a bottom surface of the first recess is nearer to a top surface of the substrate than a top surface of the fin; and
a silicide layer filling the first recess.
2. The semiconductor device of claim 1 , wherein the source/drain region is U-shaped in view of a cross section taken in the lengthwise direction.
3. The semiconductor device of claim 1 , wherein the source/drain region is in contact with the substrate.
4. The semiconductor device of claim 1 , wherein a bottom surface of the silicide layer is lower than a top surface of the fin.
5. The semiconductor device of claim 1 , wherein the spacer includes a first spacer and a second spacer, the first spacer is interposed between the gate structure and the second spacer, and a top surface of the source/drain region is in contact with the second spacer.
6. The semiconductor device of claim 5 , wherein a distance between the source/drain region and the gate structure is greater than or equal to a width of a bottom surface of the first spacer.
7. The semiconductor device of claim 5 , wherein an outer surface of the second spacer is connected to a surface of the first recess without forming a step at a boundary between the second spacer and the first recess.
8. The semiconductor device of claim 1 , wherein the source/drain region includes a first source/drain region and a second source/drain region, wherein the first source/drain region is interposed between the trench and the second source/drain region.
9. The semiconductor device of claim 8 , wherein a sum of a width of a top surface of the first source/drain region and a width of a top surface of the second source/drain region is smaller than or equal to a width of a bottom surface of the spacer.
10. The semiconductor device of claim 9 , wherein the first source/drain region and the second source/drain region are doped with a first impurity, and a concentration of the first impurity in the first source/drain region is different from that of the first impurity in the second source/drain region.
11. A semiconductor device comprising:
a substrate;
a fin formed on the substrate, wherein the fin includes a first fin protrusion and a second fin protrusion formed on the substrate;
a first recess disposed between the first fin protrusion and the second fin protrusion, wherein the first recess, the first fin protrusion and the second fin protrusion are arranged in a straight line along a first direction;
a first gate structure and a second gate structure crossing the first fin protrusion and the second fin protrusion in a second direction, respectively;
a first spacer and a second spacer disposed on inner sidewalls of the first gate structure and the second gate structure, respectively, wherein the inner sidewalls face each other through the first recess;
a source/drain region disposed in the first recess, wherein one end of the source/drain region is disposed under the first spacer and another end of the source drain/region is disposed under the second spacer, and
a silicide layer disposed on the source/drain region, wherein the silicide layer and the source/drain region fill the first recess.
12. The semiconductor device of claim 11 , wherein the source/drain region is U-shaped in view of a cross section taken in the first direction.
13. The semiconductor device of claim 12 , wherein the source/drain region is in contact with the substrate.
14. The semiconductor device of claim 11 , wherein the source/drain region includes a first source/drain region and a second source/drain region, and wherein the first source/drain region is interposed between the substrate and the second source/drain region.
15. The semiconductor device of claim 11 , further comprising a contact disposed on the silicide layer.