Protection of an integrated circuit against attacks
An integrated circuit, including: a semiconductor substrate of a first conductivity type; a plurality of regions of the first conductivity type vertically extending from the surface of the substrate, each of the regions being laterally delimited all along its periphery by a region of the second conductivity type; and a device for detecting a variation of the substrate resistance between each region of the first conductivity type and an area for biasing the substrate to a reference voltage.
1. A device, comprising:
a semiconductor substrate having a first surface opposite to a second surface;
a first plurality of regions formed in the first surface of the substrate, the first plurality of regions having a first conductivity type, the first plurality of regions being separated from each other by a plurality of portions of the substrate;
a second plurality of regions formed in the first surface of the substrate and positioned between ones of the first plurality of regions, the second plurality of regions having a second conductivity type, the second plurality of regions being arranged in an array of rows and columns, each of the second plurality of regions being separated from each other by the first plurality of regions and being aligned with the plurality of portions of the substrate;
a plurality of terminals electrically coupled to the second plurality of regions; and
a resistance detector coupled to the plurality of terminals and configured to detect a change in resistance between one of the terminals and a corresponding one of the plurality of portions of the substrate.
2. The device of claim 1 wherein the semiconductor substrate has the second conductivity type.
3. The device of claim 1 , further comprising a support on the second surface of the substrate.
4. The device of claim 1 wherein the first plurality of regions include a first doped portion and a second doped portion, the second doped portion having a lower doping level than the first doped portion.
5. The device of claim 4 wherein the first doped portion is separated from the second surface of the substrate by the second doped portion.
6. The device of claim 1 , further comprising conductive metal tracks on the first surface of the substrate and coupled to the plurality of terminals.
7. The device of claim 6 wherein the conductive metal tracks couple the plurality of terminals to each other in series.
8. The device of claim 1 , further comprising:
a third plurality of regions formed in the first surface of the substrate and positioned between the first plurality of regions and the first surface of the substrate, the third plurality of regions having the second conductivity type; and
a fourth plurality of regions formed in the first surface of the substrate, the fourth plurality of regions having the first conductivity type, the fourth plurality of regions separating the third plurality of regions from the second plurality of regions.
9. The device of claim 8 wherein each of the fourth plurality of regions completely laterally surround one of the second plurality of regions.
10. The device of claim 1 , further comprising a plurality of switches coupled between the plurality of terminals and the second plurality of regions.
11. The device of claim 10 wherein the resistance detector is configured to control each of the plurality of switches.
12. The device of claim 11 wherein the resistance detector is configured to control each of the plurality of switches individually and is configured to detect a change in resistance that corresponds to an attack on the second surface of the substrate.
13. The device of claim 11 wherein each of the plurality of switches is coupled in series with a resistance through a respective one of the plurality of portions of the substrate to ground.
14. The device of claim 13 , further comprising a conductive track coupled to the plurality of terminals, the conductive track configured to couple in parallel each of the plurality of switches that are in series with the resistance.
15. A method, comprising:
forming a first plurality of regions in a first surface of a substrate, the substrate having a second surface opposite to the first surface, the first plurality of regions having a first conductivity type, the first plurality of regions being separated from each other by a plurality of portions of the substrate;
forming a second plurality of regions in an array of rows and columns in the first surface of the substrate and positioned between ones of the first plurality of regions, the second plurality of regions having a second conductivity type, the second plurality of regions being separated from each other by the first plurality of regions and being aligned with the plurality of portions of the substrate;
coupling a plurality of terminals electrically to the second plurality of regions;
coupling a resistance detector to the plurality of terminals; and
detecting a change in resistance between one of the terminals and a corresponding one of the plurality of portions of the substrate.
16. The method of claim 15 , further comprising forming the first plurality of regions to include a first doped portion and a second doped portion, the second doped portion having a lower doping level than the first doped portion, the second doped portion separating the second surface of the substrate from the first doped portion.
17. The method of claim 15 , further comprising forming a plurality of switches between the plurality of terminals and the second plurality of regions and coupling the resistance detector to the plurality of switches for controlling each of the plurality of switches.
18. The method of claim 17 , further comprising forming a conductive track coupled to the plurality of terminals, the conductive track configured to couple in parallel each of the plurality of switches that are in series with a resistance in each of the portions of the substrate.