Electronic component, method of manufacturing the same, and mount structure of electronic component
An electronic component includes a main body, first and second external electrodes, and a water-repellent film. The first and second external electrodes are provided on a portion of a surface of the main body. The water-repellent film is provided on another portion of the surface of the main body and on a surface of the first external electrode. The water-repellent film contains a non-cross-linked silicone resin. An angle of contact of water of about 25° C. with the water-repellent film is not less than about 100° and not greater than about 160°.
1. An electronic component, comprising:
an electronic component main body;
first and second external electrodes provided on a portion of a surface of the electronic component main body; and
a water-repellent film provided on another portion of the surface of the electronic component main body and on a surface of the first external electrode, and containing a non-cross-linked silicone resin; wherein
an angle of contact of water of about 25° C. with the water-repellent film is not less than about 100° and not greater than about 160°.
2. The electronic component according to claim 1 , wherein each of the first and second external electrodes includes a plurality of layers, and an outermost layer of each of the first and second external electrodes contains at least one of Sn, Cu, and Ag.
3. The electronic component according to claim 1 , wherein
the electronic component main body includes first and second main surfaces extending along a length direction and a width direction, first and second side surfaces extending along the length direction and a thickness direction, and first and second end surfaces extending along the width direction and the thickness direction;
on the second main surface, a tip end portion of the first external electrode and a tip end portion of the second external electrode are opposed to each other in the length direction; and
the water-repellent film is located on a portion of the second main surface, which is located between the tip end portion of the first external electrode and the tip end portion of the second external electrode.
4. The electronic component according to claim 1 , wherein the water-repellent film extends across the another portion of the surface of the electronic component main body and the surface of the first external electrode.
5. The electronic component according to claim 1 , wherein the water-repellent film covers an entire surface of an exposed portion of the electronic component main body and each of the first and second external electrodes.
6. A mount structure of an electronic component, comprising:
the electronic component according to claim 1 ;
a mount substrate on which the electronic component is mounted; and
solder joining the electronic component and the mount substrate to each other.