DECORATIVE WPC PANEL COMPRISING A LOW-POROUS PROFILED EDGE AND METHOD FOR PRODUCING THE SAME

1 . Decorative panel comprising a plate-shaped carrier made of a wood plastic composite (WPC) material, wherein the plate-shaped carrier in at least one edge region has a profile and/or a cutting edge, characterized in that the profile and/or cutting edge comprises a substantially sealed surface.

2 . The decorative panel according to claim 1 , wherein the WPC material comprises a plastic material from the group consisting of polyvinyl chloride (PVC), polyethylene (PE), polypropylene (PP), polyamide (PA), polystyrene (PS), acrylonitrile-butadiene-styrene (ABS), polymethyl methacrylate (PMMA), polycarbonate (PC), polyethylene terephthalate (PET), polyether ether ketone (PEEK), polyisobutylene (PIB), polybutylene (PB), or mixtures or co-polymerizates thereof.

3 . The decorative panel according to claim 1 , wherein the panel comprises a decor applied onto the plate-shaped carrier by means of direct printing.

4 . A method for producing a decorative panel, comprising the steps of:

providing a plate-shaped carrier made of a WPC material;

forming a profile and/or a cutting edge in at least one edge of the plate-shaped carrier;

subjecting a surface of the introduced profile and/or cutting edge to a thermal treatment to at least partially melt the WPC material in the region of the profile and seal the surface.

5 . The method according to claim 4 , wherein the forming of the profile and/or the cutting edge is carried out by a machining or cutting process.

6 . The method according to claim 5 , wherein the melting of the WPC material is implemented by heating the a cutting or machining tool used in the machining or cutting process for the profiling and/or cutting of the at least one edge of the plate-shaped carrier to a temperature greater than or equal to a melting temperature of the WPC material and less than a decomposition temperature of the WPC material.

7 . The method according to claim 6 , wherein the machining or cutting tool is temperature controlled to a maximum temperature of 30° C. above the melting temperature of the WPC material.

8 . The method according to claim 7 , wherein the temperature control of the machining or cutting tool is implemented by a heating and/or cooling device.

9 . The method according to claim 8 , wherein the temperature of the machining or cutting tool is monitored contact-free.

10 . The method according to claim 8 , wherein at least the profiled region of the edge of the plate-shaped carrier is cooled down to a temperature below the melting point after the melting of the WPC material and sealing of the surface.

11 . The method according to claim 10 , wherein the cooling is carried out within a period of ≦60 s.

12 . The method according to claim 4 , comprising applying a decor to the carrier by a direct printing process subsequently to the providing the plate-shaped carrier.

13 . The method according to claim 12 , comprising a step for applying a printing base prior to the step of applying a decor.

14 . The method according to claim 4 , comprising applying a decor to the carrier by a direct printing process subsequently to the forming the profile and/or the cutting edge in the edge of the plate-shaped carrier.

15 . The method according to claim 4 , comprising applying a decor to the carrier by a direct printing process subsequently to the forming the profile and/or the cutting edge in the edge of the plate-shaped carrier.

16 . The method according to claim 4 comprising:

the providing the carrier;

the forming the profile;

and the thermal treatment;

wherein the thermal treatment is performed during the forming the profile by heating a tool used in the forming the profile; and

applying a decor to the carrier by a printing process performed after the forming the profile.

17 . The method according to claim 14 further comprising applying a wear layer over the decor.

18 . The method according to claim 16 further comprising applying a wear layer over the decor.