IP Library Granted Patent US 9,601,614
Granted Patent B2
US 9,601,614 · App. 14/669,415 · Granted Mar 21, 2017

Composite semiconductor device with different channel widths

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Quick Facts
Patent No.
US 9,601,614
App. No.
14/669,415
Granted
Mar 21, 2017
Kind
B2
Abstract

A device includes a semiconductor substrate, a first constituent transistor including a first plurality of transistor structures in the semiconductor substrate connected in parallel with one another, and a second constituent transistor including a second plurality of transistor structures in the semiconductor substrate connected in parallel with one another. The first and second constituent transistors are disposed laterally adjacent to one another and connected in parallel with one another. Each transistor structure of the first plurality of transistor structures has a lower resistance in a saturation region of operation than each transistor structure of the second plurality of transistor structures.

Claims (48)

1. A device comprising:

a semiconductor substrate;

a first constituent transistor comprising a first plurality of transistor structures in the semiconductor substrate connected in parallel with one another; and

a second constituent transistor comprising a second plurality of transistor structures in the semiconductor substrate connected in parallel with one another;

wherein the first and second constituent transistors are disposed laterally adjacent to one another and connected in parallel with one another;

wherein each transistor structure of the first and second pluralities of transistor structures comprises a plurality of source regions and a plurality of body contact regions disposed in an alternating arrangement with the plurality of source regions along a lateral dimension of the device; and

wherein each transistor structure of the first plurality of transistor structures has a lower resistance in a saturation region of operation than each transistor structure of the second plurality of transistor structures due to a layout difference in the alternating arrangement between the first and second pluralities of transistor structures.

2. The device of claim 1 , wherein the second plurality of transistor structures are laterally surrounded by the first plurality of transistor structures.

3. The device of claim 1 , wherein the second plurality of transistor structures are centered within the first plurality of transistor structures.

4. The device of claim 1 , wherein the first and second pluralities of transistor structures are not electrically isolated from one another.

5. The device of claim 1 , wherein the first and second constituent transistors are laterally diffused metal-oxide-semiconductor (LDMOS) transistors.

6. The device of claim 1 , wherein:

each transistor structure of the first and second pluralities of transistor structures comprises a body region in which a channel is formed during operation;

the channel of each transistor structure of the first and second pluralities of transistor structures is oriented in a first lateral direction; and

the first and second constituent transistors are laterally contiguous with one another in a second lateral direction orthogonal to the first lateral direction.

7. The device of claim 1 , wherein a respective transistor structure of the first plurality of transistor structures is aligned with a respective transistor structure of the second plurality of transistor structures such that the respective transistor structures share a common gate supported by the semiconductor substrate.

8. The device of claim 1 , wherein the second constituent transistor is disposed in an inner area and the first constituent transistor is disposed outwardly from the inner area.

9. The device of claim 1 , wherein the layout difference incorporates a plurality of shallow trench isolation regions into the alternating arrangement for the second plurality of transistor structures to establish the lower resistance of each transistor structure of the first plurality of transistor structures.

10. A device comprising:

a semiconductor substrate;

a first constituent transistor comprising a first plurality of transistor structures in the semiconductor substrate connected in parallel with one another; and

a second constituent transistor comprising a second plurality of transistor structures in the semiconductor substrate connected in parallel with one another;

wherein the first and second constituent transistors are disposed laterally adjacent to one another and connected in parallel with one another;

wherein each transistor structure of the first plurality of transistor structures has a lower resistance in a saturation region of operation than each transistor structure of the second plurality of transistor structures; and

wherein an effective channel width of each transistor structure of the first plurality of transistor structures is larger than an effective channel width of each transistor structure of the second plurality of transistor structures.

11. The device of claim 10 , wherein each transistor structure of the first and second pluralities of transistor structures comprises a plurality of source regions and a plurality of body contact regions disposed in an alternating arrangement with the plurality of source regions along a lateral dimension of the device.

12. The device of claim 11 , wherein the alternating arrangement establishes the effective channel width of each transistor structure.

13. The device of claim 11 , wherein, in the second plurality of transistor structures, each source region of the plurality of source regions has a smaller size in a channel-establishing dimension than each body contact region of the plurality of body contact regions.

14. A device comprising:

a semiconductor substrate;

a first constituent transistor comprising a first plurality of transistor structures in the semiconductor substrate connected in parallel with one another; and

a second constituent transistor comprising a second plurality of transistor structures in the semiconductor substrate connected in parallel with one another;

wherein the first and second constituent transistors are disposed laterally adjacent to one another and connected in parallel with one another; and

wherein an effective channel width of each transistor structure of the first plurality of transistor structures is larger than an effective channel width of each transistor structure of the second plurality of transistor structures.

15. The device of claim 14 , wherein each transistor structure of the first and second pluralities of transistor structures comprises a plurality of source regions and a plurality of body contact regions disposed in an alternating arrangement with the plurality of source regions along a lateral dimension of the device.

16. The device of claim 15 , wherein the alternating arrangement establishes the effective channel width of each transistor structure.

17. The device of claim 15 , wherein:

the alternating arrangement establishes, for each transistor structure of the first and second plurality of transistor structures, a collective size of the plurality of body contact regions in a channel-establishing dimension and a collective size of the plurality of source regions in the channel-establishing dimension; and

for each transistor structure of the second plurality of transistor structures, the collective size of the plurality of body contact regions is greater than the collective size of the plurality of source regions.

18. The device of claim 14 , wherein the second plurality of transistor structures are laterally surrounded by the first plurality of transistor structures.

19. The device of claim 14 , wherein the second constituent transistor is disposed in an inner area and the first constituent transistor is disposed outwardly from the inner area.

20. A device comprising:

a semiconductor substrate;

a first constituent transistor comprising a first plurality of transistor structures in the semiconductor substrate connected in parallel with one another; and

a second constituent transistor comprising a second plurality of transistor structures in the semiconductor substrate connected in parallel with one another;

wherein the first and second constituent transistors are disposed laterally adjacent to one another and connected in parallel with one another;

wherein each transistor structure of the first plurality of transistor structures has a lower resistance in a saturation region of operation than each transistor structure of the second plurality of transistor structures; and

wherein the second constituent transistor is disposed in an inner area and the first constituent transistor is disposed outwardly from the inner area.

Assignments (15)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 040626 FRAME: 0683. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME EFFECTIVE NOVEMBER 7, 2016. Recorded Jan 12, 2017
From: NXP SEMICONDUCTORS USA, INC. (MERGED INTO); FREESCALE SEMICONDUCTOR, INC. (UNDER)
To: NXP USA, INC.
Reel/Frame 041414/0883 →
CHANGE OF NAME Recorded Nov 16, 2016
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 040626/0683 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 7, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037458/0359 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 7, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037458/0341 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0974 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded May 4, 2015
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 035571/0095 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded May 4, 2015
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 035571/0112 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded May 4, 2015
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 035571/0080 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 26, 2015
From: MIN, WON GI; RODRIQUEZ, PETE; YANG, HONGNING; ZUO, JIANG-KAI
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 035265/0133 →