Techniques for multiple gate workfunctions for a nanowire CMOS technology
View Patent ↗In one aspect, a method of forming a CMOS device with multiple transistors having different Vt's is provided which includes: forming nanowires and pads on a wafer, wherein the nanowires are suspended at varying heights above an oxide layer of the wafer; and forming gate stacks of the transistors at least partially surrounding portions of each of the nanowires by: i) depositing a conformal gate dielectric around the nanowires and on the wafer beneath the nanowires; ii) depositing a conformal workfunction metal on the conformal gate dielectric around the nanowires and on the wafer beneath the nanowires, wherein an amount of the conformal workfunction metal deposited around the nanowires is varied based on the varying heights at which the nanowires are suspended over the oxide layer; and iii) depositing a conformal poly-silicon layer on the conformal workfunction metal around the nanowires and on the wafer beneath the nanowires.
1. A method of forming a complementary metal oxide semiconductor (CMOS) device comprising multiple nanowire-based transistors having different threshold voltages, the method comprising the steps of:
providing a wafer comprising an oxide layer on a substrate;
forming nanowires and pads on the wafer, wherein the pads are attached to opposite ends of the nanowires and anchor the nanowires to the wafer, and wherein the nanowires are suspended at varying heights above the oxide layer; and
forming gate stacks of the nanowire-based transistors at least partially surrounding portions of each of the nanowires by: i) depositing a conformal gate dielectric both around the nanowires and on the wafer beneath the nanowires; ii) depositing a conformal workfunction metal on the conformal gate dielectric both around the nanowires and on the wafer beneath the nanowires, wherein an amount of the conformal workfunction metal deposited around the nanowires is varied based on the varying heights at which the nanowires are suspended over the oxide layer; and iii) depositing a conformal poly-silicon layer on the conformal workfunction metal both around the nanowires and on the wafer beneath the nanowires,
wherein the portions of the nanowires at least partially surrounded by the gate stacks serve as channel regions of the nanowire-based transistors, wherein portions of the nanowires extending out from the gate stacks and the pads serve as source and drain regions of the nanowire-based transistors, and wherein the nanowire-based transistors have different threshold voltages based on the varied amount of the conformal workfunction metal deposited around the nanowires.
2. The method of claim 1 , further comprising the step of:
annealing the wafer in an oxygen ambient to form a conformal oxide layer at an interface between the conformal gate dielectric and the nanowires.
3. The method of claim 1 , wherein the wafer further comprises a semiconductor-on-insulator (SOI) layer on a side of the oxide layer opposite the substrate, and wherein the method further comprises the steps of:
patterning the SOI layer to form a stepped surface on a side thereof opposite the oxide layer;
growing an epitaxial semiconductor material on the stepped surface of the SOI layer; and
forming the nanowires and the pads from the epitaxial semiconductor material on the stepped surface of the SOI layer; and
removing the SOI layer from beneath the nanowires to suspend the nanowires at the varying heights above the oxide layer.
4. The method of claim 3 , further comprising the steps of:
patterning fins in the epitaxial semiconductor material and the SOI layer; and
using an etch to remove the SOI layer from the fins selective to the epitaxial semiconductor material to form the nanowires suspended above the oxide layer.
5. The method of claim 3 , wherein the SOI layer comprises silicon germanium.
6. The method of claim 3 , wherein the epitaxial semiconductor material comprises epitaxial silicon.
7. The method of claim 1 , wherein the wafer further comprises a SOI layer on a side of the oxide layer opposite the substrate, and wherein the method further comprises the steps of:
patterning the SOI layer to form the nanowires and the pads; and
recessing the oxide layer at varying depths beneath the nanowires to suspend the nanowires at the varying heights above the oxide layer.
8. The method of claim 7 , wherein the SOI layer comprises silicon, germanium, or silicon germanium.
9. The method of claim 1 , wherein the conformal gate dielectric comprises a high-κ dielectric selected from the group consisting of hafnium oxide and lanthanum oxide.
10. The method of claim 1 , wherein the conformal gate dielectric is deposited around the nanowires and on the wafer beneath the nanowires to a uniform thickness of from about 1 nanometer to about 5 nanometers, and ranges therebetween.
11. The method of claim 1 , wherein the conformal workfunction metal comprises an n-type workfunction metal selected from the group consisting of lanthanum, titanium, and tantalum.
12. The method of claim 1 , wherein the conformal workfunction metal comprises a p-type workfunction metal selected from the group consisting of aluminum, dysprosium, gadolinium, and ytterbium.
13. The method of claim 1 , wherein the conformal workfunction metal is deposited around the nanowires and on the wafer beneath the nanowires to a uniform thickness of from about 5 nanometers to about 20 nanometers, and ranges therebetween.
14. The method of claim 1 , wherein the conformal poly-silicon layer is deposited around the nanowires and on the wafer beneath the nanowires to a uniform thickness of from about 10 nanometers to about 30 nanometers, and ranges therebetween.