Camera module with electro-magnetic interference shielding
A camera module includes a circuit board, an image sensor, a bracket, a VCM, and a lens module. The image sensor is positioned on the circuit board. The bracket is mounted on the circuit board and receives the image sensor. The VCM is mounted on the bracket and includes a conductive housing and pins extending from the housing. The pins are electrically connected to the circuit board. The lens module is received in the VCM. The VCM with the lens module is supported on the bracket. The optical axis of the lens module is coinciding with a center of the image sensor. The bracket includes a plating layer and solder bumps. The plating layer is formed at least one of side surfaces of the bracket. The solder bumps electrically connect the plating layer to the circuit board and electrically connect the plating layer to the housing.
1. A camera module comprising: a circuit board; an image sensor positioned on the circuit board;
a bracket mounted on the circuit board and configured to receive the image sensor, the bracket comprises a plating layer and solder bumps, the plating layer formed on at least one side surface of the bracket, the solder bumps configured to electrically connect the plating layer to the circuit board and electrically connect the plating layer to the housing;
a voice-coil motor (VCM) mounted on the bracket, the VCM comprising a conductive housing and pins extending from the housing, the pins electrically connected to the circuit board;
a lens module received in the VCM, the lens module having an optical axis coincident with a center of the image sensor; and
wherein the bracket comprises a to surface, a bottom surface, and four side surfaces interconnected between the top surface and the bottom surface, the bottom surface is positioned on the circuit board, the top surface supports the VCM and the lens module.
2. The camera module of claim 1 , wherein the circuit board is a rigid-flexible printed circuit board, and comprises a support portion and a connection portion electrically and mechanically connected to a side of the support portion, the support portion is a rigid board, and the connection portion is a flexible board.
3. The camera module of claim 1 , wherein the circuit board is a flexible printed circuit board, and a stiffening plate is mounted on the flexible printed circuit board.
4. The camera module of claim 1 , wherein the circuit board comprises a supporting surface, and the image sensor is fixed on the supporting surface with thermosetting adhesive.
5. The camera module of claim 1 , wherein the circuit board comprises a supporting surface, and the image sensor is soldered on the supporting surface.
6. The camera module of claim 1 , wherein a receiving hole passing through the top surface and the bottom surface is defined in the bracket, a ring-shaped plate extends from an inner surface of the receiving hole and divides the receiving hole into an upper receiving hole portion adjacent to the top surface and a lower receiving hole portion adjacent to the bottom surface, and the image sensor is received in the lower receiving hole portion.
7. The camera module of claim 6 , wherein a dimension of the lower receiving hole portion is larger than that of the upper receiving hole portion.
8. The camera module of claim 6 , wherein the image sensor comprises a sensing area and a non-sensing area surrounding the sensing area, and the sensing area is entire exposed at the plate.
9. The camera module of claim 6 , wherein the four side surfaces comprises a first side surface, a second side surface, a third side surface, and a fourth side surface connected to each other end-to-end, the plating layer comprises a striped portion formed on the second side surface and a cross-shaped portion formed on the third side surface.
10. The camera module of claim 9 , wherein the solder bumps comprises an upper solder bump and a lower solder bump, the upper solder bump is located at an end of the striped portion, and the lower solder bump is located at the intersection line of the cross-shaped portion.
11. The camera module of claim 9 , wherein a protrusion protrudes from a middle portion of the first side surface, two recess portions are formed at opposite ends of the first side surface, the pins plug in the recess portions and are electrically connected to the circuit board.
12. The camera module of claim 1 , the plating layer is made of conductive metal, such as nickel (Ni), gold (Au), copper (Cu), or alloy.
13. The camera module of claim 1 , portions of the bracket except for the plating layer and the solder bumps are made of plastic, and the plating layer is formed on side surface by a laser direct structuring (LDS) method.