IP Library Granted Patent US 9,650,570
Granted Patent B2
US 9,650,570 · App. 14/672,870 · Granted May 16, 2017

Compositions for etching polysilicon

Inventors: Jerome A. Imonigie (Boise, ID); Prashant Raghu (Boise, ID)
Assignee: Micron Technology, Inc.
C09K13/08C09K13/00C09K13/04C09K13/06H01L21/28273H01L21/31111H01L21/32134H01L27/11556
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Quick Facts
Patent No.
US 9,650,570
App. No.
14/672,870
Granted
May 16, 2017
Kind
B2
Abstract

Compositions for etching polysilicon including aqueous compositions containing nitric acid, ammonium fluoride, and poly-carboxylic acid.

Claims (44)

1. An aqueous composition, comprising:

29.0-34.9 wt % water;

65-70 wt % nitric acid;

0.06-0.60 wt % ammonium fluoride; and

poly-carboxylic acid;

wherein the poly-carboxylic acid is present in the aqueous composition and the aqueous composition contains less than or equal to 0.4 wt % poly-carboxylic acid.

2. The aqueous composition of claim 1 , further comprising:

hydrofluoric acid;

wherein the hydrofluoric acid is present in the aqueous composition and the aqueous composition contains less than or equal to 0.08 wt % hydrofluoric acid.

3. The aqueous composition of claim 1 , wherein the aqueous composition comprises 29.4 to 34.9 wt % water.

4. The aqueous composition of claim 1 , wherein the aqueous composition comprises 69 wt % nitric acid, 0.6 wt % ammonium fluoride, and less than 30.4 wt % water.

5. The aqueous composition of claim 1 , wherein the poly-carboxylic acid is oxalic acid.

6. An aqueous composition comprising 69 wt % nitric acid, 0.6 wt % ammonium fluoride, 0.4 wt % poly-carboxylic acid, and 30 wt % water.

7. A composition for etching polysilicon, consisting essentially of:

nitric acid;

ammonium fluoride;

poly-carboxylic acid; and

water;

wherein the composition contains 65-70 wt % nitric acid.

8. The composition of claim 7 , wherein the composition contains 28.9-34.9 wt % water.

9. The composition of claim 7 , wherein the composition contains 0.06-0.60 wt % ammonium fluoride.

10. The composition of claim 9 , wherein the composition contains less than or equal to 0.4 wt % poly-carboxylic acid.

11. The composition of claim 7 , further comprising at least one component selected from a group consisting of a dye, a lubricant, a stabilizer, a buffer, a surfactant, a thickening agent, a preservative and an antimicrobial agent.

12. A composition for etching polysilicon, consisting essentially of:

nitric acid;

ammonium fluoride;

water;

hydrofluoric acid; and

poly-carboxylic acid;

wherein the composition contains 65-70 wt % nitric acid.

13. The composition of claim 12 , wherein the composition contains 0.06-0.60 wt % ammonium fluoride and less than or equal to 0.08 wt % hydrofluoric acid.

14. The composition of claim 12 , wherein the composition contains 0.06-0.60 wt % ammonium fluoride and less than or equal to 0.4 wt % poly-carboxylic acid.

15. The composition of claim 14 , wherein the poly-carboxylic acid is oxalic acid.

16. The composition of claim 13 , wherein the composition contains 0.06-0.60 wt % ammonium fluoride, less than or equal to 0.08 wt % hydrofluoric acid and less than or equal to 0.4 wt % poly-carboxylic acid.

17. The composition of claim 16 , wherein the poly-carboxylic acid is oxalic acid.

18. The composition of claim 12 , further comprising at least one component selected from a group consisting of a dye, a lubricant, a stabilizer, a buffer, a surfactant, a thickening agent, a preservative and an antimicrobial agent.

19. An aqueous composition, comprising:

28.9-34.9 wt % water;

65-70 wt % nitric acid;

0.06-0.60 wt % ammonium fluoride;

hydrofluoric acid; and

oxalic acid;

wherein the hydrofluoric acid is present in the aqueous composition and the aqueous composition contains less than or equal to 0.08 wt % hydrofluoric acid; and

wherein the oxalic acid is present in the aqueous composition and the aqueous composition contains less than or equal to 0.4 wt % oxalic acid.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
Continuity (2)
Division 13624272 · Sep 21, 2012
Related Publication 20150203754A1 · Jul 23, 2015