Semiconductor device including write access transistor having channel region including oxide semiconductor
Disclosed is a semiconductor device functioning as a multivalued memory device including: memory cells connected in series; a driver circuit selecting a memory cell and driving a second signal line and a word line; a driver circuit selecting any of writing potentials and outputting it to a first signal line; a reading circuit comparing a potential of a bit line and a reference potential; and a potential generating circuit generating the writing potential and the reference potential. One of the memory cells includes: a first transistor connected to the bit line and a source line; a second transistor connected to the first and second signal line; and a third transistor connected to the word line, bit line, and source line. The second transistor includes an oxide semiconductor layer. A gate electrode of the first transistor is connected to one of source and drain electrodes of the second transistor.
1. A semiconductor device comprising:
a first transistor;
a second transistor;
a third transistor;
a fourth transistor;
a first capacitor; and
a second capacitor,
wherein a channel formation region of the third transistor and a channel formation region of the fourth transistor each comprise an oxide semiconductor,
wherein one of a source and a drain of the first transistor is electrically connected to one of a source and a drain of the second transistor,
wherein the first transistor and the second transistor are electrically connected in series,
wherein one of a source and a drain of the third transistor is electrically connected to a gate of the first transistor,
wherein one of a source and a drain of the fourth transistor is electrically connected to a gate of the second transistor,
wherein one of a pair of electrodes of the first capacitor is electrically connected to the gate of the first transistor,
wherein one of a pair of electrodes of the second capacitor is electrically connected to the gate of the second transistor,
wherein the other of the pair of electrodes of the first capacitor is electrically connected to a first wiring, and
wherein the other of the pair of electrodes of the second capacitor is electrically connected to a second wiring.
2. The semiconductor device according to claim 1 , wherein the oxide semiconductor contains In, Ga and Zn.
3. The semiconductor device according to claim 1 , wherein the oxide semiconductor contains crystals.
4. The semiconductor device according to claim 1 , wherein hydrogen concentration of the oxide semiconductor is less than or equal to 5×10 19 atoms/cm 3 .
5. The semiconductor device according to claim 1 , wherein off-state current of each of the third transistor and the fourth transistor is less than or equal to 1×10 −13 A.
6. A semiconductor device comprising:
a circuit;
a first transistor;
a second transistor;
a third transistor;
a fourth transistor;
a first capacitor; and
a second capacitor,
wherein a channel formation region of the third transistor and a channel formation region of the fourth transistor each comprise an oxide semiconductor,
wherein one of a source and a drain of the first transistor is electrically connected to one of a source and a drain of the second transistor,
wherein the first transistor and the second transistor are electrically connected in series,
wherein one of a source and a drain of the third transistor is electrically connected to a gate of the first transistor,
wherein one of a source and a drain of the fourth transistor is electrically connected to a gate of the second transistor,
wherein one of a pair of electrodes of the first capacitor is electrically connected to the gate of the first transistor,
wherein one of a pair of electrodes of the second capacitor is electrically connected to the gate of the second transistor,
wherein the other of the pair of electrodes of the first capacitor is electrically connected to a first wiring,
wherein the other of the pair of electrodes of the second capacitor is electrically connected to a second wiring,
wherein the circuit is configured to supply a first potential to the gate of the first transistor through the third transistor,
wherein the circuit is configured to supply a second potential to the gate of the second transistor through the fourth transistor, and
wherein each of the first potential and the second potential is selected from 2 k (k is an integer of greater than equal to 1) kinds of writing potentials.
7. The semiconductor device according to claim 6 , wherein the oxide semiconductor contains In, Ga and Zn.
8. The semiconductor device according to claim 6 , wherein the oxide semiconductor contains crystals.
9. The semiconductor device according to claim 6 , wherein hydrogen concentration of the oxide semiconductor is less than or equal to 5×10 19 atoms/cm 3 .
10. The semiconductor device according to claim 6 , wherein off-state current of each of the third transistor and the fourth transistor is less than or equal to 1×10 −13 A.
11. A semiconductor device comprising:
a memory cell array;
a first circuit;
a second circuit; and
a third circuit,
wherein the memory cell array comprises:
a first transistor;
a second transistor;
a third transistor;
a fourth transistor;
a first capacitor; and
a second capacitor,
wherein a channel formation region of the third transistor and a channel formation region of the fourth transistor each comprise an oxide semiconductor,
wherein one of a source and a drain of the first transistor is electrically connected to one of a source and a drain of the second transistor,
wherein the first transistor and the second transistor are electrically connected in series,
wherein one of a source and a drain of the third transistor is electrically connected to a gate of the first transistor,
wherein one of a source and a drain of the fourth transistor is electrically connected to a gate of the second transistor,
wherein one of a pair of electrodes of the first capacitor is electrically connected to the gate of the first transistor,
wherein one of a pair of electrodes of the second capacitor is electrically connected to the gate of the second transistor,
wherein the other of the pair of electrodes of the first capacitor is electrically connected to a first wiring, and
wherein the other of the pair of electrodes of the second capacitor is electrically connected to a second wiring,
wherein the first circuit is configured to write a first data into the gate of the first transistor through the third transistor,
wherein the first circuit is configured to write a second data into the gate of the second transistor through the fourth transistor,
wherein the second circuit is configured to turn the first transistor on by controlling a potential of the first wiring,
wherein the second circuit is configured to turn the second transistor on by controlling a potential of the second wiring, and
wherein the third circuit is configured to read the first data or the second data based on conductance between the other of the source and the drain of the first transistor and the other of the source and the drain of the second transistor.
12. The semiconductor device according to claim 11 , wherein the oxide semiconductor contains In, Ga and Zn.
13. The semiconductor device according to claim 11 , wherein the oxide semiconductor contains crystals.
14. The semiconductor device according to claim 11 , wherein hydrogen concentration of the oxide semiconductor is less than or equal to 5×10 19 atoms/cm 3 .
15. The semiconductor device according to claim 11 , wherein off-state current of each of the third transistor and the fourth transistor is less than or equal to 1×10 −13 A.