IP Library Granted Patent US 9,741,447
Granted Patent B2
US 9,741,447 · App. 14/682,967 · Granted Aug 22, 2017

Semiconductor device including fuse circuit

Inventor: Hiroshi Akamatsu (Boise, ID)
Assignee: Micron Technology, Inc.
G11C17/18G11C17/16G11C29/76G11C29/78
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Quick Facts
Patent No.
US 9,741,447
App. No.
14/682,967
Filed
Apr 9, 2015
Granted
Aug 22, 2017
Kind
B2
Art Unit
2824
USPC
365/96
Abstract

Disclosed here is a semiconductor device that comprises a plurality of input nodes configured to be supplied with input signals, a decoder coupled to the input nodes, the decoder configured to decode the input signals and output decoded signals, and a plurality of fuse circuits provided correspondingly with the decoded signals and configured to be programmed responsive to the decoded signals, respectively.

Claims (23)

1. A semiconductor device comprising:

a plurality of input nodes configured to be supplied with input signals, wherein a number of the input nodes of the plurality of input nodes is equal to M (M is an integer of two or more) to receive M number of the input signals;

a decoder coupled to the plurality of input nodes, the decoder configured to decode the M number of input signals and output N number of decoded signals, wherein N is an integer and is greater than M; and

a plurality of fuse circuits provided correspondingly with the decoded signals and configured to be programmed responsive to the decoded signals, respectively.

2. The semiconductor device according to claim 1 , further comprising:

a plurality of latch circuits having output nodes coupled to the plurality of input nodes, respectively.

3. The semiconductor device according to claim 2 , further comprising:

a plurality of bit lines;

a plurality of word lines; and

a plurality of memory cells arranged at intersections of the bit lines and the word lines, respectively;

wherein the fuse circuits are configured to store programmed information that indicates address information of at least a part of one of the plurality of memory cells.

4. The semiconductor device according to claim 3 , wherein the one of the plurality of memory cells is defective.

5. A semiconductor device comprising:

a plurality of input nodes configured to be supplied with input signals, wherein a number of the input nodes of the plurality of input nodes is equal to M (M is an integer of two or more) to receive M number of the input signals;

a decoder coupled to the input nodes, the decoder configured to decode the input signals and output decoded signals and the decoder is configured to output 2 M number of the output signals; and

a plurality of fuse circuits provided correspondingly with the decoded signals and configured to be programmed responsive to the decoded signals, respectively.

6. The semiconductor device according to claim 5 , wherein a number of the fuse circuits is equal to 2 M .

7. The semiconductor device according to claim 6 , wherein the decoder is configured to activate one of the decoded signals and inactivate the others of the decoded signals.

8. A semiconductor device comprising:

a plurality of input nodes configured to be supplied with input signals, wherein a number of the input nodes of the plurality of input nodes is equal to M (M is an integer of two or more) to receive M number of the input signals;

a decoder coupled to the input nodes, the decoder configured to decode the input signals and output decoded signals and the decoder is configured to output (2 M −1) number of the output signals; and

a plurality of fuse circuits provided correspondingly with the decoded signals and configured to be programmed responsive to the decoded signals, respectively.

9. The semiconductor device according to claim 8 , wherein the decoder is configured to inactivate all of the decoded signals when the input signals take a first pattern and the decoder is configured to activate one of the decoded signals when the input signals take a second pattern different from the first pattern.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 9, 2015
From: AKAMATSU, HIROSHI
To: MICRON TECHNOLOGY, INC.
Reel/Frame 035374/0200 →
Priority Claims (1)
JP 2014-088962 · Apr 23, 2014 · national
Continuity (1)
Related Publication 20150310926A1 · Oct 29, 2015