Power-module assembly

1. A method comprising:

arranging power stages in a cavity of a container such that the power stages are spaced apart from walls of the container;

inserting a core between each of the power stages;

putting resin into the cavity, the cores displacing the resin and creating resin-free areas;

curing the resin to form a power-module housing having chambers created by the resin-free areas, wherein the core is disposed in the chambers;

removing the core to reveal coolant pockets within the chambers; and

installing a manifold on top of the power stages, wherein the manifold further includes an inlet stub defining a port, and wherein the manifold is inserted into the cavity such that the inlet stub extends through a wall of the housing.

2. The method of claim 1 wherein each of the power stages further includes semiconductor devices and at least one terminal.

3. The method of claim 2 wherein the power stages are arranged in the container such that the at least one terminal extends through one of the walls of the container.

4. The method of claim 1 wherein removing the core includes dissolving the core with a solvent.

5. The method of claim 1 further comprising inserting a flow guide into each of the coolant pockets.

6. The method of claim 1 wherein the resin is epoxy.

7. The method of claim 1 wherein the power stages are arranged in the cavity in a linear array with spacing between each of the power stages.

8. The method of claim 1 wherein the core includes fingers disposed between adjacent ones of the power stages.

9. The method of claim 1 wherein the resin is poured in two stages.

10. The method of claim 1 wherein the manifold defines openings and the manifold is installed so that the openings are in fluid communication with the coolant chambers.

11. A method of forming a power-module assembly comprising:

arranging power stages in a cavity of a container such that the power stages are spaced apart from walls of the container;

inserting a core between each of the power stages;

putting resin into the cavity such that the cores create resin-free areas;

curing the resin to form a housing of the power-module assembly;

removing the core to reveal coolant chambers between each of the power stages;

installing a manifold on top of the power stages; and

inserting flow guides with each flow guide being received in one of the chambers, wherein the flow guides are in fluid communication with the manifold.

12. The method of claim 11 wherein removing the core includes dissolving the core with a solvent.

13. A method of forming a power-module assembly comprising:

arranging power stages in a cavity of a container such that the power stages are spaced apart from walls of the container and from each other;

inserting a core between each of the power stages;

putting a first phase of resin into the cavity such that the cores create resin-free areas;

curing the first phase of resin to form a partial housing of the power-module assembly;

removing the core to reveal coolant chambers between the power stages;

installing a manifold, having an inlet stub that defines a port, on top of the power stages; and

putting a second phase of resin into the cavity such that the second phase of resin hardens to the partial housing to form a complete housing of the power-module assembly, wherein the inlet stub extends through a wall of the complete housing.

14. The method of claim 13 wherein each of the power stages includes semiconductor devices and at least one terminal, and the power stages are arranged in the cavity with the terminals extending through the container.

15. The method of claim 14 further comprising applying sealant on the container around the terminals.

16. The method of claim 13 wherein removing the core includes dissolving the core with a solvent.

17. The method of claim 13 wherein the core includes fingers disposed between adjacent ones of the power stages.

18. The method of claim 13 wherein the second phase of resin in put into the cavity after the manifold is installed.