Metal oxide film and method for forming metal oxide film
A metal oxide film including a crystal part and having highly stable physical properties is provided. The size of the crystal part is less than or equal to 10 nm, which allows the observation of circumferentially arranged spots in a nanobeam electron diffraction pattern of the cross section of the metal oxide film when the measurement area is greater than or equal to 5 nmφ and less than or equal to 10 nmφ.
1. An active matrix display device comprising a pixel, the pixel comprising a pixel electrode and a first transistor electrically connected to the pixel electrode, the first transistor comprising:
an oxide semiconductor film comprising a crystalline part, the oxide semiconductor film including a channel formation region; and
a gate electrode adjacent to the channel formation region with a gate insulating layer therebetween,
wherein the oxide semiconductor film includes a first metal, a second metal, and a third metal,
wherein the first metal is indium, the second metal is zinc, and the third metal is any one of Al, Ti, Ga, Y, Zr, La, Ce, Nd and Hf,
wherein a size of the crystalline part is less than or equal to 10 nm,
wherein a plurality of circumferentially distributed spots are observable in a measurement area greater than or equal to an area with a diameter of 5 nmφ and less than or equal to an area with a diameter of 10 nmφ in a nanobeam electron diffraction pattern of a cross-section of the oxide semiconductor film, and
wherein a halo pattern is observable in a selected-area electron diffraction pattern of a plane of the oxide semiconductor film,
wherein a crystalline peak is not observable in an XRD spectrum with respect to the oxide semiconductor film.
2. The active matrix display device according to claim 1 , wherein the third metal is gallium.
3. The active matrix display device according to claim 1 , wherein a size of the crystalline part is less than or equal to 5 nm.
4. The active matrix display device according to claim 1 , wherein the gate electrode is located below the oxide semiconductor film.
5. The active matrix display device according to claim 1 , wherein the gate electrode is located above the oxide semiconductor film.
6. The active matrix display device according to claim 1 , wherein the pixel further comprises a second transistor, and wherein the gate electrode of the first transistor is connected to one of a source and a drain of the second transistor.
7. An active matrix display device comprising a pixel, the pixel comprising a pixel electrode and a first transistor electrically connected to the pixel electrode, the first transistor comprising:
an oxide semiconductor film comprising a crystalline part, the oxide semiconductor film including a channel formation region; and
a gate electrode adjacent to the channel formation region with a gate insulating layer therebetween,
wherein the oxide semiconductor film includes a first metal, a second metal, and a third metal,
wherein the first metal is indium, the second metal is zinc, and the third metal is any one of Al, Ti, Ga, Y, Zr, La, Ce, Nd and Hf,
wherein a size of the crystalline part is less than or equal to 10 nm,
wherein a plurality of circumferentially distributed spots are observable in a measurement area greater than or equal to an area with a diameter of 5 nmφ and less than or equal to an area with a diameter of 10 nmφ in a nanobeam electron diffraction pattern of a cross-section of the oxide semiconductor film, and
wherein a crystalline peak is not observable in an XRD spectrum with respect to the oxide semiconductor film.
8. The active matrix display device according to claim 7 , wherein a halo pattern is observable in a selected-area electron diffraction pattern of a plane of the oxide semiconductor film.
9. The active matrix display device according to claim 7 , wherein the third metal is gallium.
10. The active matrix display device according to claim 7 , wherein a size of the crystalline part is less than or equal to 5 nm.
11. The active matrix display device according to claim 7 , wherein the XRD spectrum is measured by an out-of-plane method.
12. The active matrix display device according to claim 7 , wherein the gate electrode is located below the oxide semiconductor film.
13. The active matrix display device according to claim 7 , wherein the gate electrode is located above the oxide semiconductor film.
14. The active matrix display device according to claim 7 , wherein the pixel further comprises a second transistor, wherein the gate electrode of the first transistor is connected to one of a source and a drain of the second transistor.
15. An active matrix display device comprising a pixel, the pixel comprising a pixel electrode and a first transistor electrically connected to the pixel electrode, the first transistor comprising:
an oxide semiconductor film comprising a crystalline part, the oxide semiconductor film including a channel formation region; and
a gate electrode adjacent to the channel formation region with a gate insulating layer therebetween,
wherein the oxide semiconductor film includes a first metal, a second metal, and a third metal,
wherein the first metal is indium, the second metal is zinc, and the third metal is any one of Al, Ti, Ga, Y, Zr, La, Ce, Nd and Hf,
wherein a size of the crystalline part is less than or equal to 10 nm,
wherein a plurality of circumferentially distributed spots are observable in a measurement area greater than or equal to an area with a diameter of 5 nmφ and less than or equal to an area with a diameter of 10 nmφ in a nanobeam electron diffraction pattern of a cross-section of the oxide semiconductor film, and
wherein spots having order of regularity that represents a crystal state in which crystal parts are aligned with a specific plane are observable in the measurement area greater than or equal to an area with a diameter of 5 nmφ and less than or equal to an area with a diameter of 10 nmφ in the cross-sectional direction of the measurement area of a film thinned from the oxide semiconductor film to be less than or equal to 10 nm,
wherein a crystalline peak is not observable in an XRD spectrum with respect to the oxide semiconductor film.
16. The active matrix display device according to claim 15 , wherein a halo pattern is observable in a selected-area electron diffraction pattern of a plane of the oxide semiconductor film.
17. The active matrix display device according to claim 15 , wherein the third metal is gallium.
18. The active matrix display device according to claim 15 , wherein a size of the crystalline part is less than or equal to 5 nm.
19. The active matrix display device according to claim 15 , wherein the gate electrode is located below the oxide semiconductor film.
20. The active matrix display device according to claim 15 , wherein the gate electrode is located above the oxide semiconductor film.
21. The active matrix display device according to claim 15 , wherein the pixel further comprises a second transistor, wherein the gate electrode of the first transistor is connected to one of a source and a drain of the second transistor.
22. An active matrix display device comprising a pixel, the pixel comprising a pixel electrode and a first transistor electrically connected to the pixel electrode, the first transistor comprising:
a first oxide semiconductor film;
a second oxide semiconductor film on the first oxide semiconductor film;
a gate electrode adjacent to one of the first oxide semiconductor film and the second oxide semiconductor film with a gate insulating film interposed therebetween,
wherein at least one of the first oxide semiconductor film and the second oxide semiconductor film includes a first metal, a second metal, and a third metal,
wherein the at least one of the first oxide semiconductor film and the second oxide semiconductor film comprises a crystalline part,
wherein the first metal is indium, the second metal is zinc, and the third metal is any one of Al, Ti, Ga, Y, Zr, La, Ce, Nd and Hf,
wherein a size of the crystalline part is less than or equal to 10 nm, and
wherein a plurality of circumferentially distributed spots are observable in a measurement area greater than or equal to an area with a diameter of 5 nmφ and less than or equal to an area with a diameter of 10 nmφ in a nanobeam electron diffraction pattern of a cross-section of the at least one of the first oxide semiconductor film and the second oxide semiconductor film,
wherein a crystalline peak is not observable in an XRD spectrum with respect to the at least one of the oxide semiconductor film.
23. The active matrix display device according to claim 22 , wherein a halo pattern is observable in a selected-area electron diffraction pattern of a plane of the at least one of the first oxide semiconductor film and the second oxide semiconductor film.
24. The active matrix display device according to claim 22 , wherein the third metal is gallium.
25. The active matrix display device according to claim 22 , wherein a size of the crystalline part is less than or equal to 5 nm.
26. The active matrix display device according to claim 22 , wherein the gate electrode is located below the first oxide semiconductor film.
27. The active matrix display device according to claim 22 , wherein the gate electrode is located above the second oxide semiconductor film.
28. The active matrix display device according to claim 22 , wherein the pixel further comprises a second transistor, wherein the gate electrode of the first transistor is connected to one of a source and a drain of the second transistor.
29. The active matrix display device according to claim 22 , wherein energy level of a conduction band minimum of the second oxide semiconductor film is closer to a vacuum level than energy level of a conduction band minimum of the first oxide semiconductor film.