Batch-type remote plasma processing apparatus
View Patent ↗A plasma processing apparatus comprises a processing chamber in which a plurality of substrates are stacked and accommodated; a pair of electrodes extending in the stacking direction of the plurality of substrates, which are disposed at one side of the plurality of substrates in said processing chamber, and to which high frequency electricity is applied; and a gas supply member which supplies processing gas into a space between the pair of electrodes.
1. A method of manufacturing a semiconductor device comprising:
accommodating a plurality of substrates in a processing chamber provided in a processing tube;
activating a processing gas in a plasma generating chamber that extends outside of a circumference of the processing tube by applying electricity to an electrode;
supplying the processing gas from the plasma generating chamber to the processing chamber; and
removing the processing gas from the processing chamber via a gas exhaust opening formed in the processing tube,
wherein the electrode is provided outside of the plasma generating chamber.
2. The method of manufacturing a semiconductor device as recited in claim 1 , wherein the electrode has a cylindrical shape.
3. The method of manufacturing a semiconductor device as recited in claim 1 , wherein a wall with a blowout opening separates the processing chamber and the plasma generating chamber.
4. The method of manufacturing a semiconductor device as recited in claim 1 , wherein the gas exhaust opening is opened at the bottom of the processing tube.
5. The method of manufacturing a semiconductor device as recited in claim 1 , wherein the gas exhaust opening is opened at the top of the processing tube.
6. A method of manufacturing a semiconductor device comprising:
accommodating a plurality of substrates in a processing chamber provided in a processing tube;
activating a processing gas in a plasma generating chamber that extends outside of a circumference of the processing tube by applying electricity to an electrode;
supplying the processing gas from the plasma generating chamber to the processing chamber; and
removing the processing gas from the processing chamber via a gas exhaust opening formed in the processing tube,
wherein the electrode has a flat plate-like shape.
7. The method of manufacturing a semiconductor device as recited in claim 6 , wherein a wall with a blowout opening separates the processing chamber and the plasma generating chamber.
8. The method of manufacturing a semiconductor device as recited in claim 6 , wherein the gas exhaust opening is opened at the bottom of the processing tube.
9. A method of manufacturing a semiconductor device comprising:
accommodating a plurality of substrates in a processing chamber provided in a processing tube;
activating a processing gas in a plasma generating chamber in communication with the processing chamber by applying electricity to an electrode that is provided outside of the plasma generating chamber;
supplying the processing gas to the processing chamber; and
removing the processing gas from the processing chamber via a gas exhaust opening formed in the processing tube.
10. The method of manufacturing a semiconductor device according to claim 9 , wherein the electrode has a flat plate-like shape.
11. The method of manufacturing a semiconductor device according to claim 10 , wherein the plasma generating chamber extends outside of a circumference of the processing tube.
12. The method of manufacturing a semiconductor device according to claim 11 , wherein a wall with a blowout opening separates the processing chamber and the plasma generating chamber.
13. The method of manufacturing a semiconductor device according to claim 9 , wherein no wall separates the plasma generating chamber and the processing chamber.
14. The method of manufacturing a semiconductor device according to claim 13 , wherein the electrode has a flat plate-like shape.
15. The method of manufacturing a semiconductor device according to claim 14 , wherein another electrode having a cylindrical shape is provided inside of the plasma generating chamber.
16. The method of manufacturing a semiconductor device according to claim 10 , wherein the plasma generating chamber is formed inside of a circumference of the processing tube.
17. The method of manufacturing a semiconductor device according to claim 9 , wherein the gas exhaust opening is opened at the bottom of the processing tube.
18. The method of manufacturing a semiconductor device according to claim 9 , wherein the gas exhaust opening is opened at the top of the processing tube.