IP Library Granted Patent US 10,220,426
Granted Patent B2
US 10,220,426 · App. 14/692,591 · Granted Mar 5, 2019

Device and method for generating channel letters

Inventor: Kyong-Chan Lim (San Diego, CA)
Assignees: SEOUL LASER DIEBOARD SYSTEM CO., LTD; SEOUL LASER DIEBOARD SYSTEM CO., LTD LLP
B21D11/08G09F7/16Y10T29/49906
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,220,426
App. No.
14/692,591
Granted
Mar 5, 2019
Kind
B2
Abstract

The disclosure provides a method and apparatus for forming a channel letter box using a profile. The method can include determining an incision position on one surface of the profile where at least one surface incision is to be made. The profile can be surface incised at the determined position. The profile can be folded at the incision position to form the channel letter box. The profile can have at least one rib on one surface. The method can also include cutting and attaching a top plate to the channel letter box, wherein a thickness of the top plate is substantially close to a distance from the top of the profile to the top of a top rib of the at least one rib.

Claims (30)

1. A method of forming a channel letter using a rule, the method comprising:

determining at least one incision position on the rule,

the rule having first and second surfaces forming a side of the channel letter;

selecting a surface incision angle to enable the rule to be folded by the surface incision angle so that the rule can be folded into a desired channel letter shape;

surface incising, using a sawing unit, at the at least one incision position by the surface incision angle to create at least one surface incision on the first surface, the at least one surface incision oriented substantially transverse to a longitudinal axis of the rule and penetrating a cut depth into an entire width of the first surface of the rule, the cut depth being less than a rule thickness, the longitudinal axis of the rule being an axis along which the rule is fed into a rule bending device,

wherein surface incising includes determining a number of incisions to make at the at least one incision position to form the desired channel letter shape;

folding the rule at the at least one incision position to form the channel letter, the first surface being disposed on an inside of the channel letter and the second surface, opposite the first surface, being disposed on an outside of the channel letter.

2. The method of claim 1 wherein the at least one surface incision removes a portion of the rule at the incision position allowing a fold at the incision position.

3. The method of claim 1 further comprising:

surface incising the rule at two or more incision positions; and

folding the rule at the two or more incision positions to form the channel letter having a curve.

4. The method of claim 1 further comprising:

surface incising the rule at one incision position; and

folding the rule at the one incision position to form a channel letter having a corner.

5. The method of claim 1 , wherein the rule has a rule height measuring 25 to 200 millimeters.

6. The method of claim 1 , wherein the rule has a rule thickness between 0.2 to 1.5 millimeters.

7. A method of forming a channel letter using a rule, the method comprising:

determining at least one incision position and a corresponding incision depth on the rule,

the rule having first and second surfaces forming a side of the channel letter;

selecting a surface incision angle to enable the rule to be folded by the surface incision angle so that the rule can be folded into a desired channel letter shape;

surface incising by the surface incision angle at the at least one incision position and for the corresponding incision depth using a sawing unit, the sawing unit being configured to make a surface incision into an entire width of the first surface in a direction substantially transverse to a longitudinal axis of the rule, the longitudinal axis of the rule being an axis along which the rule is fed into a rule bending device,

wherein surface incising includes determining a number of incisions to make at the at least one incision position to form the desired channel letter shape; and

folding the rule at the incision position by the surface incision angle using a folding unit to form the channel letter, the first surface of the rule being on an inside of the channel letter.

8. The method of claim 7 wherein the at least one surface incision removes a portion of the rule at the incision position allowing a fold at the incision position.

9. The method of claim 7 further comprising:

surface incising the rule at two or more incision positions; and

folding the rule at the two or more incision positions to form a channel letter having a curve.

10. The method of claim 7 wherein the at least one surface incision has an open edge and a closed edge, the open edge being wider than the closed edge, defining a surface incision angle and giving the at least one surface incision a V-shape.

11. The method of claim 7 , wherein the rule has a rule height measuring 25 to 200 millimeters.

12. The method of claim 4 , wherein the rule has a rule thickness between 0.2 to 1.5 millimeters.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 16, 2023
From: SEOUL LASER DIEBOARD SYSTEM CO., LTD.
To: SDNS, INC.; SEOUL LASER DIEBOARD SYSTEM CO., LTD.
Reel/Frame 064610/0803 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2015
From: LIM, KYONG-CHAN
To: SEOUL LASER DIEBOARD SYSTEM CO., LTD; SEOUL LASER DIEBOARD SYSTEM CO., LTD LLP
Reel/Frame 036599/0889 →
Continuity (3)
Continuation In Part 13458883 · Apr 27, 2012
Continuation In Part 13133133 · Jan 10, 2012
Related Publication 20150224555A1 · Aug 13, 2015