IP Library › Assignment 064610/0803
Patent Assignment
Reel/Frame 064610/0803

Assignment of Assignor's Interest

Recorded: 2023-08-16 Pages: 4
Assignor
Assignees
SDNS, INC.
27171 BURBANK, LAKE FOREST, CALIFORNIA, 92610
SEOUL LASER DIEBOARD SYSTEM CO., LTD.
13, HEUNGAN-DAERO, 49 BEON-GIL, DONGAN-GU, ANYANG-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Properties (20)
Channel Letter Machine and Method Thereof
Patent: 7,441,434 →
Application: 11/431,246 →
Publication: US 2007/0261460
Channel Letter Machine and Method Thereof
Patent: 7,878,039 →
Application: 12/234,847 →
Publication: US 2009/0013747
Generating Channel Letters Using Profiles
Patent: 9,126,252 →
Application: 13/458,883 →
Publication: US 2012/0324705
Profiles Used in Generating Channel Letters
Patent: 9,262,946 →
Application: 14/632,275 →
Publication: US 2015/0170553
Device and Method for Generating Channel Letters
Application: 14/692,591 →
Publication: US 2015/0224555
Frame Panel for Three-Dimensional Sign Board
Patent: 9,721,486 →
Application: 15/021,676 →
Publication: US 2016/0225295
Device for Securing Channel Letter Plates
Application: 15/093,609 →
Publication: US 2016/0298665
Channel Bender
Application: 15/094,867 →
Publication: US 2016/0297015
Device with Multiple Units for Processing Strips of Material
Application: 15/153,625 →
Publication: US 2016/0256966
Methods and Apparatus for Cutting Profiles
Application: 15/169,552 →
Publication: US 2016/0271708
Sharp Angle Notching Marks
Application: 15/614,360 →
Publication: US 2017/0348749
Cut-Crease Rule for Dieboard
Application: 15/849,340 →
Publication: US 2018/0178477
Liquiform Channel Letter
Application: 15/851,446 →
Publication: US 2018/0182266
Reverse Liquiform Channel Letter
Application: 15/851,473 →
Publication: US 2018/0182265
Dieboard Padding
Application: 15/904,073 →
Publication: US 2018/0236683
Adding Cutting Stations to Bending Systems
Application: 15/906,985 →
Publication: US 2018/0244011
Letter Box with Auto Riveting
Application: 16/172,558 →
Publication: US 2019/0126338
Letter Box with Auto Riveting
Application: 16/203,398 →
Publication: US 2019/0160512
Auto Brushing Device for Benders
Application: 16/356,981 →
Publication: US 2019/0283085
Methods and Apparatus for Cutting Profiles
Application: 16/379,552 →
Publication: US 2019/0232397
Related Assignments (19)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 4, 2006
From: PARK, JU WOONG; CHO, MAN SIK; LEE, SANG MOO; SONG, BYOUNG YOUNG
To: SDS USA, INC.
Reel/Frame 018145/0813 →
Assignment of Assignor's Interest May 10, 2011
From: SDS USA, INC.
To: SEOUL LASER DIEBOARD SYSTEMS CO., LTD.
Reel/Frame 026256/0030 →
Assignment of Assignor's Interest May 10, 2011
From: SDS USA, INC.
To: SEOUL LASER DIEBOARD SYSTEMS CO., LTD.
Reel/Frame 026255/0952 →
Assignment of Assignor's Interest Sep 11, 2012
From: LIM, KYONG-CHAN; ADAMS, MIKE
To: SEOUL LASER DIEBOARD SYSTEM CO., LTD.
Reel/Frame 028937/0708 →
Assignment of Assignor's Interest Sep 14, 2015
From: LIM, KYONG-CHAN
To: SEOUL LASER DIEBOARD SYSTEM CO., LTD; SEOUL LASER DIEBOARD SYSTEM CO., LTD LLP
Reel/Frame 036599/0889 →
Assignment of Assignor's Interest Sep 23, 2015
From: LIM, KYONG-CHAN
To: SEOUL LASER DIEBOARD SYSTEM CO., LTD
Reel/Frame 036664/0829 →
Assignment of Assignor's Interest Jun 1, 2016
From: LEE, SANG MOO
To: SEOUL LASER DIEBOARD SYSTEM CO., LTD.
Reel/Frame 038763/0092 →
Assignment of Assignor's Interest Jan 6, 2017
From: LEE, SANG MOO
To: SEOUL LASER DIEBOARD SYSTEM CO. LTD.
Reel/Frame 040876/0028 →
Assignment of Assignor's Interest Jan 6, 2017
From: LEE, SANG MOO
To: SEOUL LASER DIEBOARD SYSTEM CO. LTD.
Reel/Frame 040874/0234 →
Assignment of Assignor's Interest Jan 10, 2017
From: YOON, KWANG YRUL; LEE, SANG MOO
To: SEOUL LASER DIEBOARD SYSTEM CO. LTD.
Reel/Frame 040933/0065 →
Assignment of Assignor's Interest Oct 11, 2017
From: LIM, KYONG CHAN
To: SEOUL LASER DIEBOARD SYSTEM CO., LTD.
Reel/Frame 043837/0036 →
Assignment of Assignor's Interest Jul 27, 2018
From: LIM, KYONG CHAN
To: SEOUL LASER DIEBOARD SYSTEM CO., LTD.
Reel/Frame 046484/0598 →
Assignment of Assignor's Interest Jul 27, 2018
From: LIM, KYONG CHAN
To: SEOUL LASER DIEBOARD SYSTEM CO., LTD.
Reel/Frame 046484/0403 →
Assignment of Assignor's Interest Jul 27, 2018
From: LIM, KYONG CHAN
To: SEOUL LASER DIEBOARD SYSTEM CO., LTD.
Reel/Frame 046484/0280 →
Assignment of Assignor's Interest Jul 27, 2018
From: LIM, KYONG CHAN
To: SEOUL LASER DIEBOARD SYSTEM CO., LTD.
Reel/Frame 046642/0538 →
Assignment of Assignor's Interest Jul 27, 2018
From: LIM, KYONG CHAN
To: SEOUL LASER DIEBOARD SYSTEM CO., LTD.
Reel/Frame 046484/0073 →
Assignment of Assignor's Interest Mar 19, 2019
From: LIM, KYONG CHAN
To: SEOUL LASER DIEBOARD SYSTEM CO., LTD.
Reel/Frame 048632/0585 →
Assignment of Assignor's Interest Mar 19, 2019
From: LIM, KYONG CHAN
To: SEOUL LASER DIEBOARD SYSTEM CO., LTD.
Reel/Frame 048632/0885 →
Assignment of Assignor's Interest Dec 19, 2019
From: LIM, KYONG CHAN
To: SEOUL LASER DIEBOARD SYSTEM CO., LTD.
Reel/Frame 051336/0586 →