IP Library Granted Patent US 11,235,488
Granted Patent B2
US 11,235,488 · App. 15/904,073 · Granted Feb 1, 2022

Dieboard padding

Inventor: Kyong Chan Lim (San Diego, CA)
Assignee: Seoul Laser Dieboard System Co., Ltd.
B26F1/44B21D37/205B26D7/1818B26F1/40B30B15/02B31B50/14B31B50/142B31B50/252B26F2001/4463B31B2100/0022B31B2110/35
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Quick Facts
Patent No.
US 11,235,488
App. No.
15/904,073
Granted
Feb 1, 2022
Kind
B2
Abstract

Applying padding material around shaped cutting blades includes: receiving a blade shape diagram and a rule of blade; bending the rule of blade according to the blade shape diagram to produce the shaped cutting blades; and applying the padding material around the shaped cutting blades using the blade shape diagram to produce a padded shaped cutting blade, wherein the padding material provides a spring action to quickly detach the shaped cutting blades from a plate matter.

Claims (12)

1. A system for applying padding material around shaped cutting blades for a dieboard, the system comprising:

a padding applicator configured to receive a blade shape diagram and apply padding material around a shaped cutting blades using the blade shape diagram to produce a padded shaped cutting blade for the dieboard,

wherein the shaped cutting blades is received as an output from a bender which bends an unshaped rule of blade into the shaped cutting blades using the blade shape diagram,

wherein the padding applicator applies the padding material around the shaped cutting blades by spraying a foam padding around the shaped cutting blades, wherein the padding applicator is also configured to move above the shaped cutting blades to apply the padding material according to the blade shape diagram adjacent to the shaped cutting blades, wherein the padding material provides a spring action.

2. The system of claim 1 , further comprising

a pattern board configured to receive the shaped cutting blades.

3. The system of claim 2 , wherein the padding applicator further comprises

a sprayer configured to spray the padding material onto the pattern board.

4. The system of claim 2 , wherein the padding applicator further comprises

a tube to enable the padding material to be squeezed onto the pattern board.

5. The system of claim 4 , further comprising

a plurality of nozzles configured to enable the padding material to be applied from the tube at multiple points around the shaped cutting blades.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 16, 2023
From: SEOUL LASER DIEBOARD SYSTEM CO., LTD.
To: SDNS, INC.; SEOUL LASER DIEBOARD SYSTEM CO., LTD.
Reel/Frame 064610/0803 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 27, 2018
From: LIM, KYONG CHAN
To: SEOUL LASER DIEBOARD SYSTEM CO., LTD.
Reel/Frame 046484/0403 →
Continuity (2)
Provisional Application 62462545 · Feb 23, 2017
Related Publication 20180236683A1 · Aug 23, 2018
Cited By (4)
US 12,269,234 US 12,515,431 US 12,649,295 US 12,691,655