IP Library › Patent Application 16379552
Patent Application
App. No. 16/379,552

METHODS AND APPARATUS FOR CUTTING PROFILES

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Quick Facts
Patent No.
US None
App. No.
16/379,552
Abstract

An apparatus for cutting a profile, including: a cutter configured to make cuts on the profile having a first surface and a second surface, and having at least one rib on the first surface, wherein the cuts are made on the first surface of the profile; a first drive unit to drive the cutter forward and backward to and from the first surface of the profile; and a second drive unit to drive the cutter up and down along the first surface of the profile.

Claims (4)

1 . An apparatus for cutting a profile, comprising:

a cutter configured to make cuts on the profile having a first surface and a second surface, and having at least one rib on the first surface, wherein the cuts are made on the first surface of the profile;

a first drive unit to drive said cutter forward and backward to and from the first surface of the profile; and

a second drive unit to drive said cutter up and down along the first surface of the profile.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 16, 2023
From: SEOUL LASER DIEBOARD SYSTEM CO., LTD.
To: SDNS, INC.; SEOUL LASER DIEBOARD SYSTEM CO., LTD.
Reel/Frame 064610/0803 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 10, 2023
From: LEE, SANG MOO
To: SEOUL LASER DIEBOARD SYSTEM CO., LTD.
Reel/Frame 063280/0583 →