IP Library Granted Patent US 10,265,786
Granted Patent B2
US 10,265,786 · App. 15/169,552 · Granted Apr 23, 2019

Methods and apparatus for cutting profiles

Inventor: Sang Moo Lee (Kyong-gi Do, KR)
Assignee: SEOUL LASER DIEBOARD SYSTEM CO., LTD.
B23D15/002B21D11/08B21D28/02B23D23/00B21D28/243Y10T83/0524Y10T83/162Y10T83/8736
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,265,786
App. No.
15/169,552
Granted
Apr 23, 2019
Kind
B2
Abstract

An apparatus for cutting a profile, including: a cutter configured to make cuts on the profile having a first surface and a second surface, and having at least one rib on the first surface, wherein the cuts are made on the first surface of the profile; a first drive unit to drive the cutter forward and backward to and from the first surface of the profile; and a second drive unit to drive the cutter up and down along the first surface of the profile.

Claims (16)

1. A method for making cuts on a first surface of a profile to enable folding of the profile to make a channel letter, the method comprising:

determining positions of the cuts to be made on the first surface of the profile,

wherein the positions of the cuts are determined along a longitudinal axis of the profile such that the cuts are appropriate for making curvatures of the channel letter;

feeding the profile into a folding machine along the longitudinal axis; and

making the cuts at the determined positions on the first surface of the profile in a transverse direction to the longitudinal axis by driving a cutter toward the first surface of the profile and moving the cutter in the transverse direction on the first surface of the profile,

wherein making the cuts on the first surface includes

making a first cut at a center line along the transverse direction, and

making at least one additional cut along the transverse direction on either side of the center line and the at least one additional cut having a cut depth into the first surface along an entire width of the profile,

wherein the center line is a first line about which the profile is to be folded centered at the first line,

wherein the first cut and the at least one additional cut are cuts for one fold of the profile of a particular angle made at the center line.

2. The method of claim 1 , wherein the profile also comprises at least one rib disposed on the first surface.

3. The method of claim 2 , wherein making the cuts on the first surface of the profile also comprises

making cuts to the at least one rib disposed on the first surface.

4. The method of claim 3 , wherein the cuts made to the at least one rib are v-cuts.

5. The method of claim 1 , wherein moving the cutter in the transverse direction on the first surface of the profile comprises

moving the cutter up and down in the transverse direction.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 16, 2023
From: SEOUL LASER DIEBOARD SYSTEM CO., LTD.
To: SDNS, INC.; SEOUL LASER DIEBOARD SYSTEM CO., LTD.
Reel/Frame 064610/0803 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 1, 2016
From: LEE, SANG MOO
To: SEOUL LASER DIEBOARD SYSTEM CO., LTD.
Reel/Frame 038763/0092 →
Priority Claims (1)
KR 10-2007-0112810 · Nov 6, 2007 · national
Continuity (2)
Continuation 13133133
Related Publication 20160271708A1 · Sep 22, 2016