Moving image sensor package
A moving image sensor package is provided that may be used to provide optical image stabilization (OIS) in the same form factor as non-OIS enabled image sensors utilized in portable/mobile devices. The moving image sensor package includes an image sensor attached to a MEMS actuator mounted within a cutout in a circuit board, wherein the MEMS actuator has substantially the same thickness as the circuit board.
1. An image sensor package, comprising:
an image sensor;
a circuit board having a cutout;
a MEMS actuator having substantially the same thickness as the circuit board and configured to fit within the cutout;
a back plate; and
a cap comprising a window, wherein the back plate and MEMS actuator are configured with a gap formed between the back plate and a moving portion of the MEMS actuator, wherein the gap is less than 50 micrometers.
2. The image sensor package of claim 1 , wherein the image sensor is mounted on a moving portion of the MEMS actuator.
3. The image sensor package of claim 2 , wherein a shock absorbent bonding material is used to mount the image sensor on the moving portion of the MEMS actuator.
4. The image sensor package of claim 1 , wherein the MEMS actuator and the image sensor are encapsulated by the circuit board and the cap.
5. The image sensor package of claim 1 , wherein the cap further comprises an infrared cut filter.
6. The image sensor package of claim 1 , wherein the image sensor is electrically connected to the MEMS actuator, and the MEMS actuator is electrically connected to the circuit board.
7. The image sensor package of claim 1 , wherein the MEMS actuator moves in a rotational degree of freedom and a linear degree of freedom.
8. The image sensor package of claim 1 , wherein the cap further comprises motion limiting components designed to limit the motion of the image sensor.
9. The image sensor package of claim 1 , wherein a fixed portion of the MEMS actuator is attached to the back plate.
10. A camera in a portable electronic device, comprising:
an image sensor;
a MEMS actuator for moving the image sensor;
a circuit board; and
a back plate and a cap that are configured to attach onto the circuit board and encapsulate the MEMS actuator and the image sensor, wherein the back plate and MEMS actuator are configured with a gap formed between the back plate and a moving portion of the MEMS actuator, wherein the gap is less than 50 micrometers.
11. The camera of claim 10 , wherein the circuit board has an opening and the MEMS actuator is mounted substantially inside the opening.
12. The camera of claim 10 , wherein the MEMS actuator forms an electrical contact to the circuit board; and the image sensor forms an electrical contact to the MEMS actuator.
13. The camera of claim 10 , wherein the cap further comprises motion limiting components designed to limit the motion of the image sensor.
14. The camera of claim 10 , wherein the MEMS actuator moves in a rotational degree of freedom.
15. The camera of claim 10 , wherein the MEMS actuator moves in a linear degree of freedom.
16. A method of packaging an image sensor, comprising:
providing a circuit board with a cutout;
attaching a MEMS actuator such that it fits substantially within the cutout of the circuit board;
attaching an image sensor onto a moving portion of the MEMS actuator;
attaching a back plate onto the circuit board; and
forming a gap between the back plate and the moving portion of the MEMS actuator, wherein the gap is less than 50 micrometers.
17. The method of claim 16 , further comprising:
providing a cap with a window; and
encapsulating the MEMS actuator and the image sensor by bonding the cap onto the circuit board.
18. The method of claim 16 , further comprising:
electrically connecting the MEMS actuator to the circuit board; and
electrically connecting the image sensor to the MEMS actuator.
19. The method of claim 18 , wherein the electrical connection is made through one or more of conductive epoxy, wire bonding, or solder bridges.