IP Library Granted Patent US 9,305,789
Granted Patent B2
US 9,305,789 · App. 14/693,118 · Granted Apr 5, 2016

Semiconductor device comprising an active layer and a Schottky contact

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Quick Facts
Patent No.
US 9,305,789
App. No.
14/693,118
Granted
Apr 5, 2016
Kind
B2
Abstract

A semiconductor device comprising at least one active layer on a substrate and a a Schottky contact to the at least one active layer, the Schottky contact comprising a body of at least titanium and nitrogen that is electrically coupled with the at least one active layer.

Claims (8)

1. A semiconductor device comprising at least one active layer on a substrate and a Schottky contact to the at least one active layer, the Schottky contact comprising a body of at least titanium and nitrogen that is electrically coupled with the at least one active layer;

in which the body of the Schottky contact comprises a first TiW sub-layer nearest to the at least one active layer, a second TiW sub-layer farthest from the at least one active layer, and a TiW(N) sub-layer in-between the first and second TiW sub-layers.

2. A semiconductor device according to claim 1 , in which the TiW(N) sub-layer has a thickness exceeding the combined thickness of the first and second TiW sub-layers such that the properties of the sub-layer stack are dominated by the TiW(N) sub-layer.

3. A semiconductor device according to claim 1 , in which the Schottky contact comprises a stack having an active layer portion adapted to be coupled to the at least one active layer and a connection portion coupled to the active layer portion for providing a connection to the Schottky contact, wherein the body forms the active layer portion and the connection portion has a lower resistance than the active layer portion.

4. A semiconductor device according to claim 3 , in which the connection portion comprises Aluminium.

5. A semiconductor device according to claim 1 , in which the Schottky contact is laterally delimited by an electrically insulating material.

6. A semiconductor device according to claim 1 , in which the semiconductor device comprises a gallium nitride active layer.

7. An integrated circuit including the semiconductor device as defined in claim 1 .

Assignments (12)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 13, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 048328/0964 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 8, 2016
From: NXP B.V.
To: NEXPERIA B.V.
Reel/Frame 039610/0734 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 24, 2015
From: DONKERS, JOHANNES JOSEPHUS THEODORUS MARINUS; HEIL, STEPHAN BASTIAAN SIMON; AAN DE STEGGE, JOS
To: NXP B.V.
Reel/Frame 035488/0230 →