IP Library › Granted Patent US 9,624,577
Granted Patent B2
US 9,624,577 · App. 14/697,385 · Granted Apr 18, 2017

Deposition of metal doped amorphous carbon film

Inventors: Pramit Manna (Sunnyvale, CA); Abhijit Basu Mallick (Fremont, CA); Mukund Srinivasan (Fremont, CA); Rui Cheng (Santa Clara, CA)
Assignee: APPLIED MATERIALS, INC.
C23C16/26C23C16/042C23C16/06C23C16/30H01J37/32091
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Quick Facts
Patent No.
US 9,624,577
App. No.
14/697,385
Granted
Apr 18, 2017
Kind
B2
Abstract

Embodiments of the present disclosure relate to a metal-doped amorphous carbon hardmask for etching the underlying layer, layer stack, or structure. In one embodiment, a method of processing a substrate in a processing chamber includes exposing a substrate to a gas mixture comprising a carbon-containing precursor and a metal-containing precursor, reacting the carbon-containing precursor and the metal-containing precursor in the processing chamber to form a metal-doped carbon layer over a surface of the substrate, forming in the metal-doped carbon layer a defined pattern of through openings, and transferring the defined pattern to an underlying layer beneath the metal-doped carbon layer using the metal-doped carbon layer as a mask. An etch hardmask using the inventive metal-doped amorphous carbon film provides reduced compressive stress, high hardness, and therefore higher etch selectivity.

Claims (21)

1. A method of processing a substrate in a processing chamber, comprising:

exposing a substrate to a gas mixture comprising a hydrocarbon-containing precursor and a metal-containing precursor;

thermally reacting the hydrocarbon-containing precursor and the metal-containing precursor in the processing chamber to form a metal-doped amorphous carbon layer over a surface of the substrate;

forming in the metal-doped amorphous carbon layer a defined pattern of through openings; and

transferring the defined pattern to an underlying layer beneath the metal-doped amorphous carbon layer using the metal-doped amorphous carbon layer as a mask.

2. The method of claim 1 , wherein the hydrocarbon-containing precursor comprises methane (CH 4 ), ethane (C 2 H 6 ), ethylene (C 2 H 4 ), propylene (C 3 H 6 ), propyne (C 3 H 4 ), propane (C 3 H 8 ), butane (C 4 H 10 ), butylene (C 4 H 8 ) and its isomers, butadiene (C 4 H 6 ), acetelyne (C 2 H 2 ), or combinations thereof.

3. A method of processing a substrate in a processing chamber, comprising:

exposing a substrate to a gas mixture comprising a carbon-containing precursor, a metal-containing precursor, a hydrogen, methane, ammonia, carbon monoxide, helium, nitrogen, argon, or any combination thereof, wherein the metal-containing precursor is a tungsten carbonyl compound comprising tungsten hexacarbonyl (W(CO) 6 );

reacting the carbon-containing precursor and the metal-containing precursor in the processing chamber to form a metal-doped amorphous carbon layer over a surface of the substrate;

forming in the metal-doped amorphous carbon layer a defined pattern of through openings; and

transferring the defined pattern to an underlying layer beneath the metal-doped amorphous carbon layer using the metal-doped amorphous carbon layer as a mask.

4. A method of processing a substrate in a processing chamber, comprising:

flowing a carbon-containing precursor into a processing chamber to expose the substrate to the carbon-containing precursor;

while flowing the carbon-containing precursor, exposing the substrate to a gas mixture comprising a metal-containing precursor and a reducing agent;

exposing the substrate to a plasma formed from the carbon-containing precursor, the metal-containing precursor, and the reducing agent to form a metal-doped amorphous carbon layer over a surface of the substrate;

forming a defined pattern of through openings in the metal-doped amorphous carbon layer; and

transferring the defined pattern to an underlying layer beneath the metal-doped amorphous carbon layer using the metal-doped amorphous carbon layer as a mask.

5. The method of claim 4 , wherein the metal-containing precursor is a gaseous halide of a metal.

6. The method of claim 5 , wherein the metal comprises titanium (Ti), zirconium (Zr), hafnium (Hf), vanadium (V), niobium (Nb), tantalum (Ta), chromium (Cr), molybdenum (Mo), tungsten (W), manganese (Mn), rhenium (Re), iron (Fe), cobalt (Co), nickel (Ni), copper (Cu), silver (Ag), gold (Au), palladium (Pd), platinum (Pt), rhodium (Rh), iridium (Ir), ruthenium (Ru), osmium (Os), or aluminum (Al).

7. The method of claim 4 , wherein the carbon-containing precursor comprises at least one hydrocarbon compound having a general formula C x H y , where x has a range of between 1 and 10 and y has a range of between 2 and 22.

8. The method of claim 4 , wherein the reducing agent comprises hydrogen, methane, ammonia, or carbon monoxide.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 10, 2015
From: MANNA, PRAMIT; MALLICK, ABHIJIT BASU; SRINIVASAN, MUKUND; CHENG, RUI
To: APPLIED MATERIALS, INC.
Reel/Frame 036059/0881 →
Continuity (2)
Provisional Application 62027460 · Jul 22, 2014
Related Publication 20160027614A1 · Jan 28, 2016