Compact power quad flat no-lead (PQFN) package
View Patent ↗Some exemplary embodiments of a multi-chip module (MCM) power quad flat no-lead (PQFN) semiconductor package utilizing a leadframe for electrical interconnections have been disclosed. One exemplary embodiment comprises a PQFN semiconductor package comprising a leadframe, a driver integrated circuit (IC) coupled to the leadframe, a plurality of vertical conduction power devices coupled to the leadframe, and a plurality of wirebonds providing electrical interconnects, including at least one wirebond from a top surface electrode of one of the plurality of vertical conduction power devices to a portion of the leadframe, wherein the portion of the leadframe is electrically connected to a bottom surface electrode of another of the plurality of vertical conduction power devices. In this manner, efficient multi-chip circuit interconnections can be provided in a PQFN package using low cost lead frames.
1. A power quad flat no-lead (PQFN) semiconductor package comprising:
a leadframe comprising a plurality of die pads;
a driver integrated circuit (IC) coupled to a top surface of a first die pad of said leadframe;
a plurality of vertical conduction power transistors including a first group of vertical conduction power transistors coupled to a top surface of a common die pad of said leadframe and a second group of vertical conduction power transistors individually coupled to respective top surfaces of separate die pads of said leadframe;
a top surface electrode of one of said first group of vertical conduction power transistors being electrically connected to a first plating, and a bottom surface electrode of one of said second group of vertical conduction power transistors being electrically connected to a second plating, said first plating being electrically coupled to said second plating;
wherein said common die pad has an exposed surface on a bottom surface of said PQFN semiconductor package that corresponds to an outline of said first plating; and
wherein a die pad of said separate die pads of said leadframe has an exposed surface on said bottom surface of said PQFN semiconductor package that corresponds to an outline of said second plating.
2. The PQFN semiconductor package of claim 1 , wherein said PQFN semiconductor package is configured as a full bridge power device.
3. The PQFN semiconductor package of claim 1 , wherein said leadframe is selectively plated with silver for enhanced adhesion.
4. The PQFN semiconductor package of claim 1 , wherein said first group of vertical conduction power transistors is positioned near a first edge of said package, and wherein said second group of vertical conduction power transistors is positioned near a second edge of said package.
5. The PQFN semiconductor package of claim 1 , wherein a footprint of the package is 12 mm by 12 mm or greater.
6. The PQFN semiconductor package of claim 1 , wherein said plurality of vertical conduction power transistors comprises power MOSFETs.
7. The PQFN semiconductor package of claim 1 , wherein said plurality of vertical conduction power transistors comprises IGBTs.
8. A power quad flat no-lead (PQFN) semiconductor package comprising:
a leadframe;
a driver integrated circuit (IC) coupled to a top surface of a first die pad of said leadframe;
a plurality of vertical conduction power transistors including a plurality of high side transistors coupled to a top surface of a common die pad of said leadframe and a plurality of low side transistors coupled to respective top surfaces of individual die pads of said leadframe;
a top surface electrode of one of said plurality of vertical conduction power transistors being electrically connected to a first plating, and a bottom surface electrode of another of said plurality of vertical conduction power transistors being electrically connected to a second plating, said first plating being electrically coupled to said second plating;
wherein said common die pad has an exposed surface on a bottom surface of said PQFN semiconductor package that corresponds to an outline of said first plating; and
wherein a die pad of said individual die pads of said leadframe has an exposed surface on said bottom surface of said PQFN semiconductor package that corresponds to an outline of said second plating.
9. The PQFN semiconductor package of claim 8 , wherein said PQFN semiconductor package is configured as a full bridge power device.
10. The PQFN semiconductor package of claim 8 , wherein said leadframe is selectively plated with silver for enhanced adhesion.
11. The PQFN semiconductor package of claim 8 , wherein a footprint of the package is 12 mm by 12 mm or greater.
12. The PQFN semiconductor package of claim 8 , wherein said plurality of vertical conduction power transistors has six (6) vertical conduction power transistors.
13. The PQFN semiconductor package of claim 8 , wherein said plurality of vertical conduction power transistors comprises power MOSFETs.
14. The PQFN semiconductor package of claim 8 , wherein said plurality of vertical conduction power transistors comprises IGBTs.
15. A power quad flat no-lead (PQFN) semiconductor package comprising:
a leadframe;
a driver integrated circuit (IC) coupled to a top surface of a first die pad of said lead frame;
a plurality of vertical conduction power transistors including a first group of vertical conduction power transistors coupled to a top surface of a common die pad and a second group of vertical transistors coupled to respective top surfaces of individual die pads of said leadframe,
a top surface electrode of one of said plurality of vertical conduction power transistors being electrically connected to a first plating, and a bottom surface electrode of another of said plurality of vertical conduction power transistors being electrically connected to a second plating, said first plating being electrically coupled to said second plating;
wherein said common die pad has an exposed surface on a bottom surface of said PQFN semiconductor package that corresponds to an outline of said first plating; and
wherein a die pad of said individual die pads of said leadframe has an exposed surface on said bottom surface of said PQFN semiconductor package that corresponds to an outline of said second plating.
16. The PQFN semiconductor package of claim 15 , wherein said PQFN semiconductor package is configured as a full bridge power device.
17. The PQFN semiconductor package of claim 15 , wherein said plurality of vertical conduction power transistors is divided into said first group positioned on said common die pad near a first edge of said PQFN semiconductor package and said second group positioned on said individual die pads near a second edge of said PQFN semiconductor package.
18. The PQFN semiconductor package of claim 15 , wherein a footprint of the package is 12 mm by 12 mm or greater.
19. The PQFN semiconductor package of claim 15 , wherein said plurality of vertical conduction power transistors comprises power MOSFETs.
20. The PQFN semiconductor package of claim 15 , wherein said plurality of vertical conduction power transistors comprises IGBTs.