LED package having mushroom-shaped lens with volume diffuser

1. A light-emitting device package comprising:

a body including top and bottom surfaces;

a cavity in the body, the cavity extending from the top surface towards the bottom surface and having a floor;

one or more LED (light-emitting-diode) dies disposed on the floor of the cavity;

an encapsulation layer disposed within the cavity over the one or more LED dies;

a socket formed over the encapsulation layer, the socket including a top surface, a socket sidewall, and a bottom surface, the socket sidewall disposed between the top surface and the bottom surface of the socket;

a lens disposed over the over the socket, the lens comprising two or more optical materials with different indices of refraction, the lens including a cap and a plug, the cap having an upper surface that has a spherical vertical cross-section and a lower surface, the plug having a planar bottom surface and a plug sidewall between the lower surface of the plug and the lower surface of the cap, the plug disposed within the socket, and the lower surface of the cap disposed adjacent the top surface of the socket; and

an adhesive layer disposed to attach the lower surface of the cap to the top surface of the socket, wherein a portion the adhesive layer is disposed between the encapsulation layer and the lower surface of the plug.

2. The light-emitting device package of claim 1 , wherein the lens comprises at least one glass material.

3. The light-emitting device package of claim 1 , wherein the lens comprises a mixture of two or more glass materials with different indices of refraction.

4. The light-emitting device package of claim 3 , wherein the two or more glass materials are selected from glass materials having trade names Schott FK54, Schott FK3, Schott SF58, Schott, SF59, BK7, BK10, or BK6.

5. The light-emitting device package of claim 1 , wherein the lens comprises a uniform mixture of two or more optical materials with different indices of refraction.

6. The light-emitting device package of claim 1 , wherein a portion the adhesive layer is disposed between the lower surface of the cap and the top surface of the package.

7. The light-emitting device package of claim 1 , wherein a portion of the adhesive layer is disposed between the sidewall of the cap and the sidewall of the socket.

8. The light-emitting device package of claim 1 , wherein the lower surface of the cap is a flat surface, and the top surface of the package is a flat surface.

9. The light-emitting device package of claim 1 , wherein a portion of the adhesive layer is disposed between the encapsulation layer and the lower surface of the plug.

10. The light-emitting device package of claim 1 , wherein the encapsulation layer comprises a thermal insulation layer.

11. The light-emitting device package of claim 1 , wherein the encapsulation layer comprises a luminescent layer.

12. The light-emitting device package of claim 1 , wherein the package comprises a ceramic material.

13. A light-emitting device package comprising:

a body including top and bottom surfaces;

a cavity in the body, the cavity extending from the top surface towards the bottom surface and having a floor;

a plurality of LED (light-emitting-diode) dies disposed on the floor of the cavity;

a socket formed over the plurality of LED dies, the socket including a top surface, a socket sidewall, and a bottom surface, the socket sidewall disposed between the top surface and the bottom surface of the socket; and

a lens disposed over the over the socket, the lens comprising a mixture of a silicone material and TiO2 particles, the lens including a cap and a plug, the cap having an upper surface that has a spherical vertical cross-section and a lower surface, the plug having a planar bottom surface and a plug sidewall between the lower surface of the plug and the lower surface of the cap, the plug disposed within the socket, and the lower surface of the cap disposed adjacent the top surface of the socket.

14. The light-emitting device package of claim 13 , wherein the lens comprises a uniform mixture of two or more optical materials with different indices of refraction.

15. The light-emitting device package of claim 13 , further comprising an encapsulation layer disposed within the cavity over the plurality of LED dies.

16. The light-emitting device package of claim 15 , further comprising an adhesive layer disposed to attach the lower surface of the cap to the top surface of the socket, wherein a portion the adhesive layer is disposed between the encapsulation layer and the lower surface of the plug.

17. The light-emitting device package of claim 13 , wherein the shape of the lens comprises a mushroom shape.

18. The light-emitting device package of claim 13 , wherein the plug sidewall is substantially perpendicular to the lower surface of the plug.

19. A light-emitting device package comprising:

a body including top and bottom surfaces;

a cavity in the body, the cavity extending from the top surface towards the bottom surface and having a floor;

a plurality of LED (light-emitting-diode) dies disposed on the floor of the cavity;

a socket formed over the plurality of LED dies, the socket including a top surface, a socket sidewall, and a bottom surface, the socket sidewall disposed between the top surface and the bottom surface of the socket; and

a glass lens disposed over the over the socket, the glass lens comprising a mixture of two or more glass materials with different indices of refraction, the lens including a cap and a plug, the cap having an upper surface that has a spherical vertical cross-section and a lower surface, the plug having a planar bottom surface and a plug sidewall between the lower surface of the plug and the lower surface of the cap, the plug disposed within the socket, and the lower surface of the cap disposed adjacent the top surface of the socket.