IP Library Granted Patent US 9,275,990
Granted Patent B2
US 9,275,990 · App. 14/703,710 · Granted Mar 1, 2016

Circuit and method for reducing BVii on highly overdriven devices

Inventors: John L. McCollum (Orem, UT); Fethi Dhaoui (Mountain House, CA)
Assignee: Microsemi SoC Corporation
H01L27/0629H01L28/20H01L29/0847H01L29/1079
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Quick Facts
Patent No.
US 9,275,990
App. No.
14/703,710
Granted
Mar 1, 2016
Kind
B2
Abstract

An integrated circuit is formed on a p-type semiconductor substrate connected to ground potential. A deep n-well is disposed in the p-type substrate. A p-well is disposed in the deep n-well. An n+ drain region and an n+ source region are disposed in the p-well, the n+ source region connected to a common potential. A p-type contact is disposed in the p-well and is connected to ground potential through a resistor.

Claims (17)

1. An integrated circuit comprising:

a p-type semiconductor substrate connected to ground potential;

a deep n-well disposed in the p-type substrate;

a p-well disposed in the deep n-well;

an n+ drain region and an n+ source region disposed in the p-well, the n+ source region connected to a common potential;

a p-type contact disposed in the p-well and arranged to connect the p-well to the common potential through a resistor having a resistance of between about 100 kΩ and about 500 kΩ.

2. The integrated circuit of claim 1 wherein the p-type contact is p- doped to form the resistor.

3. The integrated circuit of claim 1 wherein the resistor has a resistance of about 300 kΩ.

4. The integrated circuit of claim 1 wherein the p-type contact is formed as a long and narrow region to form the resistor.

5. The integrated circuit of claim 4 wherein the resistor has a resistance of between about 100 kΩ and about 500 kΩ.

6. The integrated circuit of claim 5 wherein the resistor has a resistance of about 300 kΩ.

7. The integrated circuit of claim 1 wherein the resistor is a polysilicon resistor.

8. The integrated circuit of claim 7 wherein the resistor has a resistance of between about 100 kΩ and about 500 kΩ.

9. The integrated circuit of claim 8 wherein the resistor has a resistance of about 300 kΩ.

10. The integrated circuit of claim 1 wherein the p-type contact is p- doped and is in series with a polysilicon region to form the resistor.

11. The integrated circuit of claim 10 wherein the resistor has a resistance of between about 100 kΩ and about 500 kΩ.

12. The integrated circuit of claim 11 wherein the resistor has a resistance of about 300 kΩ.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded May 29, 2018
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.), INC.; MICROSEMI FREQUENCY AND TIME CORPORATION; MICROSEMI COMMUNICATIONS, INC.; MICROSEMI SOC CORP.; MICROSEMI CORP. - POWER PRODUCTS GROUP; MICROSEMI CORP. - RF INTEGRATED SOLUTIONS
Reel/Frame 046251/0391 →
PATENT SECURITY AGREEMENT Recorded Feb 3, 2016
From: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC. (F/K/A LEGERITY, INC., ZARLINK SEMICONDUCTOR (V.N.) INC., CENTELLAX, INC., AND ZARLINK SEMICONDUCTOR (U.S.) INC.); MICROSEMI FREQUENCY AND TIME CORPORATION (F/K/A SYMMETRICON, INC.); MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION); MICROSEMI SOC CORP. (F/K/A ACTEL CORPORATION); MICROSEMI CORP. - POWER PRODUCTS GROUP (F/K/A ADVANCED POWER TECHNOLOGY INC.); MICROSEMI CORP. - RF INTEGRATED SOLUTIONS (F/K/A AML COMMUNICATIONS, INC.)
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037691/0697 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 5, 2015
From: MCCOLLUM, JOHN L.; DHAOUI, FETHI
To: MICROSEMI SOC CORPORATION
Reel/Frame 035563/0257 →
Continuity (2)
Provisional Application 61988610 · May 5, 2014
Related Publication 20150318278A1 · Nov 5, 2015